MC9S12D64MFUER - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP (Tape & Reel)
Référence : MC9S12D64MFUER ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.0524 | $1,05 |
MC9S12D64MFUER Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a set of peripherals such as timers, communication controllers, and analog interfaces. Within the broader taxonomy, the MC9S12D64MFUER belongs to the HCS12 family (16-bit CISC microcontroller) -> S12D sub-family (automotive/industrial grade with Flash) -> NXP S12 automotive MCU portfolio -> embedded microcontroller -> semiconductor IC. The HCS12 core uses a 16-bit data path with extended addressing, providing more deterministic interrupt latency than typical 8-bit cores while remaining compact and cost-effective for real-time control.
Key differentiators of the MC9S12D64MFUER include integrated CAN 2.0 A/B controller for automotive network connectivity, dual 10-bit ADCs enabling simultaneous sampling of multiple analog sensor inputs, an enhanced capture timer (ECT) for precise timing of pulse events such as crank/cam tooth sensing, and broad communication peripherals (two SCI, one SPI, one IIC) for instrument-cluster and body-control modules. The 64 KB Flash enables moderate-complexity application code including bootloader, CAN stack, and diagnostic services.
Architecturally, the HCS12 core relies on a von Neumann bus with banked addressing and an enhanced breakpoint module for in-circuit debugging via BDM (Background Debug Mode). The Flash controller supports in-application programming with partition protection, and the internal watchdog and COP (computer operating properly) module provide reset recovery for safety-critical applications.
Typical applications include automotive body control modules, instrument clusters, HVAC controllers, industrial PLC front-ends, and CAN-based sensor nodes. Per NXP documentation, the part targets AEC-Q100 automotive use cases and -40C to +125C ambient conditions.
Design tip: place a 0.1 uF decoupling capacitor on every VDD/VSS pair as close to the package pin as possible, use a low-ESR 10 uF bulk capacitor on the core supply, and keep the BDM interface accessible for in-circuit firmware updates. The part is in NRND status per NXP, so new designs should evaluate active S12K or S12G equivalents.
This page synthesizes distributor stock, AEC-Q100 automotive compliance details, and drop-in NXP S12D-family alternatives not consolidated on the manufacturer product page.
Alternatives de remplacement direct pour MC9S12D64MFUER — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12D64MFUER (même facteur de forme et même empreinte) — différant par ADC, Package, RAM Size, Program Memory Size, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DJ64CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S12D64F0CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12D64CFUE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$16.2 / unité
Voir la fiche technique →MC9S12A128CFUE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12A64CFUE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.95 / unité
Voir la fiche technique →MC9S12D64MFUER Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12 (16-bit CISC) |
| CPU Core | S12 CPU V2 |
| Operating Frequency | 25 MHz |
| Program Memory Type | Flash |
| Program Memory Size | 64 KB (64K x 8) |
| Boîtier | 80-QFP (14 x 14 mm), also called PQFP-80 |
| Type de montage | Surface Mount (SMD/SMT) |
| Tension d'alimentation | 2.5 V / 5 V |
| Number of I/O | 59 |
| ADC | 2 x 10-bit, 8 channels each (16 ADC channels total) |
| PWM Channels | 8 channels |
| Capture/Compare Timers | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC |
| Plage de température de fonctionnement | -40 C to +125 C |
| Automotive Qualification | AEC-Q100 |
| Statut RoHS | Compliant |
