10AX090R2F40I1SG - Arria 10 GX FPGA 900K LE FCBGA-1517 | Intel
Référence : 10AX090R2F40I1SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4850 | $4 850,00 |
| 10 | $4680 | $46 800,00 |
| 100 | $4380 | $438 000,00 |
| 500 | $4050 | $2 025 000,00 |
| 1 000 | $3720 | $3 720 000,00 |
10AX090R2F40I1SG Présentation
A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing programmable logic blocks, interconnect, and dedicated silicon resources such as DSP slices, block RAM (BRAM), and high-speed serial transceivers. FPGAs belong to the programmable logic device (PLD) hierarchy, alongside CPLDs; they sit between general-purpose microcontrollers and fixed-function ASICs, offering hardware-level parallelism without the NRE cost of a custom ASIC. The Arria 10 family specifically targets mid-range applications that need more transceiver bandwidth and DSP throughput than Cyclone parts but do not require the highest-end Stratix logic density.
The 10AX090R2F40I1SG delivers key features including up to 24.33 Gbps backplane-capable transceivers, variable-precision DSP with hardened IEEE 754 single-precision floating-point support, on-chip multi-protocol memory controllers (DDR4, DDR3, LPDDR3, QDR IV), and a 1.5 GHz fabric clock. The package designation F40 indicates the 40 mm × 40 mm FCBGA footprint; the 'I' suffix denotes industrial temperature grade (-40 °C to +100 °C); the speed grade '2' positions it as a mid-tier performance option versus grades 1 and 3.
Architecturally, the device uses TSMC's 20 nm process and integrates a hard Memory Controller subsystem, partial reconfiguration support, and the secure configuration engine (AES-256, SHA-256 bitstream authentication). This makes it well suited for systems requiring remote update with cryptographic verification.
Typical applications include 100G/400G optical transport network line cards, military radar baseband processing, ASIC prototyping for SoC verification, broadcast video processing (4K/UHD pipelines), and PCI Express Gen3 accelerator cards. Its combination of transceiver count, DSP density, and 20 nm power efficiency targets high-bandwidth signal processing where software-defined flexibility is essential.
A primary design consideration is PCB routing complexity: the 1517-ball FCBGA with 1.0 mm pitch requires sequential lamination, microvia fabrication, and at least 8 PCB layers with back-drilling on high-speed serial lines. Thermal design is also critical - the industrial-grade junction range is 100 °C, so designers must budget the 0.8 m/s minimum airflow across the heatsink.
This page synthesizes distributor pricing tiers, same-family drop-in alternatives sourced from the Site MPN catalog, and practical PCB/thermal design notes not collected in the manufacturer datasheet.
Alternatives de remplacement direct pour 10AX090R2F40I1SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX090R2F40I1SG (même facteur de forme et même empreinte) — différant par Package, Mounting Type, DSP Blocks, Logic Elements, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX090R2F40I2SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6290.55 / unité
Voir la fiche technique →10AX090R2F40E2SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4750 / unité
Voir la fiche technique →10AX090R1F40I1SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3783 / unité
Voir la fiche technique →10AX090R2F40E1SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5750 / unité
Voir la fiche technique →10AX090R2F40E2LG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2920 / unité
Voir la fiche technique →10AX090R2F40I1SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory Bits | 59,234,304 |
| User I/Os | 342 |
| Process Technology | 20 nm TSMC |
| Boîtier | 1517-ball FCBGA (F40) |
| Package Size | 40 mm × 40 mm |
| Ball Pitch | 1.0 mm |
| Temperature Grade | Industrial (-40 °C to +100 °C) |
| Speed Grade | 2 (mid-tier) |
| Configuration | AES-256 / SHA-256 encrypted bitstream support |
| Memory Controller Hard IP | DDR4, DDR3, LPDDR3, QDR IV |
| PCIe Hard IP | PCI Express Gen3 x8 |
| Type de montage | Surface Mount (BGA, reflow) |
| Niveau MSL | MSL3 (JEDEC J-STD-020) |
| Statut RoHS | Compliant |
Guide de configuration des broches du 10AX090R2F40I1SG 40 mm × 40 mm
Configuration des broches du 10AX090R2F40I1SG (boîtier 40 mm × 40 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX090R2F40I1SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX090R2F40I1SG convient pour 6 applications: 100G/400G Optical Transport Network Line Card, Military / Aerospace Radar Baseband Processing, ASIC Prototyping and SoC Verification, Broadcast 4K/UHD Video Processing Pipeline, PCI Express Gen3 Accelerator Card, Industrial Test & Measurement Instrumentation.
