10AX090U2F45I2SG - Arria 10 GX FPGA 900K LE FCBGA-1932 | Intel
Référence : 10AX090U2F45I2SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4850 | $4 850,00 |
| 10 | $4520 | $45 200,00 |
| 100 | $4185 | $418 500,00 |
| 500 | $3890 | $1 945 000,00 |
| 1 000 | $3640 | $3 640 000,00 |
10AX090U2F45I2SG Présentation
An FPGA (Field Programmable Gate Array) is a class of programmable logic device that lets designers configure billions of digital logic blocks, on-chip memory, DSP blocks, and high-speed transceivers after manufacture. FPGAs sit at the same hierarchy level as ASICs but offer reconfigurability: they belong to the family of programmable logic -> digital ICs -> integrated circuits -> semiconductors. Arria 10 GX devices in particular target mid-range applications requiring a balance of logic density, transceiver bandwidth, and lower power than high-end Stratix 10 parts.
Key features include 24 backplane-capable transceivers (up to 14.1 Gbps), hard PCIe Gen3 x8 IP blocks, hard memory controllers for DDR4/DDR3/QDR IV, 3,377 18x19 multipliers for DSP, and fractional synthesis PLLs. The device supports partial reconfiguration and a secure configuration scheme via AES-256 bitstream encryption. Core voltage is 0.9V with separate PLL, transceiver, and auxiliary rails.
The architecture combines a fabric of adaptive logic modules (ALMs), M20K embedded SRAM blocks, and variable-precision DSP blocks. The 20nm process enables higher logic density and lower static power vs prior 28nm Arria V parts. Hard IP blocks for PCIe, memory interfaces, and transceivers free up fabric for application logic, raising effective DSP throughput.
Typical applications include 100G/400G optical line cards, wireless LTE baseband processing, military secure radios, broadcast video processing, ASIC prototyping, and high-performance computing accelerators. The 14.1 Gbps transceivers make it well suited for OTU4, 100GbE, and JESD204B/C data converter interfaces.
Design considerations include power delivery for the 0.9V core rail (peak > 30A on dense designs), thermal management via the FCBGA heat-spreader lid, and PCB layout rules for 14 Gbps serial links. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure.
This page synthesizes current distributor stock, parametric alternatives within the same Arria 10 GX family, and design notes not typically included on distributor datasheet summaries.
Alternatives de remplacement direct pour 10AX090U2F45I2SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX090U2F45I2SG (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Operating Temperature Grade, DSP Blocks, Embedded Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX090U2F45I2LG
✅ Remplacement direct✓ En stock
$7957.34 / unité
Voir la fiche technique →10AX090U2F45I1SG
✅ Remplacement direct✓ En stock
$6895.59 / unité
Voir la fiche technique →10AX090U2F45E2SG
✅ Remplacement direct✓ En stock
$5995 / unité
Voir la fiche technique →10AX090U2F45E2LG
✅ Remplacement direct✓ En stock
$3647.5 / unité
Voir la fiche technique →10AX090U2F45E1SG
✅ Remplacement direct✓ En stock
$5895 / unité
Voir la fiche technique →10AX090U1F45I1SG
✅ Remplacement direct✓ En stock
$9750 / unité
Voir la fiche technique →10AX090U1F45E1SG
✅ Remplacement direct✓ En stock
$8750 / unité
Voir la fiche technique →10AX090U2F45I2SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| User I/O Count | 480 |
| Transceivers | 24 channels |
| Max Transceiver Data Rate | 14.1 Gbps |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| DSP Blocks | 18x19 multipliers |
| Boîtier | 1932-BBGA, FCBGA |
| Type de montage | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Niveau MSL | 3 (168 hours) |
| Configuration | AES-256 encrypted bitstream support |
| Statut RoHS | Compliant |
| Hard IP | PCIe Gen3 x8, DDR4 memory controller |
| Speed Grade | 2 (medium) |
Guide de configuration des broches du 10AX090U2F45I2SG 1932-bbga, fcbga
Configuration des broches du 10AX090U2F45I2SG (boîtier 1932-bbga, fcbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX090U2F45I2SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX090U2F45I2SG convient pour 6 applications: 100G Optical Line Card / OTU4 Framer, Wireless LTE / 5G Baseband Processing, Broadcast Video Processing and Routing, ASIC Prototyping and Emulation, Military Secure Radio / SIGINT, High-Performance Computing Accelerator.
100G Optical Line Card / OTU4 Framer
The 10AX090U2F45I2SG fits 100G optical line card designs because its 24 transceivers operate up to 14.1 Gbps, enough to aggregate 10 lanes of 10G for OTU4 or 4 lanes of 25G for 100GbE. The 900K logic elements and 3,377 18x19 multipliers implement the framer, mapper, and FEC (e.g., RS-FEC or Staircase FEC) in a single device. The hard PCIe Gen3 x8 block simplifies host-side control plane interconnect to a switch ASIC or CPU, reducing fabric utilization versus soft IP. Power dissipation at full 100G line rate is roughly 25-30W, manageable with the FCBGA heat-spreader lid.
