10AS048K4F35I3SG - Arria 10 SX 480K SoC FPGA, 1.5 GHz, FC1152 | Altera
N.º de pieza: 10AS048K4F35I3SG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4850 | $4.850,00 |
| 10 | $4650 | $46.500,00 |
| 100 | $4295 | $429.500,00 |
| 500 | $3995 | $1.997.500,00 |
| 1.000 | $3690 | $3.690.000,00 |
10AS048K4F35I3SG Descripción general
A System-on-Chip (SoC) FPGA is a programmable logic device that combines a general-purpose microprocessor subsystem with reconfigurable FPGA fabric on a single die. The Cortex-A9 MPCore subsystem runs an operating system (typically Linux or a real-time OS) and manages peripherals, while the FPGA fabric accelerates parallel DSP, packet processing, or custom I/O protocols. SoC FPGAs sit between microcontrollers and ASICs in the hardware hierarchy: more flexible than ASICs, more deterministic than software-only CPUs. Compared with discrete CPU-plus-FPGA pairings, an SoC FPGA eliminates board-to-board interconnect latency, reducing BOM cost and PCB area in wireless, industrial, and medical imaging designs.
Key features include 480K LEs (Arria 10 SX 480 device class), dual 1.5 GHz Cortex-A9 MPCore cores with CoreSight debug and trace, hardened memory controllers, multi-gigabit transceivers, on-chip DSP blocks, and partial reconfiguration support. The 1152-ball FCBGA package provides dense I/O for high-speed parallel interfaces and multiple memory ports.
Architecturally, the device uses TSMC 20 nm SoC process with separate power domains for the HPS (Hard Processor System) and FPGA fabric, allowing each domain to be power-gated independently. The 0.9 V core, hardened L1/L2 caches, NEON media engines, and tight coupling RAM make it well suited to deterministic signal-processing pipelines that span software and hardware.
Typical applications include medical imaging (ultrasound beamforming, endoscopy), wireless baseband processing, industrial motor control, and broadcast video processing. Designers select this device when a high-performance embedded processor must share a memory space with hardware-accelerated DSP at low latency.
When designing with the 10AS048K4F35I3SG, ensure the PCB has a sufficient via-in-pad escape pattern under the FCBGA and a minimum 6-layer stack-up with continuous GND planes for transceiver signal integrity. Thermal management typically requires a heatsink because the FCBGA has a junction-to-ambient resistance in the 4-8 C/W range with forced air.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para 10AS048K4F35I3SG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AS048K4F35I3SG (mismo factor de forma y huella) — difiere en Package, Mounting Type, Family, Logic Elements, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AS048K4F35I3LG
✅ Sustitución directa✓ En stock
$2620 / unidad
Ver hoja de datos →10AS048K4F35E3SG
✅ Sustitución directa✓ En stock
$2890 / unidad
Ver hoja de datos →10AS048K4F35E3LG
✅ Sustitución directa✓ En stock
$3975 / unidad
Ver hoja de datos →10AS048K3F35I2SG
✅ Sustitución directa✓ En stock
$1995 / unidad
Ver hoja de datos →10AS048K3F35I2LG
✅ Sustitución directa✓ En stock
$3850 / unidad
Ver hoja de datos →10AS048K2F35I2SG
✅ Sustitución directa✓ En stock
$3450 / unidad
Ver hoja de datos →10AS048K4F35I3SG Valores máximos y características eléctricas
| Family | Arria 10 SX SoC FPGA |
| Device Class | 10AS048 (480K Logic Elements) |
| Number of Logic Elements | 480,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 1.5 GHz |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Operating Temperature Grade | Industrial |
| Encapsulado | 1152-ball FCBGA, 35x35 mm |
| Number of Terminals | 1152 |
| Terminal Form | Ball (BGA) |
| Tipo de montaje | Surface Mount |
| Application Market | Medical, Industrial, Wireless, Broadcast |
Guía de configuración de pines de 10AS048K4F35I3SG 1152-ball fcbga, 35x35 mm
Configuración de pines para 10AS048K4F35I3SG (encapsulado 1152-ball fcbga, 35x35 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AS048K4F35I3SG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AS048K4F35I3SG es adecuado para 6 aplicacións: Medical Ultrasound Beamforming, Wireless Baseband Processing, Industrial Motor Control and Servo Drives, Broadcast Video Processing and IPTV, Aerospace and Avionics Display Systems, High-Performance Computing and Prototyping.
Medical Ultrasound Beamforming
The 10AS048K4F35I3SG is widely used in premium ultrasound platforms where 480K logic elements and a dual 1.5 GHz Cortex-A9 MPCore HPS are essential for real-time beamforming and image reconstruction. The Cortex-A9 subsystem runs the user interface and post-processing algorithms (B-mode, Doppler, elastography), while the FPGA fabric performs parallel channel-delay calculations and pulse compression across 64-256 transducer channels. The 1.5 GHz HPS provides ample headroom for patient data management and DICOM streaming, while hardened memory controllers interface to DDR3/4 channels. Industrial temperature grade supports hospital thermal envelopes. The 1152-ball FCBGA F35 package allows dense signal routing needed for high-channel-count transducers.
Recomendado
Wireless Baseband Processing
The 10AS048K4F35I3SG delivers 480K logic elements and integrated multi-gigabit transceivers, making it a strong fit for 4G/5G small-cell and remote-radio-unit (RRU) baseband processing. The FPGA fabric implements FFT/iFFT, channel coding (LDPC, Turbo), and crest-factor-reduction DSP blocks at line rate, while the Cortex-A9 MPCore at 1.5 GHz runs the L2/L3 stack, scheduling, and OAM telemetry. Multi-gigabit transceivers interface directly to SFP+ optical links or backhaul Ethernet, eliminating external SERDES chips. The 20 nm process yields lower dynamic power than 28 nm peers, critical for thermally constrained radio head enclosures.
Recomendado
Industrial Motor Control and Servo Drives
Precision servo drives and multi-axis motion controllers use the 10AS048K4F35I3SG to combine deterministic FPGA-based PWM generation, encoder feedback decoding, and a Cortex-A9 HPS running the motion-control loop. The 480K logic elements allow multi-axis FOC (field-oriented control) for robotics, CNC machines, and 3D printers, while the 1.5 GHz Cortex-A9 core runs Linux and EtherCAT master stacks for network synchronization. Industrial temperature grade (-40 C to +100 C) handles factory floor thermal stress, and the hardened memory controller supports deterministic execution by minimizing memory jitter. Tight coupling RAM in the HPS enables sub-microsecond interrupt response for safety-rated drives.
Recomendado
Broadcast Video Processing and IPTV
Broadcast studios and IPTV head-ends use the 10AS048K4F35I3SG for real-time 4K video processing, codec transcoding, and HDR/SDR adaptation. The 480K LEs accelerate deinterlacing, scaling, and frame-rate conversion on parallel streams, while the Cortex-A9 MPCore runs the application stack (streaming protocols, conditional access, ST 2110 handling). Hardened 10 Gbps transceivers feed SDI-over-IP or SMPTE ST 2110 network interfaces. The 1.5 GHz CPU headroom allows WebRTC, HLS, and secure boot alongside the FPGA pipelines. The 35x35 mm FCBGA keeps the design compact for rack-mount broadcast equipment.
Recomendado
Aerospace and Avionics Display Systems
Avionics displays, flight-management systems, and military radar processors leverage the 10AS048K4F35I3SG for safety-critical real-time graphics, sensor fusion, and DSP pipelines. The dual Cortex-A9 MPCore supports partitioned avionics software (ARINC 653, VxWorks 653), while the FPGA fabric drives multi-head ARINC 818 video outputs and accelerates radar FFT chains. 480K logic elements fit complex FFT-based SAR (synthetic-aperture radar) processing without external ASICs. The industrial temperature grade and the ability to run lockstep on the HPS support DO-178C/DO-254 design assurance objectives in certified avionics LRUs.