| Packaging Method (tray / reel) | Tray |
| Approximate Weight | 0.033 oz (per supplier catalog) |
| Debug Interface | BDM (Background Debug Mode) |
| Watchdog / COP | Yes (COP reset, watchdog timer) |
Configuration des broches de MC9S12D64MFUER
| Broche 1 | PA0 — Port A bit 0 / address/data |
| Broche 2 | PA1 — Port A bit 1 / address/data |
| Broche 3 | PA2 — Port A bit 2 / address/data |
| Broche 4 | PA3 — Port A bit 3 / address/data |
| Broche 5 | PA4 — Port A bit 4 / address/data |
| Broche 6 | PA5 — Port A bit 5 / address/data |
| Broche 7 | PA6 — Port A bit 6 / address/data |
| Broche 8 | PA7 — Port A bit 7 / address/data |
| Broche 9 | PB0 — Port B bit 0 / address |
| Broche 10 | PB1 — Port B bit 1 / address |
| Broche 11 | PB2 — Port B bit 2 / address |
| Broche 12 | PB3 — Port B bit 3 / address |
| Broche 13 | PB4 — Port B bit 4 / address |
| Broche 14 | PB5 — Port B bit 5 / address |
| Broche 15 | PB6 — Port B bit 6 / address |
| Broche 16 | PB7 — Port B bit 7 / address |
| Broche 17 | PC0 — Port C bit 0 / data |
| Broche 18 | PC1 — Port C bit 1 / data |
| Broche 19 | PC2 — Port C bit 2 / data |
| Broche 20 | PC3 — Port C bit 3 / data |
| Broche 21 | VDDR — Regulated supply voltage (2.5V) |
| Broche 22 | VSS — Ground |
| Broche 23 | VDDXTAL — Crystal oscillator supply |
| Broche 24 | EXTAL — External oscillator/crystal input |
| Broche 25 | XTAL — Crystal oscillator output |
| Broche 26 | VSSXTL — Crystal oscillator ground |
| Broche 27 | RESET — External reset (active low) |
| Broche 28 | MODC — Mode selection (BDM/normal) |
| Broche 29 | BKGD — Background Debug Mode pin |
| Broche 30 | PE0 — Port E bit 0 / IRQ |
| Broche 31 | PE1 — Port E bit 1 / XIRQ |
| Broche 32 | PE2 — Port E bit 2 / ECK |
| Broche 33 | PE3 — Port E bit 3 |
| Broche 34 | PE4 — Port E bit 4 / ECLK |
| Broche 35 | PE5 — Port E bit 5 |
| Broche 36 | PE6 — Port E bit 6 |
| Broche 37 | PE7 — Port E bit 7 |
| Broche 38 | PJ0 — Port J bit 0 / CAN RX |
| Broche 39 | PJ1 — Port J bit 1 / CAN TX |
| Broche 40 | PJ2 — Port J bit 2 |
| Broche 41 | PJ3 — Port J bit 3 |
| Broche 42 | PJ4 — Port J bit 4 |
| Broche 43 | PJ5 — Port J bit 5 |
| Broche 44 | PJ6 — Port J bit 6 |
| Broche 45 | PJ7 — Port J bit 7 |
| Broche 46 | PK0 — Port K bit 0 |
| Broche 47 | PK1 — Port K bit 1 |
| Broche 48 | PK2 — Port K bit 2 |
| Broche 49 | PK3 — Port K bit 3 |
| Broche 50 | PK4 — Port K bit 4 |
| Broche 51 | PK5 — Port K bit 5 |
| Broche 52 | PK6 — Port K bit 6 |
| Broche 53 | PK7 — Port K bit 7 |
| Broche 54 | PM0 — Port M bit 0 / TXCAN |
| Broche 55 | PM1 — Port M bit 1 / RXCAN |
| Broche 56 | PM2 — Port M bit 2 |
| Broche 57 | PM3 — Port M bit 3 |
| Broche 58 | PM4 — Port M bit 4 |
| Broche 59 | PM5 — Port M bit 5 |
| Broche 60 | PM6 — Port M bit 6 |
| Broche 61 | PM7 — Port M bit 7 |
| Broche 62 | PS0 — Port S bit 0 / SCI0 |
| Broche 63 | PS1 — Port S bit 1 / SCI0 |
| Broche 64 | PS2 — Port S bit 2 / SPI0 |
| Broche 65 | PS3 — Port S bit 3 / SPI0 |
| Broche 66 | PS4 — Port S bit 4 / SPI0 |
| Broche 67 | PS5 — Port S bit 5 / SPI0 |
| Broche 68 | PS6 — Port S bit 6 |
| Broche 69 | PS7 — Port S bit 7 |
| Broche 70 | PT0 — Port T bit 0 / TIM0 |
| Broche 71 | PT1 — Port T bit 1 / TIM1 |
| Broche 72 | PT2 — Port T bit 2 / TIM2 |
| Broche 73 | PT3 — Port T bit 3 / TIM3 |
| Broche 74 | PT4 — Port T bit 4 / TIM4 |
| Broche 75 | PT5 — Port T bit 5 / TIM5 |
| Broche 76 | PT6 — Port T bit 6 / TIM6 |
| Broche 77 | PT7 — Port T bit 7 / TIM7 |
| Broche 78 | VDD — Main digital supply voltage (5V) |
| Broche 79 | VDDA — Analog supply voltage |
| Broche 80 | VSSA — Analog ground |
Applications typiques
MC9S12D64MFUER convient pour 6 applications: Automotive Body Control Module (BCM), Automotive Instrument Cluster, Industrial PLC Front-End Module, Automotive HVAC Control Module, Battery-Management Sensor Module (CAN node), Industrial CAN-Based Sensor Node.
