RTAX4000SL-1CQ352V vs RTAX4000DL-CQ352V Comparaison
Comparaison détaillée côte à côte de RTAX4000SL-1CQ352V par Microchip Technology et RTAX4000DL-CQ352V par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
RTAX4000SL-1CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip
RTAX4000SL-1CQ352V ✓ ActifMicrochip Technology
RTAX4000DL-CQ352V - 4M-Gate Radiation-Tolerant FPGA | Microchip
RTAX4000DL-CQ352V ✓ ActifComparaison des spécifications
| Paramètre | RTAX4000SL-1CQ352V | RTAX4000DL-CQ352V |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3 600,00 | $4 200,00 |
| Logic Elements (CLBs) | 40320 | — |
| Logic Cells | 60480 | 55,440 |
| Equivalent System Gates | 4000000 | 4,000,000 |
| Family | RTAX-S/SL Radiation-Tolerant FPGAs | RTAX-S/SL and RTAX-DSP (RTAX-DSP) |
| Technology | CMOS, antifuse (one-time programmable) | — |
| Speed Grade | -1 | — |
| Boîtier | CQ352 (ceramic, 352-pin) | — |
| Quality / Screening Grade | V (space qualification level) | — |
| Embedded SRAM | Yes, with built-in FIFO control logic | — |
| Power-Up Behavior | Live at power-up (LAPU) | — |
| Configuration | Single-chip, no external boot PROM | Live at power up, single-chip |
| Target Market | Space-flight systems | — |
| Base Architecture | Axcelerator (commercial counterpart) | — |
| Core Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | -55C to +125C |
| TID Rating | [DATA_NEEDED: total ionizing dose rating] | — |
| Radiation Immunity | Configuration immune to single-event upset (antifuse) | — |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| CLB Organization | — | 36,960 CLBs |
| Process Technology | — | CMOS, antifuse (one-time programmable) |
| Core Supply Voltage | — | 1.5 V nominal |
| Package Type | — | 352-terminal S-CQFP ceramic metal-sealed cofired flatpack (CQ352) |
| Package Dimensions | — | 48 mm x 48 mm, square, with guard ring |
| JEDEC-30 Package Code | — | S-CQFP |
| Radiation Tolerance Class | — | Radiation-tolerant (space-flight) |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control logic |
| Routing Features | — | Segmentable clocks, chip-wide highway routing, carry logic |
| Type de montage | — | Surface Mount |
| Statut RoHS | — | [DATA_NEEDED: RoHS status] |
| Total User I/O | — | [DATA_NEEDED: total user I/O count] |