MPC8245LVV300D vs MPC8245LVV333D Comparaison
Comparaison détaillée côte à côte de MPC8245LVV300D par NXP Semiconductors et MPC8245LVV333D par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D ObsoleteComparaison des spécifications
| Paramètre | MPC8245LVV300D | MPC8245LVV333D |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $79,40 | $52,75 |
| Core Processor | PowerPC 603e | — |
| Number of Cores | 1 | — |
| Largeur du bus de données | 32-bit | 32-bit |
| Core Frequency | 300 MHz | 333 MHz |
| Series | MPC82xx | — |
| Co-Processors / DSP | None | — |
| RAM Controllers | SDRAM (64-bit) | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None | — |
| Ethernet | [DATA_NEEDED: integrated Ethernet MAC count] | — |
| USB | [DATA_NEEDED: integrated USB] | — |
| PCI Bridge | PCI 2.2, 32-bit, up to 66 MHz | — |
| Température de fonctionnement | 0 C to 105 C | 0 C to +105 C (junction) |
| Boîtier | 352-TBGA (35 x 35 mm) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Part Status | Active | — |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP USA Inc. (formerly Freescale / Motorola) |
| Product Category | — | Microprocessors (MPU) |
| Core Architecture | — | PowerPC 603e (Power Architecture technology) |
| Core Count | — | 1 |
| Integrated Bridge | — | PCI bridge + memory controller |
| PCI Interface | — | PCI 2.2 compliant, 32-bit, up to 66 MHz |
| Memory Controller | — | 64-bit SDRAM (PC133), ROM/Flash interface |
| Supply Voltage - Core | — | 2.0 V (L suffix, low-voltage core) |
| Supply Voltage - I/O | — | 3.3 V |
| Boîtier / Format | — | 352-TBGA (35x35 mm) |
| Statut RoHS | — | [DATA_NEEDED: rohs status not confirmed in verified web data] |
| Lead-Free / BGA Solder | — | [DATA_NEEDED: lead-free status not confirmed] |