MPC8358EZQAGDDA vs MPC8358ECZQAGDGA Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8358EZQAGDDA sa pamamagitan ng NXP Semiconductors at MPC8358ECZQAGDGA sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8358ECZQAGDGA - PowerQUICC II Pro MPU 400MHz 668-BGA | NXP
MPC8358ECZQAGDGA ObsoletePagsanggunian na paghahambing
| Parametro | MPC8358EZQAGDDA | MPC8358ECZQAGDGA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Core Architecture | PowerPC e300 (single core) | — |
| Width ng Data Bus | 32-bit | — |
| Maximum Core Frequency | 400 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| Package Type | 668-pin TE-PBGA-PGE (29x29 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Memory Interface | DDR1/DDR2 with ECC | — |
| Ethernet | Up to 3 x 10/100/1000 Mbit (via QUICC Engine) | 10/100/1000 Mbps (GMII/RGMII/TBI) |
| PCI | PCI 2.2, 32-bit, up to 66 MHz | Yes (32-bit) |
| USB | USB 2.0 (Full/High Speed) | USB 2.0 FS/HS |
| Serial Protocols | ATM, HDLC, TDM, UART | — |
| Security Engine | SEC 2.0 (IPSec/SSL/3GPP acceleration) | — |
| Local Bus | 8 chip selects, SRAM/Flash/NOR | — |
| Temperature na Operasyon | 0 C to +105 C (junction) | -40C to +105C |
| Lead-Free / RoHS | Lead-free finish; RoHS compliant | — |
| Level ng MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Core Processor | — | PowerPC e300 |
| Number of Cores | — | 1 |
| Bus Width | — | 32-bit |
| Core Speed | — | 400 MHz |
| Series | — | MPC83xx |
| Co-Processors / DSP | — | Communications; QUICC Engine, Security; SEC |
| RAM Controllers | — | DDR, DDR2 |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | [DATA_NEEDED] |
| Packhaging / Kaso | — | 668-BBGA Exposed Pad (PBGA-PGE, 29x29 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Part Status | — | Obsolete |
| Voltage | — | 1.2 V (core) / 1.8 V / 2.5 V / 3.3 V (I/O) |
| Process Technology | — | 0.13 um |