MPC855TCZQ50D4 vs MPC860TCZQ50D4 Comparación
Comparación detallada lado a lado de MPC855TCZQ50D4 por NXP Semiconductors y MPC860TCZQ50D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP
MPC855TCZQ50D4 ✗ Fin de vidaNXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC855TCZQ50D4 | MPC860TCZQ50D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $22,10 | $16,80 |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | NXP Semiconductors (formerly Freescale) |
| Product Type | Microprocessor (MPU) | — |
| Processor Family | PowerQUICC MPC8xx / PowerPC | — |
| Core Architecture | 32-bit PowerPC with integrated CPM (Communications Processor Module) | PowerPC |
| Core Clock Speed | 50 MHz | 50 MHz |
| Number of Cores | 1 | — |
| Ancho del bus de datos | 32-bit | — |
| Tensión de alimentación | 3.3 V | — |
| Temperatura de funcionamiento | -40C to +95C | -40C to +95C (industrial) |
| Encapsulado / Carcasa | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Integrated Peripherals | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI | — |
| On-chip Memory Controller | Yes (SDRAM, DRAM, SRAM, Flash support) | — |
| Packaging | Tray | — |
| Lead Free Status | Contains Lead | — |
| Estado RoHS | Non-Compliant (legacy BGA contains lead) | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Process Technology | 0.32 um CMOS | 0.32 um CMOS (per FindIC description) |
| Part Number | — | MPC860TCZQ50D4 |
| Family | — | PowerQUICC / MPC8xx |
| Core | — | MPC8xx - 1 core, 32-bit |
| Instruction / Data Cache | — | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| Tensión de alimentación de funcionamiento | — | 2 V to 3.6 V (per FindIC comparison page) |
| Encapsulado | — | 357-PBGA (25x25 mm), ZQ suffix |
| Lead-Free | — | Contains lead (ZQ denotes tin-lead ball finish) |
| CPM (Communications Processor Module) | — | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | — | 4 |
| Memory Controller | — | Up to 256 MB DRAM with page mode support |
| Estado del ciclo de vida | — | End of Life (NXP Last Time Buy window passed) |