SCIMX535DVV1C-FR vs MCIMX535DVV1CR2 Comparaison
Comparaison détaillée côte à côte de SCIMX535DVV1C-FR par NXP Semiconductors et MCIMX535DVV1CR2 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | SCIMX535DVV1C-FR | MCIMX535DVV1CR2 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $31,75 | $22,40 |
| Core Architecture | ARM Cortex-A8 (ARMv7-A) | 32-bit |
| Maximum Core Frequency | 1.0 GHz | — |
| L1 Cache (I/D) | 32 KB / 32 KB | — |
| L2 Cache | 256 KB unified | — |
| Internal SRAM | 128 KB | — |
| Memory Interface | DDR2/LPDDR2 (16/32-bit) with PoP support | — |
| Number of User I/Os | 224 | — |
| GPU | Integrated 2D/3D graphics accelerator | — |
| Video Processing Unit | Hardware H.264 720p decode, MPEG-4, MJPEG | — |
| Display Controller | Up to WXGA (1280 x 800) resolution | — |
| Peripheral Interfaces | 2x USB 2.0, 2x CAN, 1x 10/100 ENET MAC, SATA-II, UART, SPI, I2C, I2S | — |
| Boîtier | 529-FCBGA, 19 mm x 19 mm, 0.8 mm pitch | — |
| PoP Memory Interface | FC-PBGA 12 mm, 0.4 mm pitch | — |
| Plage de température de fonctionnement | -20C to +85C (industrial) / -40C to +85C (extended, [DATA_NEEDED: confirmed grade suffix]) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | 3 (168 hours) [DATA_NEEDED: confirm from manufacturer datasheet] | 3 |
| Statut RoHS | Compliant (FR suffix indicates Pb-free) | Compliant |
| Lead-Free Finish | Yes (FR suffix) | — |
| Supply Voltage Range | [DATA_NEEDED: confirm exact rail voltages from datasheet] | — |
| PMIC Companion (recommended) | NXP PF0100 / MMPF0100 | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | i.MX53 |
| Core Processor | — | ARM Cortex-A8 |
| Number of Cores | — | 1 |
| Operating Frequency | — | 1.0 GHz |
| On-chip SRAM | — | 128 KB |
| Number of I/O Lines | — | 224 |
| Core Voltage Range | — | 0.9 V / 1.25 V / 1.3 V |
| Boîtier / Format | — | 529-FBGA / TEBGA-2 (19 mm x 19 mm) |
| Ball Pitch | — | 0.8 mm |
| Peripherals | — | LCD, Ethernet, USB, SATA, SDHC, I2C, SPI, UART, CAN |
| Connectivity | — | 10/100 Ethernet MAC, USB 2.0, SATA-II |
| GPU / Graphics | — | OpenVG / 2D/3D graphics accelerator |
| Video Processing | — | IPU + hardware codec (H.264, MPEG-4, VC-1) |
| Security | — | SAHARAS hardware encryption (AES, SHA, RNG) |
| Température de fonctionnement | — | -40C to +85C (industrial) |