Recomendado
High-Performance Computing and Prototyping
ASIC prototyping platforms and hardware emulators use the 10AS048K4F35I3SG to partition large SoC designs into multiple FPGAs with deterministic partitioning. 480K logic elements per chip allow 8-10 million ASIC gates to be mapped across a multi-FPGA farm, while the Cortex-A9 MPCore manages testbench stimulus and coverage monitoring. Multi-gigabit transceivers feed high-speed serial links between FPGA cards at 6-10 Gbps, enabling realistic at-speed validation of PCIe Gen3, DDR3/4, USB 3.0, and SerDes IP. HPS-driven host control simplifies integration with EDA flow tools.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AS048K4F35I3SG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AS048K4F35I3LG | 10AS048K4F35E3SG | 10AS048K4F35E3LG | 10AS048K3F35I2SG | 10AS048K2F35I2SG |
|---|---|---|---|---|---|---|
| Package | FCBGA-1152 (F35, 35x35 mm) | FCBGA-1152 (F35, 35x35 mm) - same | FCBGA-1152 (F35, 35x35 mm) - same | FCBGA-1152 (F35, 35x35 mm) - same | FCBGA-1152 (F35, 35x35 mm) - same | FCBGA-1152 (F35, 35x35 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Temperature Grade | Industrial (I3) | Industrial | Extended (E3) | Extended (E3) | Industrial | Industrial |
| Speed Grade | K4 | K4 | K4 | K4 | K3 (slower) | K2 (slowest) |
| Hard Processor System | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Packaging | Tray | Tray | Tray | Tray | Tray | Tray |
Diferenciadores clave
- Highest speed grade (K4) in the F35 footprint family (frente a 10AS048K3F35I2SG / 10AS048K2F35I2SG)
- Industrial temperature grade screening (frente a 10AS048K4F35E3SG (Extended temp))
- Tray packaging for low-volume production (frente a 10AS048K4F35I3LG)
Notas de diseño
The 1152-ball FCBGA (35x35 mm) package typically has theta_JA in the 4-8 C/W range with 1-2 m/s forced air, and theta_JC around 0.3-0.6 C/W depending on heatsink attachment. Estimated: at 30 W total power dissipation (typical SoC FPGA operating in medical imaging), the junction temperature rise above ambient with a 0.5 m/s airflow is roughly 30/6 = 5 C per watt above 25 C ambient. A heatsink with thermal interface material is strongly recommended for sustained workloads; thermal vias must be placed under the BGA thermal pad array.
Layout of the 1152-ball FCBGA F35 package requires via-in-pad (VIP) technology with 0.2-0.3 mm laser-drilled microvias, stacked on 0.4-0.5 mm pitch through-vias for inner-layer fan-out. Use a minimum 6-layer stack-up with continuous GND planes under the BGA and a dedicated power plane for the 0.9 V core rail. Series decoupling capacitors should be placed on the bottom side directly beneath the balls, with bulk capacitors distributed within 50 mm. Maintain 100 ohm differential impedance for transceiver pairs (12.5 Gbps+) with length matching to within 150 mil.
Do not exceed the maximum HPS IO bank voltage (typically 2.5 V or 3.3 V depending on bank configuration); verify bank assignments against the Quartus Prime pin planner before tape-out. The MSEL pins must be pulled to the correct boot configuration for the boot source (QSPI, SD card, NAND). For industrial temp applications, ensure the JTAG chain termination matches the 10AS048 I/O standards. Always use the Arria 10 transceiver toolkit for signal-integrity verification of multi-gigabit links before production.
Separate HPS and FPGA power domains when planning the PCB power tree - the HPS requires a stable 0.9 V core with sequencing, while FPGA fabric power typically uses 0.9 V core plus 1.1 V/1.8 V/2.5 V/3.3 V IO bank supplies. Place a ferrite bead between shared supplies if HPS and FPGA are powered from the same rail. Use staggered power-on with PG (power-good) signals to meet HPS boot sequencing requirements. Estimate decoupling: at least 4 x 22 uF bulk + 40 x 100 nF ceramics within the BGA region, plus 10 nF for high-frequency bypass.
Información de cumplimiento
Compliance data (RoHS/REACH/lead-free) not provided in verified web data; marked [DATA_NEEDED]. AEC-Q100 not applicable - this is a SoC FPGA for medical/industrial, not automotive qualification scope.
