M7AFS600-FGG484I vs AFS600-FGG484 Comparaison

Comparaison détaillée côte à côte de M7AFS600-FGG484I par Microchip Technology et AFS600-FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

Microchip Technology
M7AFS600-FGG484I M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip

M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip

M7AFS600-FGG484I ✓ Actif
Microchip Technology
AFS600-FGG484 AFS600-FGG484 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG484 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG484 ✓ Actif

Comparaison des spécifications

Paramètre M7AFS600-FGG484I AFS600-FGG484
Marque Microchip Technology Microchip Technology
Catégorie FPGA & CPLD FPGA & CPLD
Statut du cycle de vie Actif Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $219,20 $0,00
Programmable Logic Family Fusion (Microsemi/Actel, now Microchip) —
System Gates 600000 gates 600000 gates
Embedded Processor ARM CoreMP7 (ARM7TDMI-compatible) —
User I/O 172 I/O —
Configuration Technology Flash-based, on-chip —
Core Supply Voltage 1.5 V —
Boîtier 484-BGA (FGG484), 1.0 mm ball pitch 484-pin FBGA; one verified source alternatively labels BGA-256
Type de montage Surface Mount Surface mount
Température de fonctionnement -40C to +100C (industrial, I grade) 0 C to 70 C
Memory - Listable Resource 110592 (per DigiKey listing) —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
I/O Bank Count [DATA_NEEDED: I/O bank count] —
Embedded Flash Blocks [DATA_NEEDED: embedded flash block count] —
Analog Peripherals [DATA_NEEDED: analog peripheral configuration] —
Niveau MSL [DATA_NEEDED: moisture sensitivity level] —
Statut RoHS [DATA_NEEDED: RoHS status] —
Programming Tool Chain Microchip Libero SoC (formerly Actel Libero) —
Device Type — Fusion mixed-signal FPGA
Maximum Frequency — 1098.9 MHz
Technology — 130 nm
Metal Layers — 7 layers
Process — Flash-based CMOS
Tension d'alimentation — 1.5 V
I/O Count — 172 I/O
Configuration Retention — Nonvolatile flash
Power-Up Feature — Live at Power-Up (LAPU)
Architecture — Monolithic mixed-signal FPGA
Programmable Logic — High-performance flash-based programmable logic
Analog Resources — Configurable analog resources
Flash Memory — Large flash-memory blocks
Clocking — Comprehensive clock generation and management circuitry
Processor Support — Optional ARM support
Statut du cycle de vie — [DATA_NEEDED: current lifecycle status]
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
REACH Compliance — [DATA_NEEDED: REACH compliance status]

Fiches techniques et ressources

Parcourir tous les produits Créer un BOM Demander un devis