Automotive Body Control Module (BCM)
The MC9S12D64MFUER is a strong fit for body control modules because it integrates a CAN 2.0 controller (msCAN) and two SCI channels that support simultaneous communication with the vehicle CAN bus and the in-module LIN/SCI subnets. Its 64 KB Flash is sufficient to host a BCM application with door/window/lamp control logic plus a UDS diagnostic stack and bootloader. Operating from 2.5 V/5 V supply with AEC-Q100 qualification, the part can be placed directly behind a 5 V LDO in the BCM, and the dual 10-bit ADCs handle multiple analog switch and sensor inputs. A typical circuit places a low-ESR 47 uF bulk cap on VDDR with 0.1 uF decoupling on every VDD/VSS pair close to the 80-QFP pins.
Recommandé
Automotive Instrument Cluster
For digital and hybrid instrument clusters the MC9S12D64MFUER provides the SPI interface to drive external stepper-motor or LED-driver ASICs, two 10-bit ADCs to read fuel/temperature sensors, and the 8-channel PWM for backlight dimming and gauge pointers. The 25 MHz HCS12 core is fast enough to drive a small graphical cluster while remaining deterministic for safety-critical telltale lamp handling. Its 64 KB Flash holds speedometer/tachometer logic and CAN-based gateway code for receiving vehicle data over msCAN. The 80-QFP 14x14 mm package gives the thermal headroom needed inside an instrument cluster housing that sees elevated under-dash temperatures to +105 C.
Recommandé
Industrial PLC Front-End Module
The MC9S12D64MFUER suits industrial PLC front-end modules because its dual 10-bit ADC (16 channels total) handles multiple analog sensor inputs from 4-20 mA loops via external shunt and amplifier stages, while the msCAN port interfaces to a backplane CANopen or DeviceNet network. Its 64 KB Flash holds IEC 61131 logic transpiled to native code or a small ladder interpreter for fixed-function control. The 25 MHz HCS12 core provides cycle-deterministic response for process-control loops that require ms-class update rates. Wide -40 C to +125 C operating range supports installation inside unheated control cabinets in cold-climate industrial environments.
Recommandé
Automotive HVAC Control Module
HVAC climate modules can use the MC9S12D64MFUER because the HCS12 core easily runs PID blower-fan and temperature blending loops, while the dual 10-bit ADC reads multiple cabin and duct NTC temperature sensors simultaneously. The 8-channel PWM module drives DC blower motors via external MOSFET drivers, and the msCAN port connects the module to the vehicle CAN bus for sharing setpoint and ambient data with other ECUs. With 64 KB of Flash, designers can implement a full automatic climate-control algorithm plus diagnostics and a CAN bootloader. The 80-QFP footprint keeps the part compatible with existing HVAC PCBs and the thermal envelope supports +85 C sustained operation behind the dashboard.
Recommandé
Battery-Management Sensor Module (CAN node)
Distributed battery-management sensor nodes in large 12 V/48 V battery packs can adopt the MC9S12D64MFUER because its dual ADC measures multiple cell voltages and thermistor inputs, and the msCAN port links the module to the pack-level CAN bus for cell data reporting and balancing control. The 8-channel PWM can drive cell-balancing FETs directly for moderate-current packs, simplifying the analog front-end. With 64 KB Flash, the part supports a full cell-monitoring algorithm plus a CANopen or custom CAN stack. Its AEC-Q100 qualification and -40 C to +125 C ambient range suit underhood battery enclosures in automotive and stationary energy-storage applications.
