STM32F103ZET7 vs STM32F745ZET6 Comparaison

Comparaison détaillée côte à côte de STM32F103ZET7 par STMicroelectronics et STM32F745ZET6 par STMicroelectronics. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

STMicroelectronics
STM32F103ZET7 STM32F103ZET7 - 72MHz Cortex-M3 512KB MCU | STMicroelectronics

STM32F103ZET7 - 72MHz Cortex-M3 512KB MCU | STMicroelectronics

STM32F103ZET7 ✓ Actif
STMicroelectronics
STM32F745ZET6 STM32F745ZET6 - 216MHz Cortex-M7 512KB MCU | STMicroelectronics

STM32F745ZET6 - 216MHz Cortex-M7 512KB MCU | STMicroelectronics

STM32F745ZET6 ✓ Actif

Comparaison des spécifications

Paramètre STM32F103ZET7 STM32F745ZET6
Marque STMicroelectronics STMicroelectronics
Catégorie Microcontrollers Microcontrollers
Statut du cycle de vie Actif Actif
Product Type 32-bit ARM Cortex-M3 microcontroller 32-bit microcontroller IC
Maximum Operating Frequency 72 MHz 216 MHz
Architecture 32-bit RISC 32-bit RISC
Embedded Flash Memory 512 KB —
Operating Voltage 2.5 V/3.3 V —
Timer Count 11 timers —
ADC Count 3 ADCs —
Communication Interface Count 13 communication interfaces —
USB Interface USB —
CAN Interface CAN —
Boîtier 144-LQFP 144-LQFP (20 mm x 20 mm)
Package Body Size 20 mm x 20 mm —
Type de montage Surface Mount Surface mount
Core ARM Cortex-M3 32-bit ARM Cortex-M7
MCU Family STM32F1 high-density performance line —
Flash Organization 512K x 8 —
Plage de température de fonctionnement [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
RAM Capacity [DATA_NEEDED: RAM capacity] —
GPIO Count [DATA_NEEDED: GPIO count] —
Statut RoHS [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification]
Flash Memory — 512 KB (512K x 8)
Supply Voltage Options — 1.8 V, 2.5 V, and 3.3 V
Microcontroller Family — STM32F7
DSP/FPU Positioning — High-performance and DSP/FPU
Packaging — Tray
RAM — [DATA_NEEDED: RAM memory]
Maximum I/O Count — [DATA_NEEDED: maximum I/O count]
Peripheral Interfaces — [DATA_NEEDED: peripheral interfaces]
Clock Sources — [DATA_NEEDED: clock sources]
Flash Endurance — [DATA_NEEDED: Flash endurance]
ESD/Humidity Qualification — [DATA_NEEDED: ESD and humidity qualification]
RoHS — [DATA_NEEDED: RoHS status]
REACH — [DATA_NEEDED: REACH status]

Fiches techniques et ressources

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