10AX090R4F40E3LG - Arria 10 GX FPGA 900K LE | Intel
Référence : 10AX090R4F40E3LG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5810.41 | $5 810,41 |
| 10 | $5519.89 | $55 198,90 |
| 100 | $5113.16 | $511 316,00 |
| 500 | $4764.54 | $2 382 270,00 |
| 1 000 | $4415.91 | $4 415 910,00 |
10AX090R4F40E3LG Présentation
What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit in the hierarchy between ASICs (high NRE, high volume) and microcontrollers (fixed architecture, sequential execution), offering hardware-level parallelism with software-like reconfigurability. The Arria 10 GX family specifically adds hardened floating-point DSP blocks and up to 28.05 Gbps transceivers, placing it in the mid-range transceiver tier of Intel's FPGA portfolio.
Key specifications of the 10AX090R4F40E3LG include 900K logic elements, 59,234,304 embedded memory bits, 342 user I/O pins, and 0.9V core voltage operation. The R4 suffix denotes transceiver speed grade and routing hierarchy, F40 indicates the 1517-pin FCBGA package, E3 represents the enhanced speed grade (mid-tier), and LG denotes lead-free RoHS-compliant packaging.
Architecturally, the Arria 10 GX implements a 20-nm Tri-Gate process with adaptive logic modules (ALMs), 20 Kbit MLAB memory blocks, and variable-precision DSP blocks supporting IEEE 754 single-precision floating point. The hardened floating-point pipeline operates at up to 1.5 TFLOPs for DSP-bound designs, while the partial reconfiguration region controller supports in-system logic swaps without full bitstream reload.
Typical applications include 4K/8K video broadcast infrastructure, 100G/400G Ethernet line cards, radar signal processing for defense systems, medical imaging acceleration, and ASIC prototyping. The transceiver capability also suits software-defined radio (SDR) and 5G fronthaul test equipment.
When designing with the Arria 10 GX 10AX090R4F40E3LG, ensure the PCB uses a 1.0 mm pitch BGA land pattern with microvia stack-ups and matched-length routing for transceiver lanes. Thermal management requires 4-6 layer copper pours and forced airflow due to the 1517-ball package's high power density. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing tiers, drop-in alternatives from the Arria 10 family, and practical design notes not consolidated in the Intel datasheet. Pin-compatible same-package variants are curated from the Site MPN list for internal link integrity.
Alternatives de remplacement direct pour 10AX090R4F40E3LG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX090R4F40E3LG (même facteur de forme et même empreinte) — différant par Package, Transceivers, DSP Blocks, Speed Grade, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX090R4F40E2LG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AX090R4F40E3SG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AX090R4F40I2LG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AX090R3F40E2LG
✅ Remplacement direct✓ En stock
$5750 / unité
Voir la fiche technique →10AX090R4F40E2SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10AX090R2F40E2LG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2920 / unité
Voir la fiche technique →10AX090R4F40E3LG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Logic Elements | 900000 |
| Embedded Memory Bits | 59234304 |
| User I/O Pins | 342 |
| Core Voltage | 0.9 V |
| Process Technology | 20 nm |
| Boîtier | 1517-ball FCBGA (F40) |
| Speed Grade | E3 (enhanced mid-grade) |
| Statut RoHS | Compliant (LG suffix) |
| Type de montage | Surface Mount (BGA) |
| Lead-Free | Yes |
| Configuration Method | SRAM-based, volatile |
| Design Tool | Intel Quartus Prime |
Guide de configuration des broches du 10AX090R4F40E3LG 1517-ball fcbga (f40)
Configuration des broches du 10AX090R4F40E3LG (boîtier 1517-ball fcbga (f40)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX090R4F40E3LG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX090R4F40E3LG convient pour 6 applications: 100G/400G Ethernet Line Cards, 4K/8K Video Broadcast Infrastructure, Radar Signal Processing, ASIC Prototyping, Medical Imaging Acceleration, Software-Defined Radio (SDR).
100G/400G Ethernet Line Cards
The 10AX090R4F40E3LG fits 100G Ethernet line card designs where 900K logic elements and 59 Mbit embedded memory implement MAC, framing, and FEC pipelines. The Arria 10 GX transceiver resources support 10G/25G/40G lane aggregation, and the 1517-ball FCBGA provides sufficient I/O for QSFP28 cage interfacing. Engineers place the FPGA between the network processor and PHY, with the 0.9V core minimizing per-port power. For 400G, consider the higher-tier Arria 10 GT SKUs with 28.05 Gbps transceivers instead.
Recommandé
4K/8K Video Broadcast Infrastructure
The 10AX090R4F40E3LG suits 4K/8K broadcast infrastructure where 900K logic elements implement video processing, color space conversion, and HDR pipeline logic. The 59 Mbit embedded memory buffers multi-frame video with sufficient throughput, and the 342 user I/O support HDMI 2.0, SDI, and DisplayPort interfaces. Designers use the DSP blocks for real-time scaling and deinterlacing. The Arria 10 GX variant balances logic density with broadcast-grade I/O flexibility.
