XC6SLX25-3FT256I vs XC6SLX25-3FT256C Comparaison
Comparaison détaillée côte à côte de XC6SLX25-3FT256I par AMD et XC6SLX25-3FT256C par Xilinx. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | XC6SLX25-3FT256I | XC6SLX25-3FT256C |
|---|---|---|
| Marque | AMD | Xilinx |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-6 LX field-programmable gate array |
| Device Family | Spartan-6 LX | — |
| Logic Cells | 24,051 cells | — |
| Configurable Logic Blocks | 1,879 CLBs | 1,879 CLBs |
| Adaptive Logic Modules | 3,758 ALMs | 3,758 ALMs |
| Embedded Memory | 936 kbit | 936 kbit |
| User I/O | 186 I/O | — |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | -3 | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Boîtier | 256-LBGA, 17 x 17 mm | 256-pin FTBGA, 17 x 17 mm, 1 mm pitch |
| Package Pitch | [DATA_NEEDED: package ball pitch] | — |
| Température de fonctionnement | 0°C to 85°C | — |
| Termination | Lead-free | — |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | [DATA_NEEDED: AEC-Q100 qualification] |
| Logic Elements | — | 24,051 cells |
| Input/Output Count | — | 186 I/O |
| Core Voltage | — | 1.2 V |
| Performance Figure | — | 667 MHz |
| Terminal Count | — | 256 balls |
| Type de montage | — | Surface mount |
| Package Shape | — | Square |
| Temperature Grading | — | Other |
| Lead-Free Status | — | Lead free |
| Unit Price | — | $24.3384 as of 2026-10-28 |