MPC8358EZQAGDDA vs MPC8358ECZQAGDGA Comparaison
Comparaison détaillée côte à côte de MPC8358EZQAGDDA par NXP Semiconductors et MPC8358ECZQAGDGA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8358ECZQAGDGA - PowerQUICC II Pro MPU 400MHz 668-BGA | NXP
MPC8358ECZQAGDGA ObsoleteComparaison des spécifications
| Paramètre | MPC8358EZQAGDDA | MPC8358ECZQAGDGA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Obsolete |
| Core Architecture | PowerPC e300 (single core) | — |
| Largeur du bus de données | 32-bit | — |
| Maximum Core Frequency | 400 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| Package Type | 668-pin TE-PBGA-PGE (29x29 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Memory Interface | DDR1/DDR2 with ECC | — |
| Ethernet | Up to 3 x 10/100/1000 Mbit (via QUICC Engine) | 10/100/1000 Mbps (GMII/RGMII/TBI) |
| PCI | PCI 2.2, 32-bit, up to 66 MHz | Yes (32-bit) |
| USB | USB 2.0 (Full/High Speed) | USB 2.0 FS/HS |
| Serial Protocols | ATM, HDLC, TDM, UART | — |
| Security Engine | SEC 2.0 (IPSec/SSL/3GPP acceleration) | — |
| Local Bus | 8 chip selects, SRAM/Flash/NOR | — |
| Température de fonctionnement | 0 C to +105 C (junction) | -40C to +105C |
| Lead-Free / RoHS | Lead-free finish; RoHS compliant | — |
| Niveau MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Core Processor | — | PowerPC e300 |
| Number of Cores | — | 1 |
| Bus Width | — | 32-bit |
| Core Speed | — | 400 MHz |
| Series | — | MPC83xx |
| Co-Processors / DSP | — | Communications; QUICC Engine, Security; SEC |
| RAM Controllers | — | DDR, DDR2 |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | [DATA_NEEDED] |
| Boîtier / Format | — | 668-BBGA Exposed Pad (PBGA-PGE, 29x29 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Part Status | — | Obsolete |
| Voltage | — | 1.2 V (core) / 1.8 V / 2.5 V / 3.3 V (I/O) |
| Process Technology | — | 0.13 um |