MMA6262QR2 vs MMA6262QR2-FR Comparação
Comparação detalhada lado a lado de MMA6262QR2 por NXP Semiconductors e MMA6262QR2-FR por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MMA6262QR2-FR - ±1.5g Dual-Axis Micromachined Accelerometer | NXP
MMA6262QR2-FR NrndComparação de especificações
| Parâmetro | MMA6262QR2 | MMA6262QR2-FR |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Motion Sensors | Motion Sensors |
| Status do ciclo de vida | Última compra | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $5,20 | $4,21 |
| Tipo de sensor | Accelerometer, Dual-Axis (X, Y) | Accelerometer, dual-axis (X, Y) |
| Acceleration Range | ±1.5 g | ±1.5 g |
| Sensitivity | 740 mV/g to 860 mV/g (at 3.3 V) | 800 mV/g (typical, ratiometric) |
| Supply Voltage (VDD) | 3.15 V to 5.25 V (per MMA6801KW comp doc) | 2.2 V to 3.6 V |
| Tipo de saída | Analog, Ratiometric | Analog, ratiometric to VDD |
| Bandwidth (Low-Pass Filter) | 150 Hz (1-pole factory-set) | — |
| Zero-g Offset | Factory calibrated, no external trim required | — |
| Temperature Compensation | On-chip, factory-set | — |
| Temperatura de operação | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] | -40 °C to +105 °C |
| Encapsulamento / Caixa | 16-QFN-EP (6x6 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Supplier Device Package | 16-QFN-EP (6x6) | — |
| Lead Free Status | Contains Lead (per digchip snippet) | — |
| Status RoHS | RoHS3 Compliant | RoHS Compliant (Contains Lead in some variants - check datasheet) |
| Sense Technology | Capacitive Micromachined (MEMS) | — |
| Number of Axes | — | 2 (X, Y) |
| Bandwidth (-3 dB) | — | 150 Hz (internal 1-pole LPF) |
| Corrente de alimentação | — | 2 mA (typical) |
| Zero-g Output (ratiometric) | — | VDD/2 (typical) |
| Shock Survival | — | 2000 g |
| Self-Test | — | Yes (external logic input) |
| Encapsulamento | — | 16-QFN-EP, 6 mm x 6 mm, exposed thermal pad |
| MEMS Process | — | Capacitive micromachined (surface micromachining) |