MMA6262QR2 vs MMA6262QR2-FR Comparaison
Comparaison détaillée côte à côte de MMA6262QR2 par NXP Semiconductors et MMA6262QR2-FR par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MMA6262QR2-FR - ±1.5g Dual-Axis Micromachined Accelerometer | NXP
MMA6262QR2-FR NrndComparaison des spécifications
| Paramètre | MMA6262QR2 | MMA6262QR2-FR |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Motion Sensors | Motion Sensors |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $5,20 | $4,21 |
| Type de capteur | Accelerometer, Dual-Axis (X, Y) | Accelerometer, dual-axis (X, Y) |
| Acceleration Range | ±1.5 g | ±1.5 g |
| Sensitivity | 740 mV/g to 860 mV/g (at 3.3 V) | 800 mV/g (typical, ratiometric) |
| Supply Voltage (VDD) | 3.15 V to 5.25 V (per MMA6801KW comp doc) | 2.2 V to 3.6 V |
| Type de sortie | Analog, Ratiometric | Analog, ratiometric to VDD |
| Bandwidth (Low-Pass Filter) | 150 Hz (1-pole factory-set) | — |
| Zero-g Offset | Factory calibrated, no external trim required | — |
| Temperature Compensation | On-chip, factory-set | — |
| Température de fonctionnement | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] | -40 °C to +105 °C |
| Boîtier / Format | 16-QFN-EP (6x6 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Supplier Device Package | 16-QFN-EP (6x6) | — |
| Lead Free Status | Contains Lead (per digchip snippet) | — |
| Statut RoHS | RoHS3 Compliant | RoHS Compliant (Contains Lead in some variants - check datasheet) |
| Sense Technology | Capacitive Micromachined (MEMS) | — |
| Number of Axes | — | 2 (X, Y) |
| Bandwidth (-3 dB) | — | 150 Hz (internal 1-pole LPF) |
| Courant d'alimentation | — | 2 mA (typical) |
| Zero-g Output (ratiometric) | — | VDD/2 (typical) |
| Shock Survival | — | 2000 g |
| Self-Test | — | Yes (external logic input) |
| Boîtier | — | 16-QFN-EP, 6 mm x 6 mm, exposed thermal pad |
| MEMS Process | — | Capacitive micromachined (surface micromachining) |