MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP
Référence : MSC8157ETVT1000A ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $247.48 | $247,48 |
| 10 | $228.92 | $2 289,20 |
| 100 | $210.41 | $21 041,00 |
| 500 | $197.4 | $98 700,00 |
| 1 000 | $190.89 | $190 890,00 |
MSC8157ETVT1000A Présentation
A digital signal processor (DSP) is a specialized microprocessor whose architecture (modified Harvard, wide datapaths, hardware MACs, single-cycle multi-issue) is optimized for the numerical intensity of signal-processing algorithms such as FIR/IIR filtering, FFTs, and modem baseband processing. The NXP MSC8157 family sits at the high end of the StarCore roadmap: a multi-core DSP subsystem-on-chip aimed at wireless base stations, media gateways, and other compute-heavy infrastructure linecards, several levels above a generic microcontroller in computational density for fixed-point DSP workloads.
Key features include six SC3850 cores, 6.375 MB on-chip RAM, 96 kB on-chip ROM, a rich multi-protocol I/O subsystem (Ethernet, I²C, SPI, UART, PCI, RGMII, SGMII, Serial RapidIO), and voltage-flexible I/O rails at 1.0 V / 1.5 V / 2.5 V. The extended-temperature grade and security-enhanced firmware (T suffix denoting Trusted / secure boot versions of the device family) make it suitable for industrial and telecom-infrastructure applications.
The architecture combines six independent VLIW-style SC3850 cores with a high-bandwidth shared L2 memory subsystem and dedicated DMA controllers. This design enables parallel execution of DSP tasks such as multi-channel baseband processing while a separate core complex manages MAC/PHY stacks or encryption, all within a single BGA package. The 1 GHz clock and 64-bit datapath provide the headroom needed for 3G/4G PHY workloads and high-channel-count media transcoding.
Typical applications include wireless baseband processing in 3G/4G LTE picocells and femtocells, multi-channel voice and audio transcoding in media gateways, radar and sonar array processing, and industrial machine-vision inspection lines. The Serial RapidIO and SGMII interfaces let the part drop directly into AdvancedTCA-style linecards and DSP farms.
When designing with this device, allocate at least six PCB layers for the FCBGA break-out and provide a continuous ground plane under the package. The 1 GHz clock, 64-bit external bus, and multi-rail power tree (1.0 V core plus selectable 1.0/1.5/2.5 V I/O) demand strict DDR-style length matching and decoupling discipline.
This page synthesizes real-time distributor pricing, Freescale/NXP StarCore family cross-references, and practical design considerations not found in the standalone datasheet, helping system architects evaluate drop-in and speed-grade alternatives for the MSC8157ETVT1000A.
Alternatives de remplacement direct pour MSC8157ETVT1000A — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MSC8157ETVT1000A (même facteur de forme et même empreinte) — différant par Operating Temperature, Mounting Type, Interfaces, Memory Controller, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MSC8157ESVT1000A
✅ Remplacement direct✓ En stock
$152.8 / unité
Voir la fiche technique →MSC8144ETVT800A
✅ Remplacement direct✓ En stock
$195.5 / unité
Voir la fiche technique →MSC8156ESAG1000B
✅ Remplacement direct✓ En stock
$112 / unité
Voir la fiche technique →MSC8156HVT1000B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8256ESVT1000B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MSC8157ETVT1000A Spécifications
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | StarCore |
| Type | SC3850 Six-Core Digital Signal Processor (DSP) |
| Architecture | StarCore SC3850, six independent cores |
| Core Count | 6 |
| Clock Rate | 1 GHz (1000 MHz) |
| Largeur du bus de données | 64-bit |
| On-Chip RAM | 6.375 MB |
| On-Chip ROM | 96 kB |
| L1 Instruction Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| Voltage - Core | 1.0 V |
| Voltage - I/O | 1.0 V / 1.5 V / 2.5 V (selectable) |
| Interfaces | Ethernet, I²C, SPI, UART/USART, PCI, RGMII, SGMII, Serial RapidIO |
| Température de fonctionnement | -40°C to +105°C (Extended) |
| Boîtier | 783-FCBGA (Flip-Chip BGA), 29 mm × 29 mm |
| Nombre de broches | 783 |
| Type de montage | Surface Mount (FCBGA) |
| Lead Status | Lead Free |
| Process Technology | CMOS |
Guide de configuration des broches du MSC8157ETVT1000A 783-fcbga (flip-chip bga), 29 mm × 29 mm
Configuration des broches du MSC8157ETVT1000A (boîtier 783-fcbga (flip-chip bga), 29 mm × 29 mm). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour MSC8157ETVT1000A.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MSC8157ETVT1000A convient pour 6 applications: Wireless Baseband Processing (3G/4G LTE Picocells & Femtocells), Multi-Channel Voice and Audio Transcoding, Radar and Sonar Array Processing, Industrial Machine-Vision Inspection Systems, Telecom Infrastructure (DSP Farm Linecards), Software Defined Radio (SDR) Base Stations.
