M7AFS600-FGG256I vs AFS600-1FGG256 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-FGG256I sa pamamagitan ng Microchip Technology at AFS600-1FGG256 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ NakahandaMicrochip Technology
AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-1FGG256 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M7AFS600-FGG256I | AFS600-1FGG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | 600,000 gates |
| User I/O | 119 | 119 I/O |
| Packhaging | 256-LBGA (FBGA), 1 mm ball pitch | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | — |
| Temperature Grade | Industrial (I suffix) | — |
| Hanay ng Temperature na Operasyon | -40C to +85C (industrial grade standard range) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Packaging | Tray | — |
| Level ng MSL | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Volte ng Pagbibigay | — | 1.5 V |
| Logic Family | — | Flash-based CMOS |
| Metal Layers | — | 7 layers |
| Package Type | — | 256-ball FBGA |
| Package Pin Count | — | 256 balls |
| Package Pitch | — | 1.0 mm |
| Temperature na Operasyon | — | 0°C to 70°C |
| Configuration Memory | — | Embedded nonvolatile flash |
| Power-Up Configuration | — | Live at power-up |
| Integrated Analog Resources | — | Configurable analog blocks |
| Integrated Clock Management | — | Clock generation and management |
| Embedded Memory | — | Large flash memory blocks |
| Package Family | — | FBGA surface-mount package family |
| Tindminan RoHS | — | RoHS compliant |
| Lead-Free Status | — | Lead-free |
| Pin Assignments | — | [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |