XC6SLX25-3FT256I vs XC6SLX25-3FT256C Comparación
Comparación detallada lado a lado de XC6SLX25-3FT256I por AMD y XC6SLX25-3FT256C por Xilinx. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC6SLX25-3FT256I | XC6SLX25-3FT256C |
|---|---|---|
| Marca | AMD | Xilinx |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-6 LX field-programmable gate array |
| Device Family | Spartan-6 LX | — |
| Logic Cells | 24,051 cells | — |
| Configurable Logic Blocks | 1,879 CLBs | 1,879 CLBs |
| Adaptive Logic Modules | 3,758 ALMs | 3,758 ALMs |
| Embedded Memory | 936 kbit | 936 kbit |
| User I/O | 186 I/O | — |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | -3 | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Encapsulado | 256-LBGA, 17 x 17 mm | 256-pin FTBGA, 17 x 17 mm, 1 mm pitch |
| Package Pitch | [DATA_NEEDED: package ball pitch] | — |
| Temperatura de funcionamiento | 0°C to 85°C | — |
| Termination | Lead-free | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | [DATA_NEEDED: AEC-Q100 qualification] |
| Logic Elements | — | 24,051 cells |
| Input/Output Count | — | 186 I/O |
| Core Voltage | — | 1.2 V |
| Performance Figure | — | 667 MHz |
| Terminal Count | — | 256 balls |
| Tipo de montaje | — | Surface mount |
| Package Shape | — | Square |
| Temperature Grading | — | Other |
| Lead-Free Status | — | Lead free |
| Unit Price | — | $24.3384 as of 2026-10-28 |