MD7IC2050NBR1 vs MW7IC2040NR1 Comparaison

Comparaison détaillée côte à côte de MD7IC2050NBR1 par NXP Semiconductors et MW7IC2040NR1 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MD7IC2050NBR1 MD7IC2050NBR1 - 10W W-CDMA RF Power Amplifier 1880-2100MHz | NXP

MD7IC2050NBR1 - 10W W-CDMA RF Power Amplifier 1880-2100MHz | NXP

MD7IC2050NBR1 ✓ Actif
NXP Semiconductors
MW7IC2040NR1 MW7IC2040NR1 - 4W RF LDMOS Wideband PA | NXP | Cellular BTS

MW7IC2040NR1 - 4W RF LDMOS Wideband PA | NXP | Cellular BTS

MW7IC2040NR1 ✓ Actif

Comparaison des spécifications

Paramètre MD7IC2050NBR1 MW7IC2040NR1
Marque NXP Semiconductors NXP Semiconductors
Catégorie RF Amplifiers RF Amplifiers
Statut du cycle de vie Actif Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $22,40 $24,20
RF Type W-CDMA General Purpose / Wideband Integrated Power Amplifier
Frequency Range 1.88 GHz to 2.1 GHz —
Operating Bandwidth (broader usability) 1750 MHz to 2050 MHz —
Tension d'alimentation 28 V —
Supply Current (quiescent) 230 mA —
Gain 30.5 dB —
Output Power (P3dB class, datasheet) [DATA_NEEDED: P3dB output power] —
Average Output Power (W-CDMA) 10 W average —
Architecture Multi-stage RF LDMOS integrated power amplifier —
Input Matching On-chip, 50 ohm, DC blocked —
Output Matching On-chip, >5 ohm nominal —
Enable / Disable Integrated (with quiescent current temperature compensation) —
ESD Protection Integrated —
Boîtier TO-272 WB-14 (CASE 1618-02, plastic overmold) —
Maximum Junction / Package Temperature 225 C capable plastic —
RoHS Compliance Compliant (per manufacturer datasheet) —
Type de montage Surface Mount (flanged lead) Surface Mount (PCB solderable with bottom drain ground plane)
Température de fonctionnement [DATA_NEEDED: operating temperature range] -40 C to +85 C (industrial base-station operating ambient; per Freescale/NXP LDMOS module family)
Manufacturer — NXP Semiconductors (formerly Freescale / Motorola Semiconductor)
Technology — RF LDMOS (Laterally Diffused MOSFET)
Fonction — Two-stage integrated power amplifier with on-chip matching
Frequency Range (Application) — 1805 MHz to 1990 MHz (covers 1805-1880 MHz DCS/PCS and 1930-1990 MHz UMTS)
Frequency Range (Characterization) — 100 MHz to 1 GHz
Supply Voltage (Vdd) — 24 V to 32 V (nominal 28 V)
Maximum Supply Voltage — 32 V
Quiescent Supply Current (Idq) — 75 mA
Small-Signal Gain — 23.5 dB
Output Power (avg, W-CDMA) — 4 W (typical at rated operating conditions)
Modulation Compatibility — Single W-CDMA, GSM/EDGE, UMTS, LTE, all typical cellular BTS formats
Boîtier / Format — TO-270 WBL-16 (TO-270-16 Variant, Flat Leads), plastic over-mold surface-mount
Nombre de broches — 16
Operating Mode — Class-AB (multi-stage, externally biased)
Lead Configuration — Flat leads (surface-mount)
Packaging Type — Tape & Reel (per part suffix NR1 suffix convention)
Statut RoHS — Compliant (per NXP product family)

Fiches techniques et ressources

Parcourir tous les produits Créer un BOM Demander un devis