MPX4250GP vs MPX5500DP Comparaison
Comparaison détaillée côte à côte de MPX4250GP par NXP Semiconductors et MPX5500DP par STMicroelectronics. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPX4250GP - 250kPa Vented Gauge Pressure Sensor | NXP Semiconductors
MPX4250GP ✓ ActifSTMicroelectronics
MPX5500DP - 500kPa Differential Pressure Sensor | STMicroelectronics
MPX5500DP ✓ ActifComparaison des spécifications
| Paramètre | MPX4250GP | MPX5500DP |
|---|---|---|
| Marque | NXP Semiconductors | STMicroelectronics |
| Catégorie | Pressure Sensors | Pressure Sensors |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $9,85 | $4,86 |
| Manufacturer | NXP Semiconductors | — |
| Pressure Type | Vented Gauge | Differential (Dual Port) |
| Operating Pressure Range | 0 kPa to 250 kPa (0 to 36.26 PSI) | — |
| Maximum Overpressure | [DATA_NEEDED: max overpressure rating] | — |
| Type de sortie | Analog, Ratiometric | Analog Voltage |
| Plage de tension de sortie | 0.2 V to 4.9 V | 0.2 V to 4.7 V |
| Sensitivity | 18.8 mV/kPa (nominal) | — |
| Tension d'alimentation | 4.85 V to 5.35 V | 5 V (typical) |
| Courant d'alimentation | [DATA_NEEDED: supply current] | [DATA_NEEDED: supply current] |
| Température de fonctionnement | -40C to +125C | -40C to +125C (per ST datasheet family) |
| Accuracy | [DATA_NEEDED: total error band] | [DATA_NEEDED: accuracy %FS] |
| Port Size | 0.19 inch (4.93 mm) male tube / barbed | Male 0.19" (4.93 mm) Tube, Dual |
| Boîtier | 6-SIP Module (6-pin Single Inline Package) | 6-SIP Module |
| Type de montage | Through-hole SIP module | Through-Hole (SIP) |
| Compensation | On-chip temperature compensated and calibrated | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant (per ST/NXP product pages) |
| Operating Pressure Max | — | 500 kPa (72.52 PSI) |
| Operating Pressure Min | — | 0 kPa |
| Compensated Temperature | — | 0 C to 85 C |
| Package Dimensions | — | 17.78 mm x 29.48 mm x 10.67 mm |
| Lead Pitch | — | 2.54 mm |
| Technology | — | Piezoresistive, Monolithic Silicon |
| Signal Conditioning | — | On-chip, Temperature Compensated |