100G/400G Optical Transport Network Line Card
The 10AX090R2F40I1SG fits OTU4 line-card designs because it integrates up to 24.33 Gbps transceivers capable of 4×28 Gbps OTU4 or 10×10 Gbps OTU2 fan-out without external mux devices. The 900 K logic elements absorb the FEC (GFEC, EFEC, oFEC), framer, and mapping logic, while the variable-precision DSP blocks handle PRBS generation and clock-data recovery post-processing. Placed on a backplane with QSFP28 cages, the FPGA interfaces to coherent DSP ASICs through the on-chip transceiver array. The industrial temperature grade ensures compliance with carrier-grade central-office ambient ranges (-5 to +55 C). One 10AX090 line card typically replaces two earlier-generation FPGAs, reducing BOM cost and power per gigabit.
Recommandé
Military / Aerospace Radar Baseband Processing
Radar baseband and beamforming payloads benefit from the 10AX090R2F40I1SG's hard floating-point DSP blocks (IEEE 754 single precision) and 59 Mb of embedded block RAM. The 900K logic elements map multi-channel FFT / pulse-compression pipelines at 1.5 GHz fabric clock, while 24 Gbps transceivers stream digitized antenna data from ADC arrays. The industrial -40 to +100 C temperature envelope covers ground-mobile and shipboard enclosures without additional thermal screening. Designers typically pair this FPGA with a Xilinx Kintex or dedicated radar ASIC for higher-tier systems, but the Arria 10 stands alone for mid-tier surveillance radar. SEC/SHA bitstream authentication supports anti-tamper requirements on deployed systems.
Recommandé
ASIC Prototyping and SoC Verification
For ASIC prototyping the 10AX090R2F40I1SG provides 900 K logic elements with partial reconfiguration, letting design teams emulate large SoCs across multiple FPGAs. The 59 Mb of BRAM maps to embedded SRAM and cache hierarchies in the target ASIC, while hard memory controllers bring up DDR4 PHYs at full speed. Quartus Prime's TimeQuest timing analysis provides accurate slack margins for ASIC sign-off correlation. The industrial temp grade allows bring-up in thermally unconditioned lab environments. Designers commonly co-deploy two to four Arria 10 devices via the LVDS tiling channels to map multi-million-gate ASICs.
Recommandé
Broadcast 4K/UHD Video Processing Pipeline
The 10AX090R2F40I1SG powers 4K/UHD broadcast frame synchronizers, color-space converters, and IP gateway pipelines. Its DSP blocks handle HDR/WCG color-volume transforms and motion-adaptive deinterlacing in real time, while the BRAM acts as 4K frame buffers without external SDRAM. The hard PCIe Gen3 IP enables direct host attachment on video-server motherboards. The industrial temperature range covers the fanless 1U chassis commonly deployed in broadcast playout centers. Compared with merchant ASSP video bridges, the FPGA delivers reconfigurable support for emerging codecs (NDI, SMPTE ST 2110) over the device lifetime.
Recommandé
PCI Express Gen3 Accelerator Card
Edge and server accelerator cards use the 10AX090R2F40I1SG as a co-processor paired with a host CPU over PCIe Gen3 x8. The hard PCIe IP sustains 8 GT/s per lane with 128-bit completion TLP support, while the FPGA fabric hosts the customer's machine-learning, database, or signal-processing kernel. The 24.33 Gbps transceivers can expose multi-100 GbE or NVMe-of-Fabric side channels, allowing the card to act as a SmartNIC. The industrial temp grade supports dense blade-server inlets. Designers use the Quartus Prime PCIe HIP example design to bring up a working Gen3 endpoint in days rather than weeks.
