M1AFS600-1FGG484K vs AFS600-FG484 Comparação

Comparação detalhada lado a lado de M1AFS600-1FGG484K por Microchip Technology e AFS600-FG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
M1AFS600-1FGG484K M1AFS600-1FGG484K - Fusion FPGA 600K Gates 484-BGA | Microchip

M1AFS600-1FGG484K - Fusion FPGA 600K Gates 484-BGA | Microchip

M1AFS600-1FGG484K ✓ Ativo
Microchip Technology
AFS600-FG484 AFS600-FG484 - 600K Mixed-Signal FPGA | Microchip

AFS600-FG484 - 600K Mixed-Signal FPGA | Microchip

AFS600-FG484 ✓ Ativo

Comparação de especificações

Parâmetro M1AFS600-1FGG484K AFS600-FG484
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $155,00 $90,57
Family Fusion (M1 series) —
System Gates 600K —
Logic Elements [DATA_NEEDED: logic element count] —
Total Flash Configuration Bits 110592 —
User I/O 172 172 I/O
Embedded Processor ARM Cortex-M1 (M1 variant) —
Technology 130 nm flash-based CMOS Advanced 130 nm, 7-layer metal, flash-based CMOS
Core Voltage 1.5 V —
Encapsulamento 484-pin FBGA (FGG484) 484-ball PBGA
Tipo de montagem Surface Mount —
Max Frequency 1282.05 MHz (family reference) —
Configuration Memory On-chip flash (single-chip, instant-on) Embedded nonvolatile flash
Analog Peripherals Configurable analog blocks (Fusion architecture) —
Clock Management Integrated clock generation and management circuitry —
Speed Grade -1 —
Temperatura de operação [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Packaging Option Tray (K suffix) —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Device Type — Fusion mixed-signal FPGA
Equivalent Gate Count — 600,000 gates
Logic Cells — 13,824 logic cells in related 600K-package variants
Package Dimensions — 23.00 mm x 23.00 mm in related 600K-package variants
Package Ball Pitch — 1.00 mm
Power-Up Configuration — Live at power-up in applicable Fusion devices
Programmable Resources — Configurable analog, programmable logic, embedded flash, and clock management
Processor Support — Optional ARM support in the Fusion family
Product Family — Fusion mixed-signal FPGAs
Manufacturer — Microchip Technology
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
Lead-Free Status — [DATA_NEEDED: lead-free status]
Halogen-Free Status — [DATA_NEEDED: halogen-free status]
Tensão de alimentação — [DATA_NEEDED: supply voltage range]

Fichas técnicas e recursos

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