MSC8157ETVT1000A vs MSC8157ESVT1000A Comparaison
Comparaison détaillée côte à côte de MSC8157ETVT1000A par NXP Semiconductors et MSC8157ESVT1000A par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP
MSC8157ETVT1000A ObsoleteNXP Semiconductors
MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8157ESVT1000A ObsoleteComparaison des spécifications
| Paramètre | MSC8157ETVT1000A | MSC8157ESVT1000A |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $190,89 | $152,80 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Series | StarCore | — |
| Type | SC3850 Six-Core Digital Signal Processor (DSP) | — |
| Architecture | StarCore SC3850, six independent cores | — |
| Core Count | 6 | — |
| Clock Rate | 1 GHz (1000 MHz) | — |
| Largeur du bus de données | 64-bit | 32-Bit / 64-Bit |
| On-Chip RAM | 6.375 MB | — |
| On-Chip ROM | 96 kB | — |
| L1 Instruction Cache (per core) | 32 KB | 32 KB |
| L1 Data Cache (per core) | 32 KB | 32 KB |
| Voltage - Core | 1.0 V | — |
| Voltage - I/O | 1.0 V / 1.5 V / 2.5 V (selectable) | — |
| Interfaces | Ethernet, I²C, SPI, UART/USART, PCI, RGMII, SGMII, Serial RapidIO | — |
| Température de fonctionnement | -40°C to +105°C (Extended) | 0C to +105C |
| Boîtier | 783-FCBGA (Flip-Chip BGA), 29 mm × 29 mm | — |
| Nombre de broches | 783 | — |
| Type de montage | Surface Mount (FCBGA) | Surface Mount (FCBGA) |
| Lead Status | Lead Free | — |
| Process Technology | CMOS | CMOS |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Core Architecture | — | StarCore SC3850 (Six cores) |
| Core Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core / 6000 MIPS aggregate |
| Package Type | — | FCBGA-783 (Flip-Chip BGA, 29x29 mm) |
| Pin/Ball Count | — | 783 |
| Tension d'alimentation | — | 1.0 V core (typical) |
| Lead-Free / RoHS | — | Yes (lead-free) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |
| High-Speed Interfaces | — | Serial RapidIO, SGMII, PCI Express, Ethernet, I2C, SPI, UART |
| Memory Controller | — | Multi-channel DDR SDRAM controller |
| Statut du cycle de vie | — | Obsolete (stock available from authorized distributors) |