M7AFS600-FGG256I vs AFS600-1FGG256 Comparaison
Comparaison détaillée côte à côte de M7AFS600-FGG256I par Microchip Technology et AFS600-1FGG256 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ ActifMicrochip Technology
AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-1FGG256 ✓ ActifComparaison des spécifications
| Paramètre | M7AFS600-FGG256I | AFS600-1FGG256 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | 600,000 gates |
| User I/O | 119 | 119 I/O |
| Boîtier | 256-LBGA (FBGA), 1 mm ball pitch | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | — |
| Temperature Grade | Industrial (I suffix) | — |
| Plage de température de fonctionnement | -40C to +85C (industrial grade standard range) | — |
| Type de montage | Surface Mount | — |
| Packaging | Tray | — |
| Niveau MSL | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Tension d'alimentation | — | 1.5 V |
| Logic Family | — | Flash-based CMOS |
| Metal Layers | — | 7 layers |
| Package Type | — | 256-ball FBGA |
| Package Pin Count | — | 256 balls |
| Package Pitch | — | 1.0 mm |
| Température de fonctionnement | — | 0°C to 70°C |
| Configuration Memory | — | Embedded nonvolatile flash |
| Power-Up Configuration | — | Live at power-up |
| Integrated Analog Resources | — | Configurable analog blocks |
| Integrated Clock Management | — | Clock generation and management |
| Embedded Memory | — | Large flash memory blocks |
| Package Family | — | FBGA surface-mount package family |
| Statut RoHS | — | RoHS compliant |
| Lead-Free Status | — | Lead-free |
| Pin Assignments | — | [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |