M7AFS600-FGG484I vs AFS600-FGG484 Comparación

Comparación detallada lado a lado de M7AFS600-FGG484I por Microchip Technology y AFS600-FGG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
M7AFS600-FGG484I M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip

M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip

M7AFS600-FGG484I ✓ Activo
Microchip Technology
AFS600-FGG484 AFS600-FGG484 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG484 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG484 ✓ Activo

Comparación de especificaciones

Parámetro M7AFS600-FGG484I AFS600-FGG484
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $219,20 $0,00
Programmable Logic Family Fusion (Microsemi/Actel, now Microchip) —
System Gates 600000 gates 600000 gates
Embedded Processor ARM CoreMP7 (ARM7TDMI-compatible) —
User I/O 172 I/O —
Configuration Technology Flash-based, on-chip —
Core Supply Voltage 1.5 V —
Encapsulado 484-BGA (FGG484), 1.0 mm ball pitch 484-pin FBGA; one verified source alternatively labels BGA-256
Tipo de montaje Surface Mount Surface mount
Temperatura de funcionamiento -40C to +100C (industrial, I grade) 0 C to 70 C
Memory - Listable Resource 110592 (per DigiKey listing) —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
I/O Bank Count [DATA_NEEDED: I/O bank count] —
Embedded Flash Blocks [DATA_NEEDED: embedded flash block count] —
Analog Peripherals [DATA_NEEDED: analog peripheral configuration] —
Nivel MSL [DATA_NEEDED: moisture sensitivity level] —
Estado RoHS [DATA_NEEDED: RoHS status] —
Programming Tool Chain Microchip Libero SoC (formerly Actel Libero) —
Device Type — Fusion mixed-signal FPGA
Maximum Frequency — 1098.9 MHz
Technology — 130 nm
Metal Layers — 7 layers
Process — Flash-based CMOS
Tensión de alimentación — 1.5 V
I/O Count — 172 I/O
Configuration Retention — Nonvolatile flash
Power-Up Feature — Live at Power-Up (LAPU)
Architecture — Monolithic mixed-signal FPGA
Programmable Logic — High-performance flash-based programmable logic
Analog Resources — Configurable analog resources
Flash Memory — Large flash-memory blocks
Clocking — Comprehensive clock generation and management circuitry
Processor Support — Optional ARM support
Estado del ciclo de vida — [DATA_NEEDED: current lifecycle status]
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
REACH Compliance — [DATA_NEEDED: REACH compliance status]

Hojas de datos y recursos

Examinar todos los productos Crear BOM Solicitar cotización