MC908AB32MFUE vs MC9S12D64MFUER Comparaison
Comparaison détaillée côte à côte de MC908AB32MFUE par NXP Semiconductors et MC9S12D64MFUER par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S12D64MFUER - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP (Tape & Reel)
MC9S12D64MFUER NrndComparaison des spécifications
| Paramètre | MC908AB32MFUE | MC9S12D64MFUER |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $1,05 |
| Product Type | 8-bit microcontroller unit (MCU) | — |
| Series | HC08 / HC08AB | — |
| CPU | Enhanced M68HC08 CPU08 | — |
| Maximum Clock Speed | 8 MHz | — |
| Program Memory Type | Flash | Flash |
| Program Memory Size | 32 KB (32K x 8) | 64 KB (64K x 8) |
| RAM Size | 1 KB (1K x 8) | — |
| EEPROM | 512 bytes | — |
| Number of I/O | 51 pins | 59 |
| Boîtier | 64-QFP (14 x 14 mm) | 80-QFP (14 x 14 mm), also called PQFP-80 |
| Type de montage | Surface mount | Surface Mount (SMD/SMT) |
| Architecture | 8-bit | — |
| Oscillator Type | [DATA_NEEDED: oscillator type] | — |
| Operating Voltage Range | [DATA_NEEDED: operating voltage range] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Core Architecture | — | HCS12 (16-bit CISC) |
| CPU Core | — | S12 CPU V2 |
| Operating Frequency | — | 25 MHz |
| Tension d'alimentation | — | 2.5 V / 5 V |
| ADC | — | 2 x 10-bit, 8 channels each (16 ADC channels total) |
| PWM Channels | — | 8 channels |
| Capture/Compare Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC |
| Automotive Qualification | — | AEC-Q100 |
| Packaging Method (tray / reel) | — | Tray |
| Approximate Weight | — | 0.033 oz (per supplier catalog) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Watchdog / COP | — | Yes (COP reset, watchdog timer) |