Wireless Baseband Processing (3G/4G LTE Picocells & Femtocells)
The MSC8157ETVT1000A's six SC3850 cores at 1 GHz and 6.375 MB on-chip RAM make it well-suited for parallel physical-layer baseband processing in 3G and 4G LTE picocell and femcell base stations. Each core can independently execute channel decoding, FFT/iFFT blocks, or modem stacks while the high-bandwidth L2 memory subsystem keeps data movement off the external bus. The Serial RapidIO and SGMII interfaces integrate naturally with base-station backhaul and PHY transceivers. The extended -40°C to +105°C temperature grade survives outdoor deployments where ambient can swing widely. Per NXP documentation, six-core StarCore delivers the aggregate MIPS required for multi-channel LTE PHY without an additional co-processor. This makes the part a single-chip alternative to multiple lower-core DSPs, reducing BOM and FPGA glue logic.
Recommandé
Multi-Channel Voice and Audio Transcoding
Voice gateways, IP-PBX systems, and conference bridges that need to transcode hundreds of G.711/G.722/AMR-WB streams simultaneously benefit from the MSC8157ETVT1000A's parallel DSP throughput. Each SC3850 core delivers up to 1 GMAC/s of fixed-point arithmetic, so six cores handle 6+ GMAC/s aggregate throughput. The 6.375 MB on-chip RAM accommodates input/output frame buffers plus per-channel state, reducing external DDR traffic. The UART/USART and I²C control interfaces let the host MPU manage call routing while the DSP cores handle transcoding. Compared to a CPU-based transcoder farm, the MSC8157ETVT1000A consumes far less power per channel and runs deterministic real-time code. This makes it a strong fit for media-gateway and SBC (session border controller) designs.
Recommandé
Radar and Sonar Array Processing
Phased-array radar and sonar systems require parallel beamforming, FFT, and pulse-compression operations across many channels with deterministic latency - exactly the workload profile the MSC8157ETVT1000A targets. Each SC3850 core handles a slice of the array while the 1 GHz clock sustains real-time processing windows. The 64-bit data bus sustains the high sample rates needed for active electronically scanned arrays. Multiple MSC8157ETVT1000A devices can be chained via Serial RapidIO to scale to larger antenna arrays in naval and surveillance installations. Industrial and defense-grade variants of the same die family provide extended-temperature reliability for marine environments. Per the NXP MSC8157 product brief, six-core DSPs are widely used in radar front-end pre-processing.
Recommandé
Industrial Machine-Vision Inspection Systems
High-speed production-line inspection cameras must process multi-megapixel frames at line rates of 30-60 fps to detect defects in real time. The MSC8157ETVT1000A's six cores, each capable of running independent Sobel, FFT, or convolution kernels, deliver the aggregate throughput for parallel image processing pipelines. The extended -40°C to +105°C temperature range handles the heat of cabinet-mounted industrial PCs near motors and drives. The SPI and I²C interfaces connect to camera sensors and lighting controllers while Ethernet (RGMII/SGMII) streams processed results to factory PLCs. The 96 kB on-chip ROM supports secure boot of inspection firmware, important for anti-tamper in contract-manufacturing facilities. This makes the part a strong fit for SMT, semiconductor, and pharmaceutical inspection lines.
Recommandé
Telecom Infrastructure (DSP Farm Linecards)
DSP farm linecards in AdvancedTCA and proprietary telecom chassis aggregate many DSPs to handle thousands of voice or data channels per shelf. The MSC8157ETVT1000A's 783-FCBGA 29x29 mm body is optimized for high-density linecards with front-panel I/O, and the Serial RapidIO fabric lets multiple devices share one backplane without CPU intervention. The PCI interface maintains compatibility with legacy AdvancedTCA control planes. The voltage-flexible I/O rails (1.0/1.5/2.5 V) let designers bridge to older ASICs on the same linecard. According to NXP application notes, six-core StarCore devices replaced multiple earlier-generation DSPs in dense media-gateway shelves. The part's extended temperature grade suits outdoor cabinet installations in mobile network infrastructure.
