MPC8245LVV300D vs MPC8245LVV333D Comparación
Comparación detallada lado a lado de MPC8245LVV300D por NXP Semiconductors y MPC8245LVV333D por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D ObsoleteComparación de especificaciones
| Parámetro | MPC8245LVV300D | MPC8245LVV333D |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $79,40 | $52,75 |
| Core Processor | PowerPC 603e | — |
| Number of Cores | 1 | — |
| Ancho del bus de datos | 32-bit | 32-bit |
| Core Frequency | 300 MHz | 333 MHz |
| Series | MPC82xx | — |
| Co-Processors / DSP | None | — |
| RAM Controllers | SDRAM (64-bit) | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None | — |
| Ethernet | [DATA_NEEDED: integrated Ethernet MAC count] | — |
| USB | [DATA_NEEDED: integrated USB] | — |
| PCI Bridge | PCI 2.2, 32-bit, up to 66 MHz | — |
| Temperatura de funcionamiento | 0 C to 105 C | 0 C to +105 C (junction) |
| Encapsulado | 352-TBGA (35 x 35 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Part Status | Active | — |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP USA Inc. (formerly Freescale / Motorola) |
| Product Category | — | Microprocessors (MPU) |
| Core Architecture | — | PowerPC 603e (Power Architecture technology) |
| Core Count | — | 1 |
| Integrated Bridge | — | PCI bridge + memory controller |
| PCI Interface | — | PCI 2.2 compliant, 32-bit, up to 66 MHz |
| Memory Controller | — | 64-bit SDRAM (PC133), ROM/Flash interface |
| Supply Voltage - Core | — | 2.0 V (L suffix, low-voltage core) |
| Supply Voltage - I/O | — | 3.3 V |
| Encapsulado / Carcasa | — | 352-TBGA (35x35 mm) |
| Estado RoHS | — | [DATA_NEEDED: rohs status not confirmed in verified web data] |
| Lead-Free / BGA Solder | — | [DATA_NEEDED: lead-free status not confirmed] |