M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip
Référence : M7AFS600-1FGG484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $270.75 | $2 707,50 |
| 100 | $256.5 | $25 650,00 |
| 500 | $242.25 | $121 125,00 |
| 1 000 | $228 | $228 000,00 |
M7AFS600-1FGG484I Présentation
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices, above CPLDs in capacity, and the Microchip (formerly Microsemi/Actel) Fusion family is distinctive because it integrates analog peripherals, flash-based configuration, and hard ARM CoreMP7 processing into a single mixed-signal programmable platform.
Key features of the M7AFS600-1FGG484I include the embedded ARM CoreMP7 microprocessor hard core running at up to 1.28205 GHz nominal family rating, 600K system gates of flash-based logic, 172 user I/Os, and an industrial temperature range of -40C to +85C. The flash-based Fusion fabric retains configuration in non-volatile memory, eliminating the external boot flash and configuration controller required by SRAM FPGAs and improving system security and time-to-first-bit.
Technically, the device is fabricated in a 130nm process with a 1.5V core supply (1.425V to 1.575V operating window). The M7 speed grade in the suffix denotes the fastest commercial timing grade of the Fusion family, supporting maximum operating frequencies around 1.28205 GHz for logic paths per distributor parametric data. The FBGA-484 package offers a dense 1.0 mm ball pitch surface-mount footprint for high-IO industrial designs.
Typical applications include industrial automation and motor control, avionics and defense systems requiring single-chip secure programmable logic, and instrumentation where on-chip analog plus ARM processing reduces BOM count.
Design consideration: verify 16-week manufacturer lead time in production planning and budget core voltage at 1.5V within the 1.425V to 1.575V tolerance band.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour M7AFS600-1FGG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec M7AFS600-1FGG484I (même facteur de forme et même empreinte) — différant par Package, Process Technology, Family, Operating Temperature, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
M7AFS600-2FGG484I
✅ Remplacement direct✓ En stock
$243.75 / unité
Voir la fiche technique →M7AFS600-FGG484I
✅ Remplacement direct✓ En stock
$219.2 / unité
Voir la fiche technique →M7AFS600-FGG484
✅ Remplacement direct✓ En stock
$232.9 / unité
Voir la fiche technique →M7AFS600-1FG484I
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →M7AFS600-FG484I
✅ Remplacement direct✓ En stock
$273.98 / unité
Voir la fiche technique →M7AFS600-2FG484I
✅ Remplacement direct✓ En stock
$272.01 / unité
Voir la fiche technique →M1AFS600-FG484I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →M7AFS600-1FGG484I Valeurs maximales et caractéristiques électriques
| Series | Fusion (M7AFS600) |
| System Gates | 600000 |
| Number of I/Os | 172 |
| Total RAM Bits | 110592 |
| Embedded Processor | ARM CoreMP7 |
| Tension d'alimentation | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Maximum Operating Frequency | 1282.05 MHz |
| Process Technology | 130 nm |
| Speed Grade | 1 (M7, fastest family grade) |
| Température de fonctionnement | -40C to +85C |
| Boîtier / Format | 484-BGA (FBGA) |
| Supplier Device Package | 484-FPBGA (23x23) |
| Style de montage | SMD/SMT |
| Packaging | Tray |
| Programmable Type | Flash-based, In-System Programmable |
| Statut RoHS | ROHS3 Compliant |
| Manufacturer Lead Time | 16 weeks |
Guide de configuration des broches du M7AFS600-1FGG484I 484-fpbga (23x23)
Configuration des broches du M7AFS600-1FGG484I (boîtier 484-fpbga (23x23)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour M7AFS600-1FGG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
M7AFS600-1FGG484I convient pour 6 applications: Industrial Automation and Motor Control, Avionics and Defense Programmable Logic, Mixed-Signal Test and Measurement Instrumentation, Industrial Networking and Protocol Gateways, Medical Diagnostic Equipment, Smart Energy Meters and Substation RTUs.
Industrial Automation and Motor Control
The M7AFS600-1FGG484I fits industrial automation because its 600K-gate flash fabric, 172 user I/Os, and ARM CoreMP7 hard core let one chip close position-loop control, drive PWM stages, and run communications simultaneously. Operating from -40C to +85C with a 1.5V core (1.425V to 1.575V window), it tolerates factory-floor temperature swings that SRAM FPGAs with external boot flash handle less gracefully. In a servo drive, the CoreMP7 supervises the protocol stack while fabric-based PWM generators run deterministically at rated family frequencies up to the 1282.05 MHz grade rating. The flash-based configuration removes configuration-corruption failure modes and speeds deterministic power-up, an advantage in production lines where every second of boot delay matters.
Recommandé
Avionics and Defense Programmable Logic
Defense and avionics subsystems favor the M7AFS600-1FGG484I because Microchip's (Microsemi's) flash-based Fusion architecture inherently resists single-event configuration upset better than SRAM fabrics and carries no external bitstream to intercept. The -40C to +85C industrial range covers many conduction-cooled embedded applications, and the 484-FBGA (23x23 mm) package supports dense 3U cPCI and VPX cards. With 600K gates and 110592 RAM bits, the device implements bus interfaces (MIL-STD-1553-adjacent glue logic, ARINC 429 front ends) while the ARM CoreMP7 runs housekeeping firmware. The active status plus documented 16-week lead time supports long-program procurement, and ROHS3 compliance eases European defense conversions where COTS components must meet modern environmental directives.