Recommandé
Software Defined Radio (SDR) Base Stations
Software defined radio platforms targeting LTE and 5G small cells use general-purpose DSPs to run waveforms in software, enabling field upgrades without hardware rework. The MSC8157ETVT1000A's six cores give SDR designers the headroom to run multiple radio chains in parallel - one core per antenna branch, with reserve cores for adaptive filtering and protocol stack work. The 1 GHz clock and 64-bit datapath sustain the FFT and channel-decoding workloads at LTE symbol rates. External ADC/DAC companion parts interface via RGMII/SGMII, keeping the analog front-end and digital baseband cleanly partitioned. Per the NXP product brief, the device family is widely used in software-Defined-Radio reference designs. The extended temperature grade supports outdoor small-cell enclosure requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MSC8157ETVT1000A — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MSC8157ESVT1000A | MSC8144ETVT800A | MSC8156ESAG1000B | MSC8156HVT1000B | MSC8256ESVT1000B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA - same | 783-FCBGA - same | 783-FCBGA - same | 783-FCBGA - same | 783-FCBGA - same |
| Clock Rate | 1 GHz | 1 GHz | 800 MHz (-20%) | 1 GHz | 1 GHz | 1 GHz |
| Architecture | StarCore SC3850, six independent cores | StarCore SC3850, six independent cores | StarCore SC3850, four cores | StarCore SC3850, quad cluster | StarCore SC3850 | StarCore SC3850 single-core superscalar |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Six independent SC3850 cores at 1 GHz aggregate throughput (vs MSC8144ETVT800A)
- Extended temperature grade covering -40°C to +105°C (vs MSC8157ESVT1000A)
- Multi-protocol I/O including Serial RapidIO, SGMII, PCI (vs MSC8256ESVT1000B)
Notes de conception
Estimated: at 1.0 V core, six cores running at full utilization draw the bulk of the rated power. The FCBGA package has a theta_JC in the single-digit C/W range but achieves its full thermal performance only when the PCB land pattern includes a continuous ground plane and thermal via array directly beneath the BGA. In a typical 6-layer PCB with 1 oz copper and a thermal-via grid, expect theta_JB near 1-2 C/W; designers should also include a heat spreader or forced-air cooling for sustained workloads above 70°C ambient.
The 783-FCBGA at 29x29 mm needs HDI microvia technology (laser-drilled or plasma-etched vias in the buildup layers) to escape the 1 mm-pitch BGA. Routes must exit on inner layers through via-on-pad or dog-bone fanouts, with matched-length traces on the 64-bit external data bus. Per NXP FCBGA layout guidelines, place 0.1 µF decoupling capacitors on every voltage rail in the package footprint plus bulk ceramic + tantalum capacitors within 1 inch. Use a continuous reference plane directly under the BGA to control impedance for the 1 GHz signals.
The 1 GHz clock and 64-bit external bus make signal integrity a first-order concern. Use controlled-impedance routing (target 50 Ω single-ended, 100 Ω differential for Serial RapidIO and SGMII), keep series-termination resistors within 200 mils of the driver, and apply matched-length rules (±25 mil) on the data bus to keep skew below one clock period. Per NXP application notes, avoid routing high-speed signals across plane splits under the package and place guard traces or shielding around clock outputs.
Voltage sequencing matters: bring the 1.0 V core rail up before the selectable 1.0/1.5/2.5 V I/O rails to prevent I/O latch-up. Use a multi-phase PMIC such as the NXP PF3000 or equivalent to provide tight 1.0 V regulation under the high di/dt that six 1 GHz cores demand. Bulk 22 µF ceramic plus 47 µF polymer capacitors placed adjacent to the BGA reduce core-rail droop during DSP processing peaks. Add a sequencing supervisor to assert reset only after both rails reach regulation.
Three pitfalls trip up most first-time MSC8157ETVT1000A designers. First, the obsolete lifecycle status means new designs should not commit the part - validate NXP PCN alerts and stock availability with authorized distributors like Rochester Electronics. Second, the boot ROM expects firmware to be loaded via Serial RapidIO, I²C, or PCI; designers must populate a boot EEPROM or flash on every reference design. Third, the encryption/security suffix (T variant) requires a signed firmware image - production code must include secure-boot headers or the device will refuse to execute.
Informations de conformité
RoHS compliant lead-free FCBGA per Freescale/NXP product page; AEC-Q100 not qualified (industrial/telecom grade, not automotive); conflict-minerals policy inherited from NXP corporate compliance.
