MPC855TCZQ50D4 vs MPC860TCZQ50D4 Comparaison
Comparaison détaillée côte à côte de MPC855TCZQ50D4 par NXP Semiconductors et MPC860TCZQ50D4 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ Fin de vieComparaison des spécifications
| Paramètre | MPC855TCZQ50D4 | MPC860TCZQ50D4 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $22,10 | $16,80 |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | NXP Semiconductors (formerly Freescale) |
| Product Type | Microprocessor (MPU) | — |
| Processor Family | PowerQUICC MPC8xx / PowerPC | — |
| Core Architecture | 32-bit PowerPC with integrated CPM (Communications Processor Module) | PowerPC |
| Core Clock Speed | 50 MHz | 50 MHz |
| Number of Cores | 1 | — |
| Largeur du bus de données | 32-bit | — |
| Tension d'alimentation | 3.3 V | — |
| Température de fonctionnement | -40C to +95C | -40C to +95C (industrial) |
| Boîtier / Format | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Integrated Peripherals | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI | — |
| On-chip Memory Controller | Yes (SDRAM, DRAM, SRAM, Flash support) | — |
| Packaging | Tray | — |
| Lead Free Status | Contains Lead | — |
| Statut RoHS | Non-Compliant (legacy BGA contains lead) | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Process Technology | 0.32 um CMOS | 0.32 um CMOS (per FindIC description) |
| Part Number | — | MPC860TCZQ50D4 |
| Family | — | PowerQUICC / MPC8xx |
| Core | — | MPC8xx - 1 core, 32-bit |
| Instruction / Data Cache | — | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| Tension d'alimentation de fonctionnement | — | 2 V to 3.6 V (per FindIC comparison page) |
| Boîtier | — | 357-PBGA (25x25 mm), ZQ suffix |
| Lead-Free | — | Contains lead (ZQ denotes tin-lead ball finish) |
| CPM (Communications Processor Module) | — | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | — | 4 |
| Memory Controller | — | Up to 256 MB DRAM with page mode support |
| Statut du cycle de vie | — | End of Life (NXP Last Time Buy window passed) |