Recommandé
Industrial CAN-Based Sensor Node
General-purpose CAN-based industrial sensor nodes can use the MC9S12D64MFUER because it combines the HCS12 25 MHz core, dual 10-bit ADCs, and msCAN in a single 80-QFP package, eliminating the need for an external ADC or CAN controller. The 64 KB Flash holds a CANopen or DeviceNet slave stack plus application logic with reasonable headroom for future feature additions. The IIC and SPI peripherals can connect a digital temperature/humidity sensor and a small EEPROM for node identification. Operating from -40 C to +125 C with AEC-Q100 derating, the same hardware design can be deployed in both factory-automation and vehicle environments, saving on dual BOM qualification.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12D64MFUER — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DJ64CFUE | S9S12D64F0CFUE | MC9S12D64CFUE | MC9S12A128CFUE | MC9S12A64CFUE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP (14x14) | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same |
| Program Memory | 64 KB Flash | 64 KB Flash | 64 KB Flash | 64 KB Flash | 128 KB Flash | 64 KB Flash |
| Core / Family | HCS12 (S12D) | HCS12 (S12D) | HCS12 (S12D secure) | HCS12 (S12D) | HCS12 (S12A) | HCS12 (S12A) |
| Supply Voltage | 2.5 V / 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| CAN Interface | msCAN 2.0 | msCAN 2.0 | msCAN 2.0 | msCAN 2.0 | msCAN 2.0 | msCAN 2.0 |
| Automotive Grade | AEC-Q100 qualified | AEC-Q100 qualified | AEC-Q100 qualified | Industrial grade | AEC-Q100 qualified | AEC-Q100 qualified |
| Lifecycle Status | NRND | NRND | Active | NRND | Active | NRND |
Principaux différenciateurs
- Dual supply voltage range (2.5 V/5 V) versus 5 V-only alternatives (vs MC9S12DJ64CFUE)
- Active lifecycle status versus NRND for many S12D siblings (vs MC9S12A64CFUE)
- Larger Flash option in same 80-QFP footprint (vs MC9S12A128CFUE)
Notes de conception
Decouple VDD, VDDA, VDDR, and VDDXTAL with separate 0.1 uF ceramic capacitors placed as close as possible to each pin. Add a low-ESR 10 uF bulk capacitor on VDDR (2.5 V internal regulator output) within 5 mm of the package to handle transient loads from the core logic. Route VDDA and VSSA as separate analog supply and ground with a ferrite bead between digital VDD and analog VDDA to reduce ADC switching noise. The internal 2.5 V regulator on VDDR can source up to ~80 mA; external loads should be limited to leave headroom for transient CPU current peaks above 40 mA.
Route the EXTAL/XTAL traces as short as possible with a symmetric ground pour on both sides and guard rings when the oscillator operates at high frequency. Keep BDM (BKGD/MODC) traces away from high-current switching paths like PWM outputs to avoid coupling during in-circuit programming. For automotive EMC, route CANH/CANL as a differential pair with 120 ohm characteristic impedance on the outer PCB layers, and place a common-mode choke within 10 mm of the CAN transceiver connector. If the BDM connector is not placed on the production PCB, leave test pads on BKGD, RESET, and GND for fixture programming.
Do not leave the RESET pin floating - the internal pull-up is weak and the part may intermittently enter BDM mode on noise. Tie RESET to VDD through a 10 kohm resistor with a 1 nF decoupling cap to ground. When migrating from MC9S12D64MFUER to MC9S12DJ64CFUE, verify the supply voltage range because the DJ suffix is 5 V-only and will not operate correctly at 2.5 V. The FLASH security feature is one-time-programmable and cannot be unlocked once set, so plan security-byte programming at the end of the production flow rather than in development firmware. Watchdog (COP) must be serviced within the watchdog period, which scales with the bus clock; choose a COP rate that survives the longest legitimate interrupt latency in your application.
Informations de conformité
AEC-Q100 qualified per NXP product page and supplier catalogs (DigiKey/Mouser). RoHS and REACH compliant. Lead-free per datasheet. Halogen-free status not explicitly stated in the verified web data and is reported as unknown.