Recommandé
Industrial Test & Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and radar testers use the 10AX090R2F40I1SG as the central timing and DSP engine. Its 24 Gbps transceivers acquire 50+ GHz-class ADC output data, while the variable-precision DSP executes channel equalization, FFT, and statistical measurements on streaming samples. The 59 Mb of BRAM holds deep acquisition memory for transient capture, reducing the need for external QDR. The industrial -40 to +100 C envelope covers test-equipment rack environments from outdoor cell-site analyzers to climate-controlled ATE floors. Field engineers benefit from Quartus Prime's partial reconfiguration for on-site firmware updates without instrument recalibration.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX090R2F40I1SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX090R2F40I2SG | 10AX090R2F40E2SG | 10AX090R1F40I1SG | 10AX090R2F40E1SG | 10AX090R2F40E2LG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FCBGA-1517 (F40, 40x40 mm) | FCBGA-1517 (F40) - same | FCBGA-1517 (F40) - same | FCBGA-1517 (F40) - same | FCBGA-1517 (F40) - same | FCBGA-1517 (F40) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
| Speed Grade | 2 (mid-tier) | 2 | 2 | 1 (lower Fmax) | 1 (lower Fmax) | 2 |
| Temperature Grade | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Extended commercial (0 to +100 C) | Industrial (-40 to +100 C) | Extended commercial (0 to +100 C) | Extended commercial (0 to +100 C) |
| User I/Os | 342 | 342 | 342 | 342 | 342 | 342 |
| Process Technology | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC |
Principaux différenciateurs
- Pin-to-pin speed grade flexibility (vs 10AX090R1F40I1SG)
- Industrial temperature qualification (vs 10AX090R2F40E2SG)
- Identical F40 footprint across the alternative set (vs 10AX090N3F40I2SG)
Notes de conception
The 1517-ball F40 FCBGA with 1.0 mm ball pitch requires an 8+ layer PCB with sequential lamination and laser-drilled microvias (typically 0.1 mm pad diameter) to escape the inner rows of the BGA. Pair the FCBGA land pattern with 1 oz copper outer layers and 0.5 oz inner layers; route 100 ohm differential pairs on the top microvia layer for the high-speed transceivers. Back-drill high-speed serial vias to minimize stub resonance. Plan for a 50 mm × 50 mm keep-out zone around the device for the heatsink and 0.8 m/s airflow.
Estimated: at a typical Arria 10 power envelope of 25 W and a junction-to-ambient theta_JA of 1.2 C/W with a 0.8 m/s heatsink, the junction rises roughly 30 C above the inlet air. Industrial grade (-40 to +100 C junction) requires that the inlet air stay below 70 C at full load. Use a TIM (thermal interface material) with conductivity >= 3 W/m-K between the package lid and the heatsink. Verify thermal performance with the Intel Arria 10 PowerPlay early-power estimator before committing the PCB layout.
Do not confuse the F40 package with the F34 or F45 packages that share the same 10AX090 logic density - the ball map and transceiver count differ between F-codes. Always re-run Quartus Prime I/O assignment analysis when changing the F-code. Configuration mode (Active Serial x4 vs Avalon-ST x32) also varies between F-codes and must be re-validated against the new pin-out file. Finally, the speed-grade digit (R1 vs R2 vs R3) affects static-timing closure; do not assume R1 is interchangeable with R2 without re-fitting.
Keep high-speed serial pairs (transceiver channels) at a 100 ohm differential impedance with intra-pair skew under 1 ps. Place the reference clock source (GXB REFCLK) within 5 mm of the FPGA REFCLK pin and route it as a length-matched 50 ohm microstrip. Group power pins (VCC, VCCP, VCCR, VCCT) with 0.1 uF X7R bypass capacitors placed within 2 mm of each ball. Provide a low-noise LDO for VCCT_GXB and a dedicated ferrite-isolated rail for each transceiver bank.
Informations de conformité
RoHS and REACH compliance verified per Altera (Intel) ordering information page. AEC-Q100 not applicable for an industrial FPGA; consult Altera automotive-grade Arria 10 variants if needed.