10AS048K4F35I3SG - Arria 10 SX 480K SoC FPGA, 1.5 GHz, FC1152 | Altera
Référence : 10AS048K4F35I3SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4850 | $4 850,00 |
| 10 | $4650 | $46 500,00 |
| 100 | $4295 | $429 500,00 |
| 500 | $3995 | $1 997 500,00 |
| 1 000 | $3690 | $3 690 000,00 |
10AS048K4F35I3SG Présentation
A System-on-Chip (SoC) FPGA is a programmable logic device that combines a general-purpose microprocessor subsystem with reconfigurable FPGA fabric on a single die. The Cortex-A9 MPCore subsystem runs an operating system (typically Linux or a real-time OS) and manages peripherals, while the FPGA fabric accelerates parallel DSP, packet processing, or custom I/O protocols. SoC FPGAs sit between microcontrollers and ASICs in the hardware hierarchy: more flexible than ASICs, more deterministic than software-only CPUs. Compared with discrete CPU-plus-FPGA pairings, an SoC FPGA eliminates board-to-board interconnect latency, reducing BOM cost and PCB area in wireless, industrial, and medical imaging designs.
Key features include 480K LEs (Arria 10 SX 480 device class), dual 1.5 GHz Cortex-A9 MPCore cores with CoreSight debug and trace, hardened memory controllers, multi-gigabit transceivers, on-chip DSP blocks, and partial reconfiguration support. The 1152-ball FCBGA package provides dense I/O for high-speed parallel interfaces and multiple memory ports.
Architecturally, the device uses TSMC 20 nm SoC process with separate power domains for the HPS (Hard Processor System) and FPGA fabric, allowing each domain to be power-gated independently. The 0.9 V core, hardened L1/L2 caches, NEON media engines, and tight coupling RAM make it well suited to deterministic signal-processing pipelines that span software and hardware.
Typical applications include medical imaging (ultrasound beamforming, endoscopy), wireless baseband processing, industrial motor control, and broadcast video processing. Designers select this device when a high-performance embedded processor must share a memory space with hardware-accelerated DSP at low latency.
When designing with the 10AS048K4F35I3SG, ensure the PCB has a sufficient via-in-pad escape pattern under the FCBGA and a minimum 6-layer stack-up with continuous GND planes for transceiver signal integrity. Thermal management typically requires a heatsink because the FCBGA has a junction-to-ambient resistance in the 4-8 C/W range with forced air.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour 10AS048K4F35I3SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS048K4F35I3SG (même facteur de forme et même empreinte) — différant par Package, Mounting Type, Family, Logic Elements, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS048K4F35I3LG
✅ Remplacement direct✓ En stock
$2620 / unité
Voir la fiche technique →10AS048K4F35E3SG
✅ Remplacement direct✓ En stock
$2890 / unité
Voir la fiche technique →10AS048K4F35E3LG
✅ Remplacement direct✓ En stock
$3975 / unité
Voir la fiche technique →10AS048K3F35I2SG
✅ Remplacement direct✓ En stock
$1995 / unité
Voir la fiche technique →10AS048K3F35I2LG
✅ Remplacement direct✓ En stock
$3850 / unité
Voir la fiche technique →10AS048K2F35I2SG
✅ Remplacement direct✓ En stock
$3450 / unité
Voir la fiche technique →10AS048K4F35I3SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 SX SoC FPGA |
| Device Class | 10AS048 (480K Logic Elements) |
| Number of Logic Elements | 480,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 1.5 GHz |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Operating Temperature Grade | Industrial |
| Boîtier | 1152-ball FCBGA, 35x35 mm |
| Number of Terminals | 1152 |
| Terminal Form | Ball (BGA) |
| Type de montage | Surface Mount |
| Application Market | Medical, Industrial, Wireless, Broadcast |
Guide de configuration des broches du 10AS048K4F35I3SG 1152-ball fcbga, 35x35 mm
Configuration des broches du 10AS048K4F35I3SG (boîtier 1152-ball fcbga, 35x35 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS048K4F35I3SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS048K4F35I3SG convient pour 6 applications: Medical Ultrasound Beamforming, Wireless Baseband Processing, Industrial Motor Control and Servo Drives, Broadcast Video Processing and IPTV, Aerospace and Avionics Display Systems, High-Performance Computing and Prototyping.
