MPC8260AZUPIBB vs MPC8260AZUMHBB Comparaison
Comparaison détaillée côte à côte de MPC8260AZUPIBB par NXP Semiconductors et MPC8260AZUMHBB par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8260AZUPIBB - PowerPC G2 MPU 300MHz 480-TBGA | NXP
MPC8260AZUPIBB ⚠ Dernier achatNXP Semiconductors
MPC8260AZUMHBB - PowerQUICC II HIP4 266MHz MPU | NXP 480-TBGA
MPC8260AZUMHBB NrndComparaison des spécifications
| Paramètre | MPC8260AZUPIBB | MPC8260AZUMHBB |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $180,00 | $52,10 |
| Family | PowerQUICC II | — |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 | 1 |
| Bus Width | 32-bit | — |
| Largeur du bus de données | 64-bit (external memory bus) | 64-Bit |
| Core Speed | 300 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None | — |
| Supply Voltage (Core) | 1.8 V | 1.8 V |
| Supply Voltage (I/O) | 3.3 V | 3.3 V |
| Process Technology | 0.25 um HiP4 | 0.25 µm CMOS |
| Boîtier | 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch) | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +105C (industrial) | [DATA_NEEDED: industrial/commercial junction range] |
| Statut RoHS | [DATA_NEEDED: RoHS status not stated in web snippets] | [DATA_NEEDED: per NXP product page] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale/Motorola) |
| Product Family | — | PowerQUICC II HIP4 (MPC82xx) |
| Architecture | — | RISC, PowerPC G2 |
| Core Clock Frequency | — | 266 MHz |
| Package Type | — | 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch) |
| Peripherals | — | Communication Processor Module (CPM), PCI, Ethernet, ATM, HDLC |
| Silicon Revision | — | Rev B (HIP4) |
| Tray Packaging | — | Yes (per distributor listings) |