SCIMX535DVV1C-FR vs MCIMX535DVV1CR2 Comparação
Comparação detalhada lado a lado de SCIMX535DVV1C-FR por NXP Semiconductors e MCIMX535DVV1CR2 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | SCIMX535DVV1C-FR | MCIMX535DVV1CR2 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $31,75 | $22,40 |
| Core Architecture | ARM Cortex-A8 (ARMv7-A) | 32-bit |
| Maximum Core Frequency | 1.0 GHz | — |
| L1 Cache (I/D) | 32 KB / 32 KB | — |
| L2 Cache | 256 KB unified | — |
| Internal SRAM | 128 KB | — |
| Memory Interface | DDR2/LPDDR2 (16/32-bit) with PoP support | — |
| Number of User I/Os | 224 | — |
| GPU | Integrated 2D/3D graphics accelerator | — |
| Video Processing Unit | Hardware H.264 720p decode, MPEG-4, MJPEG | — |
| Display Controller | Up to WXGA (1280 x 800) resolution | — |
| Peripheral Interfaces | 2x USB 2.0, 2x CAN, 1x 10/100 ENET MAC, SATA-II, UART, SPI, I2C, I2S | — |
| Encapsulamento | 529-FCBGA, 19 mm x 19 mm, 0.8 mm pitch | — |
| PoP Memory Interface | FC-PBGA 12 mm, 0.4 mm pitch | — |
| Faixa de temperatura de operação | -20C to +85C (industrial) / -40C to +85C (extended, [DATA_NEEDED: confirmed grade suffix]) | — |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount |
| Nível MSL | 3 (168 hours) [DATA_NEEDED: confirm from manufacturer datasheet] | 3 |
| Status RoHS | Compliant (FR suffix indicates Pb-free) | Compliant |
| Lead-Free Finish | Yes (FR suffix) | — |
| Supply Voltage Range | [DATA_NEEDED: confirm exact rail voltages from datasheet] | — |
| PMIC Companion (recommended) | NXP PF0100 / MMPF0100 | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | i.MX53 |
| Core Processor | — | ARM Cortex-A8 |
| Number of Cores | — | 1 |
| Operating Frequency | — | 1.0 GHz |
| On-chip SRAM | — | 128 KB |
| Number of I/O Lines | — | 224 |
| Core Voltage Range | — | 0.9 V / 1.25 V / 1.3 V |
| Encapsulamento / Caixa | — | 529-FBGA / TEBGA-2 (19 mm x 19 mm) |
| Ball Pitch | — | 0.8 mm |
| Peripherals | — | LCD, Ethernet, USB, SATA, SDHC, I2C, SPI, UART, CAN |
| Connectivity | — | 10/100 Ethernet MAC, USB 2.0, SATA-II |
| GPU / Graphics | — | OpenVG / 2D/3D graphics accelerator |
| Video Processing | — | IPU + hardware codec (H.264, MPEG-4, VC-1) |
| Security | — | SAHARAS hardware encryption (AES, SHA, RNG) |
| Temperatura de operação | — | -40C to +85C (industrial) |