Medical Ultrasound Beamforming
The 10AS048K4F35I3SG is widely used in premium ultrasound platforms where 480K logic elements and a dual 1.5 GHz Cortex-A9 MPCore HPS are essential for real-time beamforming and image reconstruction. The Cortex-A9 subsystem runs the user interface and post-processing algorithms (B-mode, Doppler, elastography), while the FPGA fabric performs parallel channel-delay calculations and pulse compression across 64-256 transducer channels. The 1.5 GHz HPS provides ample headroom for patient data management and DICOM streaming, while hardened memory controllers interface to DDR3/4 channels. Industrial temperature grade supports hospital thermal envelopes. The 1152-ball FCBGA F35 package allows dense signal routing needed for high-channel-count transducers.
Recommandé
Wireless Baseband Processing
The 10AS048K4F35I3SG delivers 480K logic elements and integrated multi-gigabit transceivers, making it a strong fit for 4G/5G small-cell and remote-radio-unit (RRU) baseband processing. The FPGA fabric implements FFT/iFFT, channel coding (LDPC, Turbo), and crest-factor-reduction DSP blocks at line rate, while the Cortex-A9 MPCore at 1.5 GHz runs the L2/L3 stack, scheduling, and OAM telemetry. Multi-gigabit transceivers interface directly to SFP+ optical links or backhaul Ethernet, eliminating external SERDES chips. The 20 nm process yields lower dynamic power than 28 nm peers, critical for thermally constrained radio head enclosures.
Recommandé
Industrial Motor Control and Servo Drives
Precision servo drives and multi-axis motion controllers use the 10AS048K4F35I3SG to combine deterministic FPGA-based PWM generation, encoder feedback decoding, and a Cortex-A9 HPS running the motion-control loop. The 480K logic elements allow multi-axis FOC (field-oriented control) for robotics, CNC machines, and 3D printers, while the 1.5 GHz Cortex-A9 core runs Linux and EtherCAT master stacks for network synchronization. Industrial temperature grade (-40 C to +100 C) handles factory floor thermal stress, and the hardened memory controller supports deterministic execution by minimizing memory jitter. Tight coupling RAM in the HPS enables sub-microsecond interrupt response for safety-rated drives.
Recommandé
Broadcast Video Processing and IPTV
Broadcast studios and IPTV head-ends use the 10AS048K4F35I3SG for real-time 4K video processing, codec transcoding, and HDR/SDR adaptation. The 480K LEs accelerate deinterlacing, scaling, and frame-rate conversion on parallel streams, while the Cortex-A9 MPCore runs the application stack (streaming protocols, conditional access, ST 2110 handling). Hardened 10 Gbps transceivers feed SDI-over-IP or SMPTE ST 2110 network interfaces. The 1.5 GHz CPU headroom allows WebRTC, HLS, and secure boot alongside the FPGA pipelines. The 35x35 mm FCBGA keeps the design compact for rack-mount broadcast equipment.
Recommandé
Aerospace and Avionics Display Systems
Avionics displays, flight-management systems, and military radar processors leverage the 10AS048K4F35I3SG for safety-critical real-time graphics, sensor fusion, and DSP pipelines. The dual Cortex-A9 MPCore supports partitioned avionics software (ARINC 653, VxWorks 653), while the FPGA fabric drives multi-head ARINC 818 video outputs and accelerates radar FFT chains. 480K logic elements fit complex FFT-based SAR (synthetic-aperture radar) processing without external ASICs. The industrial temperature grade and the ability to run lockstep on the HPS support DO-178C/DO-254 design assurance objectives in certified avionics LRUs.
