RTAX4000SL-1CQ352V vs RTAX4000DL-CQ352V Vergleich
Detaillierter Direktvergleich von RTAX4000SL-1CQ352V von Microchip Technology und RTAX4000DL-CQ352V von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
RTAX4000SL-1CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip
RTAX4000SL-1CQ352V ✓ AktivMicrochip Technology
RTAX4000DL-CQ352V - 4M-Gate Radiation-Tolerant FPGA | Microchip
RTAX4000DL-CQ352V ✓ AktivSpezifikationsvergleich
| Parameter | RTAX4000SL-1CQ352V | RTAX4000DL-CQ352V |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.600,00 | $4.200,00 |
| Logic Elements (CLBs) | 40320 | — |
| Logic Cells | 60480 | 55,440 |
| Equivalent System Gates | 4000000 | 4,000,000 |
| Family | RTAX-S/SL Radiation-Tolerant FPGAs | RTAX-S/SL and RTAX-DSP (RTAX-DSP) |
| Technology | CMOS, antifuse (one-time programmable) | — |
| Speed Grade | -1 | — |
| Gehäuse | CQ352 (ceramic, 352-pin) | — |
| Quality / Screening Grade | V (space qualification level) | — |
| Embedded SRAM | Yes, with built-in FIFO control logic | — |
| Power-Up Behavior | Live at power-up (LAPU) | — |
| Configuration | Single-chip, no external boot PROM | Live at power up, single-chip |
| Target Market | Space-flight systems | — |
| Base Architecture | Axcelerator (commercial counterpart) | — |
| Core Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -55C to +125C |
| TID Rating | [DATA_NEEDED: total ionizing dose rating] | — |
| Radiation Immunity | Configuration immune to single-event upset (antifuse) | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| CLB Organization | — | 36,960 CLBs |
| Process Technology | — | CMOS, antifuse (one-time programmable) |
| Core Supply Voltage | — | 1.5 V nominal |
| Package Type | — | 352-terminal S-CQFP ceramic metal-sealed cofired flatpack (CQ352) |
| Package Dimensions | — | 48 mm x 48 mm, square, with guard ring |
| JEDEC-30 Package Code | — | S-CQFP |
| Radiation Tolerance Class | — | Radiation-tolerant (space-flight) |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control logic |
| Routing Features | — | Segmentable clocks, chip-wide highway routing, carry logic |
| Montageart | — | Surface Mount |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |
| Total User I/O | — | [DATA_NEEDED: total user I/O count] |