M7AFS600-1FG484I vs M7AFS600-1FGG484I Comparaison
Comparaison détaillée côte à côte de M7AFS600-1FG484I par Microchip Technology et M7AFS600-1FGG484I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ ActifMicrochip Technology
M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip
M7AFS600-1FGG484I ✓ ActifComparaison des spécifications
| Paramètre | M7AFS600-1FG484I | M7AFS600-1FGG484I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $198,00 | $228,00 |
| System Gates | 600000 | 600000 |
| Programmable Logic Tiles | 110592 | — |
| User I/O | 172 | — |
| Family | Fusion (Flash FPGA with optional ARM CoreMP7 support) | — |
| Process Technology | 130 nm, 7-layer metal, Flash-based CMOS | 130 nm |
| Configuration Memory | Nonvolatile Flash, retains program when powered off | — |
| Power-Up Feature | Live at Power-Up (LAPU) | — |
| Supply Voltage (Core) | 1.5 V | — |
| Logic Family | CMOS | — |
| Speed Grade | 1 | 1 (M7, fastest family grade) |
| Boîtier | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm | — |
| Ball Pitch | 1.0 mm | — |
| Température de fonctionnement | Industrial, -40C to +85C | -40C to +85C |
| Type de montage | Surface Mount | — |
| Embedded Processor Support | ARM CoreMP7 | — |
| Statut RoHS | Compliant | ROHS3 Compliant |
| Series | — | Fusion (M7AFS600) |
| Number of I/Os | — | 172 |
| Total RAM Bits | — | 110592 |
| Embedded Processor | — | ARM CoreMP7 |
| Tension d'alimentation | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| Maximum Operating Frequency | — | 1282.05 MHz |
| Boîtier / Format | — | 484-BGA (FBGA) |
| Supplier Device Package | — | 484-FPBGA (23x23) |
| Style de montage | — | SMD/SMT |
| Packaging | — | Tray |
| Programmable Type | — | Flash-based, In-System Programmable |
| Manufacturer Lead Time | — | 16 weeks |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Number of Logic Cells | — | [DATA_NEEDED: logic cell count] |