Recommandé
High-Performance Computing and Prototyping
ASIC prototyping platforms and hardware emulators use the 10AS048K4F35I3SG to partition large SoC designs into multiple FPGAs with deterministic partitioning. 480K logic elements per chip allow 8-10 million ASIC gates to be mapped across a multi-FPGA farm, while the Cortex-A9 MPCore manages testbench stimulus and coverage monitoring. Multi-gigabit transceivers feed high-speed serial links between FPGA cards at 6-10 Gbps, enabling realistic at-speed validation of PCIe Gen3, DDR3/4, USB 3.0, and SerDes IP. HPS-driven host control simplifies integration with EDA flow tools.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS048K4F35I3SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS048K4F35I3LG | 10AS048K4F35E3SG | 10AS048K4F35E3LG | 10AS048K3F35I2SG | 10AS048K2F35I2SG |
|---|---|---|---|---|---|---|
| Package | FCBGA-1152 (F35, 35x35 mm) | FCBGA-1152 (F35, 35x35 mm) - same | FCBGA-1152 (F35, 35x35 mm) - same | FCBGA-1152 (F35, 35x35 mm) - same | FCBGA-1152 (F35, 35x35 mm) - same | FCBGA-1152 (F35, 35x35 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Temperature Grade | Industrial (I3) | Industrial | Extended (E3) | Extended (E3) | Industrial | Industrial |
| Speed Grade | K4 | K4 | K4 | K4 | K3 (slower) | K2 (slowest) |
| Hard Processor System | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Packaging | Tray | Tray | Tray | Tray | Tray | Tray |
Principaux différenciateurs
- Highest speed grade (K4) in the F35 footprint family (vs 10AS048K3F35I2SG / 10AS048K2F35I2SG)
- Industrial temperature grade screening (vs 10AS048K4F35E3SG (Extended temp))
- Tray packaging for low-volume production (vs 10AS048K4F35I3LG)
Notes de conception
The 1152-ball FCBGA (35x35 mm) package typically has theta_JA in the 4-8 C/W range with 1-2 m/s forced air, and theta_JC around 0.3-0.6 C/W depending on heatsink attachment. Estimated: at 30 W total power dissipation (typical SoC FPGA operating in medical imaging), the junction temperature rise above ambient with a 0.5 m/s airflow is roughly 30/6 = 5 C per watt above 25 C ambient. A heatsink with thermal interface material is strongly recommended for sustained workloads; thermal vias must be placed under the BGA thermal pad array.
Layout of the 1152-ball FCBGA F35 package requires via-in-pad (VIP) technology with 0.2-0.3 mm laser-drilled microvias, stacked on 0.4-0.5 mm pitch through-vias for inner-layer fan-out. Use a minimum 6-layer stack-up with continuous GND planes under the BGA and a dedicated power plane for the 0.9 V core rail. Series decoupling capacitors should be placed on the bottom side directly beneath the balls, with bulk capacitors distributed within 50 mm. Maintain 100 ohm differential impedance for transceiver pairs (12.5 Gbps+) with length matching to within 150 mil.
Do not exceed the maximum HPS IO bank voltage (typically 2.5 V or 3.3 V depending on bank configuration); verify bank assignments against the Quartus Prime pin planner before tape-out. The MSEL pins must be pulled to the correct boot configuration for the boot source (QSPI, SD card, NAND). For industrial temp applications, ensure the JTAG chain termination matches the 10AS048 I/O standards. Always use the Arria 10 transceiver toolkit for signal-integrity verification of multi-gigabit links before production.
Separate HPS and FPGA power domains when planning the PCB power tree - the HPS requires a stable 0.9 V core with sequencing, while FPGA fabric power typically uses 0.9 V core plus 1.1 V/1.8 V/2.5 V/3.3 V IO bank supplies. Place a ferrite bead between shared supplies if HPS and FPGA are powered from the same rail. Use staggered power-on with PG (power-good) signals to meet HPS boot sequencing requirements. Estimate decoupling: at least 4 x 22 uF bulk + 40 x 100 nF ceramics within the BGA region, plus 10 nF for high-frequency bypass.
Informations de conformité
Compliance data (RoHS/REACH/lead-free) not provided in verified web data; marked [DATA_NEEDED]. AEC-Q100 not applicable - this is a SoC FPGA for medical/industrial, not automotive qualification scope.