Recommandé
Radar Signal Processing
The 10AX090R4F40E3LG is ideal for radar signal processing systems where 900K logic elements implement FFT pipelines, beamforming, and pulse compression. The 59 Mbit embedded memory supports large FFT windows for SAR and phased-array radar, and the Arria 10 GX variable-precision DSP blocks handle IEEE 754 single-precision floating point. Designers leverage hardened floating-point for 1.5 TFLOPs throughput. The 1517-ball FCBGA also fits defense system thermal envelopes with proper airflow management.
Recommandé
ASIC Prototyping
The 10AX090R4F40E3LG supports ASIC prototyping where 900K logic elements provide capacity for next-generation ASIC designs in the 5M-15M gate range when mapped to FPGA logic. The Arria 10 GX partial reconfiguration capability enables rapid design iteration, and the 20nm process offers realistic timing characteristics for pre-silicon validation. Engineers use the device to validate ASIC RTL before tape-out, reducing design risk. The 1517-ball FCBGA provides sufficient I/O for ASIC testbench interfacing.
Recommandé
Medical Imaging Acceleration
The 10AX090R4F40E3LG accelerates medical imaging algorithms like CT reconstruction, MRI FFT, and ultrasound beamforming where parallel DSP throughput is critical. The 900K logic elements and hardened floating-point DSP blocks deliver 1.5 TFLOPs, sufficient for real-time image reconstruction at diagnostic frame rates. The 59 Mbit embedded memory holds image slices and filter coefficients. Designers pair the FPGA with high-speed ADC front-ends for direct RF sampling.
Recommandé
Software-Defined Radio (SDR)
The 10AX090R4F40E3LG supports SDR platforms where 900K logic elements implement multi-standard waveform processing across LTE, 5G NR, and tactical radio protocols. The Arria 10 GX transceivers handle wideband RF sampling up to 17.4 Gbps, and the DSP blocks perform channelization, modulation, and demodulation in real time. The 59 Mbit embedded memory buffers IQ samples across multiple channels. Designers use the partial reconfiguration feature to swap waveforms dynamically.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX090R4F40E3LG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX090R4F40E2LG | 10AX090R4F40E3SG | 10AX090R4F40I2LG | 10AX090R3F40E2LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA - same | 1517-ball FCBGA - same | 1517-ball FCBGA - same | 1517-ball FCBGA - same |
| Logic Elements | 900000 | 900000 | 900000 | 900000 | 900000 |
| Speed Grade | E3 | E2 (slower) | E3 (same) | I2 (faster) | E2 (slower) |
| Transceiver Tier | R4 (mid-density) | R4 (same) | R4 (same) | R4 (same) | R3 (lower-density) |
| Embedded Memory Bits | 59234304 | 59234304 | 59234304 | 59234304 | 59234304 |
| RoHS Compliance | Compliant (LG) | Compliant (LG) | Compliant + Halogen-free (SG) | Compliant (LG) | Compliant (LG) |
Principaux différenciateurs
- Mid-tier speed grade balance (vs 10AX090R4F40I2LG)
- Lead-free RoHS compliance (vs 10AX090R4F40E3SG)
- Full R4 transceiver density (vs 10AX090R3F40E2LG)
Notes de conception
Estimated: The 1517-ball FCBGA package concentrates high power density at ~25-35W typical for the 10AX090R4F40E3LG. Design 4-6 layer PCB with dedicated GND/power planes and a minimum 25x25mm copper pour on top/bottom layers. Forced airflow of 200-400 LFM is typically required. Reference Intel AN 754 (PCB layout) for thermal via patterns. Without proper cooling, junction temperature will exceed the 100C enhanced-grade limit within seconds of full operation.
Use 1.0 mm ball pitch BGA land pattern with non-solder-mask-defined (NSMD) pads for improved thermal cycling reliability. Microvia-in-pad construction is mandatory for inner-row signals - through-via stubs exceed the 25 ps budget for transceiver signal integrity. Reference Intel Arria 10 GX device family pin connection guidelines for decoupling capacitor placement: 0402 X7R ceramics at every transceiver power pin.
Transceiver lanes on Arria 10 GX operate up to 17.4 Gbps. Route differential pairs with 100 ohm differential impedance, intra-pair skew under 1 ps, and length-matching within 0.5 mm. Reference Intel AN 525 for transceiver channel simulation methodology. Use HyperLynx or ANSYS SIwave for pre-layout channel extraction. Avoid via transitions in transceiver lanes - place via transitions only at the breakout region.
Place the configuration device (EPCQ-L or compatible) within 4 inches of the FPGA DATA, DCLK, and nCS pins. Route configuration signals with controlled impedance and avoid routing parallel to noisy switching signals. Decouple each FPGA power rail with a 100uF bulk + 10uF + 1uF + 0.1uF capacitor network. Reference Intel Arria 10 GX pin connection guidelines for complete power tree design.
Do not assume speed grades are interchangeable: E2 vs E3 vs I2 reflect different transistor process corners that affect timing margin. Verify timing closure in Quartus Prime after speed grade substitution. The R4 vs R3 suffix denotes different transceiver densities - R4 has more transceiver channels active. Ensure your design uses Quartus Prime 18.1 or later for full Arria 10 GX support.
Informations de conformité
RoHS compliant per LG suffix designation. Lead-free per LG suffix. Not halogen-free - choose SG suffix variant for halogen-free compliance. AEC-Q100 not applicable - FPGAs are not AEC-Q100 qualified unless specified.