STM32F103ZET7 vs STM32F745ZET6 Perbandingan
Perbandingan bersamaan detil STM32F103ZET7 dari STMicroelectronics dan STM32F745ZET6 dari STMicroelectronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
STMicroelectronics
STM32F103ZET7 - 72MHz Cortex-M3 512KB MCU | STMicroelectronics
STM32F103ZET7 ✓ AktifSTMicroelectronics
STM32F745ZET6 - 216MHz Cortex-M7 512KB MCU | STMicroelectronics
STM32F745ZET6 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | STM32F103ZET7 | STM32F745ZET6 |
|---|---|---|
| Merek | STMicroelectronics | STMicroelectronics |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | 32-bit ARM Cortex-M3 microcontroller | 32-bit microcontroller IC |
| Maximum Operating Frequency | 72 MHz | 216 MHz |
| Architecture | 32-bit RISC | 32-bit RISC |
| Embedded Flash Memory | 512 KB | — |
| Operating Voltage | 2.5 V/3.3 V | — |
| Timer Count | 11 timers | — |
| ADC Count | 3 ADCs | — |
| Communication Interface Count | 13 communication interfaces | — |
| USB Interface | USB | — |
| CAN Interface | CAN | — |
| Paket | 144-LQFP | 144-LQFP (20 mm x 20 mm) |
| Package Body Size | 20 mm x 20 mm | — |
| Tipe Mounting | Surface Mount | Surface mount |
| Core | ARM Cortex-M3 | 32-bit ARM Cortex-M7 |
| MCU Family | STM32F1 high-density performance line | — |
| Flash Organization | 512K x 8 | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| RAM Capacity | [DATA_NEEDED: RAM capacity] | — |
| GPIO Count | [DATA_NEEDED: GPIO count] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | [DATA_NEEDED: AEC-Q100 qualification] |
| Flash Memory | — | 512 KB (512K x 8) |
| Supply Voltage Options | — | 1.8 V, 2.5 V, and 3.3 V |
| Microcontroller Family | — | STM32F7 |
| DSP/FPU Positioning | — | High-performance and DSP/FPU |
| Packaging | — | Tray |
| RAM | — | [DATA_NEEDED: RAM memory] |
| Maximum I/O Count | — | [DATA_NEEDED: maximum I/O count] |
| Peripheral Interfaces | — | [DATA_NEEDED: peripheral interfaces] |
| Clock Sources | — | [DATA_NEEDED: clock sources] |
| Flash Endurance | — | [DATA_NEEDED: Flash endurance] |
| ESD/Humidity Qualification | — | [DATA_NEEDED: ESD and humidity qualification] |
| RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH | — | [DATA_NEEDED: REACH status] |