MPX5050DP vs MPXV5050GP Comparaison
Comparaison détaillée côte à côte de MPX5050DP par NXP Semiconductors et MPXV5050GP par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MPX5050DP | MPXV5050GP |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Pressure Sensors | Pressure Sensors |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $8,65 | $10,66 |
| Manufacturer | NXP Semiconductors | — |
| Type de capteur | Differential Pressure Sensor | Vented Gauge Pressure Sensor |
| Operating Principle | Piezoresistive (MEMS silicon) | — |
| Pressure Range | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) |
| Pressure Port Type | Differential, dual tube port (Male, 0.19" / 4.93 mm Tube) | — |
| Type de sortie | Analog ratiometric voltage | Analog, ratiometric |
| Plage de tension de sortie | 0.2 V to 4.7 V | — |
| Full-Scale Span | 4.5 V typical | 4.5 V typical |
| Tension d'alimentation | 5.0 V nominal (4.75 V to 5.25 V) | 4.75 V to 5.25 V (5 V typical) |
| Sensitivity | 90 mV/kPa typical | — |
| Accuracy | [DATA_NEEDED: full temperature accuracy band] | — |
| Response Time | 1 ms typical | — |
| Overpressure Rating | 200 kPa | — |
| Température de fonctionnement | -40C to +125C | 0C to +85C |
| Boîtier | 6-SIP Module (SOT1693-1 / Case 1351-01) | 8-SMD, Gull Wing, Side Port (SO SOT1693-1) |
| Type de montage | Through-Hole (with dual pressure ports) | Surface Mount |
| Courant d'alimentation | [DATA_NEEDED: quiescent supply current] | — |
| Statut RoHS | Compliant | Compliant |
| Tension de sortie | — | 0.2 V to 4.7 V (at 5 V supply) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Port Style | — | Male - 0.13 in (3.17 mm) vertical side tube |
| Body Size | — | 12.06 mm x 12.06 mm x 3.38 mm |
| Lead Pitch | — | 2.54 mm |
| Signal Conditioning | — | On-chip bipolar op-amp, thin-film temp compensation |
| Min Package Quantity | — | 25 (NXP tray) |
| Min Order Quantity | — | 250 (NXP budgetary) |