Recommandé
Mixed-Signal Test and Measurement Instrumentation
Bench instruments and modular (PXI) modules use the M7AFS600-1FGG484I where on-chip Fusion analog peripherals sample slow auxiliary channels (temperatures, supply monitors) while the digital fabric captures fast edges. The 600K-gate capacity and 110592 RAM bits buffer trigger histograms and time-stamped captures locally, and the ARM CoreMP7 offloads USB/LAN command parsing from the fabric. Its flash fabric configures in milliseconds after power-on, so instruments appear ready on the bus immediately - a measurable UX benefit over SRAM FPGAs needing boot-flash loads. With 172 I/Os across multiple banks, front-end level-shifting for TTL, LVCMOS, and differential probe inputs is handled in-package, and the 1.5V core keeps total board power within bench-standard budgets.
Recommandé
Industrial Networking and Protocol Gateways
Protocol gateways between fieldbus generations (CAN, PROFIBUS-adjacent serial, Ethernet tunneling) exploit the M7AFS600-1FGG484I's combination of fabric-based real-time interfaces and ARM CoreMP7 software stack. The 600K-gate fabric implements multiple independent UART, SPI, and timer channels at line rate, while the processor runs protocol translation and web management. Its -40C to +85C rating suits unconditioned cabinets in substations and water-plant installations, and the 1.425V to 1.575V core window tolerates noisy 24V-derived rails with a good regulator. Flash-based configuration means a power dip does not erase the bitstream - critical for unattended gateways - and the 484-FBGA gives enough I/O to fan out isolated transceiver banks on a single credit-card-sized PCB.
Recommandé
Medical Diagnostic Equipment
Point-of-care analyzers and patient-monitoring front ends use the M7AFS600-1FGG484I because Fusion's integrated analog blocks digitize slow biomedical channels (temperature, pressure transducers) while the digital fabric streams fast ADC data into the 110592-bit RAM. The ARM CoreMP7 executes self-test and calibration routines required by IEC 60601-adjacent quality processes without a second microcontroller. Deterministic flash power-up lets the instrument present a ready state within milliseconds of emergency power application, and the 600K gates implement filtering, decimation, and alarm comparators entirely in hardware for latency-critical alarms. The -40C to +85C range comfortably covers autoclave-adjacent storage and cold-chain transport, and ROHS3 compliance satisfies environmental requirements for hospital procurement.
Recommandé
Smart Energy Meters and Substation RTUs
Substation remote terminal units and high-end smart meters benefit from the M7AFS600-1FGG484I's mixed-signal integration: Fusion analog peripherals monitor battery voltages and transformer temperatures while the fabric timestamps digital inputs with microsecond resolution for sequence-of-events records. The ARM CoreMP7 runs DNP3/IEC-adjacent communication stacks, and 600K gates provide the math for metrology front ends. Operating from -40C to +85C matches unheated outdoor cabinets, and the 1.5V core supply (1.425V to 1.575V) works with wide-input industrial power modules. Because flash configuration survives brownouts, the RTU resumes service without operator intervention after grid disturbances - exactly the availability profile utilities specify. The 484-FBGA's 172 I/Os terminate large DI/DO matrices on one chip.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour M7AFS600-1FGG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | M7AFS600-2FGG484I | M7AFS600-FGG484I | M7AFS600-FGG484 | M1AFS600-FG484I |
|---|---|---|---|---|---|
| Package | 484-FBGA (23x23) | 484-FBGA (23x23) - same | 484-FBGA (23x23) - same | 484-FBGA (23x23) - same | 484-FBGA - same family |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Number of I/Os | 172 | 172 | 172 | 172 | 172 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | 0C to +70C (commercial) | -40C to +85C |
| Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Packaging | Tray | Tray | Tray | Tray | Tray |
Principaux différenciateurs
- Fastest Fusion M7AFS600 speed grade in the FG484 footprint (vs M7AFS600-FGG484I)
- Industrial temperature rating for harsh environments (vs M7AFS600-FGG484)
- Mixed-signal Fabric plus ARM CoreMP7 hard core (vs A3P600-1FG484I (ProASIC3E))
Notes de conception
The core supply must remain within the 1.425V to 1.575V window per the Microchip USA technical details. Estimated: at 600K flash gates in 130nm, core current is typically in the hundreds of milliamps under toggle-heavy conditions, so select a 1.5V regulator with at least 1.5A headroom and 3% or better load regulation. Separate the analog domain of the Fusion mixed-signal block onto its own filtered rail per the Fusion family datasheet power-up sequencing section, and confirm rail sequencing order before layout freeze.
The 484-FPBGA (23x23 mm) uses a fine-pitch ball grid requiring controlled-impedance fan-out. Recommended: dedicate at least two inner layers to a solid ground pour under the package, place 0.1uF ceramic decoupling capacitors on the underside of the PCB directly beneath power/ground ball clusters, and use via-in-pad or dog-house fan-out per Microchip's Fusion PCB layout application guidance. Follow IPC-recommended reflow profiles for lead-free BGA balls and X-ray inspect after assembly given the invisible joints.
Two recurring pitfalls: first, timing closure - if you substitute the slower M7AFS600-FGG484I (1098.9 MHz) for this speed-1 part, re-run static timing in Microchip Libero SoC at the new grade; paths that met 1282.05 MHz margins may fail. Second, supply chain - the manufacturer lead time is 16 weeks and authorized stock is intermittent, so do not freeze a production BOM on this MPN without a qualified same-family second source such as M7AFS600-2FGG484I already validated in your design.
Informations de conformité
ROHS3 Compliant per Microchip USA product listing. Active product status with 16-week manufacturer lead time. REACH, halogen-free, and conflict minerals status not stated in reviewed data.