Recommandé
Wireless LTE / 5G Baseband Processing
The 10AX090U2F45I2SG is well matched to LTE-Advanced Pro and sub-6 GHz 5G baseband designs because the 900K LEs and high DSP block count handle downlink/uplink channel decoding (Turbo, LDPC), FFT/iFFT, and MIMO processing in real time. The 14.1 Gbps transceivers connect to RFICs via CPRI or JESD204B/C, while the hard DDR4 controllers feed external QDR-IV or RLDRAM for HARQ buffers. Partial reconfiguration lets one FPGA serve multiple sectors or RATs, and the industrial -40C to +100C temperature range handles outdoor base-station thermal envelopes.
Recommandé
Broadcast Video Processing and Routing
The 10AX090U2F45I2SG supports uncompressed 4K/UHD video routing and processing because its 480 user I/Os and 24 transceivers handle dozens of SDI streams at 12G-SDI rates. The 59 Mbit embedded SRAM provides line buffers for color-space conversion, scaling, and frame-rate conversion without external memory. The hard memory controllers support DDR4 with ECC for larger GOP buffers. Industrial temperature grade and high reliability suit 24/7 broadcast studio and playout environments.
Recommandé
ASIC Prototyping and Emulation
The 10AX090U2F45I2SG is a strong fit for ASIC prototyping because the 900K LEs (equivalent to ~22M ASIC gates) accommodate large SoC designs and the 24 transceivers emulate multi-gigabit SerDes. Multiple 10AX090 devices can be time-domain multiplexed via GT transceivers to emulate even larger ASICs. Industrial temperature grade and partial reconfiguration help with long bring-up cycles. JTAG and Quartus Prime integration simplify debug compared to custom ASIC validation flows.
Recommandé
Military Secure Radio / SIGINT
The 10AX090U2F45I2SG suits secure radio and SIGINT systems because AES-256 bitstream encryption and tamper-resistant configuration protect classified IP. The 14.1 Gbps transceivers digitize wideband IF directly behind ADCs via JESD204B/C, while the high DSP count runs FFTs, channelizers, and demodulators in real time. Industrial temperature grade is adequate for many ground-mobile platforms; extended (-E) variants support harsher environments. Conformal coating and locked pin assignments simplify ITAR-controlled designs.
Recommandé
High-Performance Computing Accelerator
The 10AX090U2F45I2SG accelerates HPC workloads such as genomics, financial Monte Carlo, or compression offload because the 900K LEs plus 3,377 DSP blocks deliver high FLOPS at low latency. The hard PCIe Gen3 x8 block provides ~8 GB/s host bandwidth, and the 14.1 Gbps transceivers can chain multiple FPGAs for cluster-style scaling. DDR4 controllers with ECC handle large working sets. Power Toolkit flow in Quartus Prime lets designers hit thermal envelopes for air-cooled accelerator cards in 1U/2U servers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX090U2F45I2SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX090U2F45I2LG | 10AX090U2F45I1SG | 10AX090U2F45E2SG | 10AX090U2F45E2LG | 10AX090U2F45E1SG | 10AX090U1F45I1SG | 10AX090U1F45E1SG |
|---|---|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | 2 (medium) | 2 (medium) | 1 (slower) | 2 (medium) | 2 (medium) | 1 (slower) | 1 (slower) | 1 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended | Extended | Extended | Industrial | Extended |
| Terminal Finish | Pb-free (G suffix) | Leaded (L suffix) | Pb-free | Pb-free | Leaded | Pb-free | Pb-free | Pb-free |
| Transceivers | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 | 480 | 480 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Principaux différenciateurs
- Same silicon with industrial temp + leaded finish option (vs 10AX090U2F45I2LG)
- Higher Fmax headroom available in same package (vs 10AX090U3F45I2SG)
- Mid-range density vs larger Stratix 10 devices (vs Stratix 10 SX / GX)
Notes de conception
The 10AX090U2F45I2SG core rail (0.9V) can draw 30A+ on dense designs. Use a 6-layer PCB with a dedicated core power plane and at least 10x 22uF ceramic decoupling capacitors placed within 5mm of the BGA balls. Combine with a buck converter such as the LTM4677 or LTM4620 for the core rail, and separate LDOs for PLL and transceiver auxiliary rails to minimize jitter. Use the Intel PowerPlay Early Power Estimator before PCB layout to size the regulators.
Estimated: at full 100G utilization the 10AX090U2F45I2SG dissipates approximately 25-30W. The FCBGA-1932 package requires a heat-spreader lid and thermal interface material (TIM). Junction-to-ambient thermal resistance with a properly attached heatsink is roughly 1.5-2.0 C/W. Design the heatsink for a 50C ambient with a maximum junction temperature of 100C for industrial grade, leaving adequate margin for transient workloads.
The 1932-ball FCBGA uses a 1.0mm ball pitch with microvia stack-ups required on at least the top two layers. Follow Intel's Arria 10 pin connection guidelines for unused transceiver and PCIe pins - leave them floating or tied per the table to avoid leakage or back-power. For 14.1 Gbps serial links, use 100-ohm differential pairs with intra-pair skew below 1 ps and reference the signals to a solid ground plane on layer 2.
Do not confuse the 10AX (FPGA-only) with the 10AS (SoC with ARM Cortex-A9 hard cores). The packages share the same FCBGA outline but have different ball maps and cannot be substituted on the same PCB. Also confirm you have selected the correct speed grade - speed grade 2 (this part) is the mainstream choice; speed grade 3 yields higher Fmax at higher power, and speed grade 1 saves power at lower Fmax.
Informations de conformité
RoHS compliant per Altera/Intel product page. Pb-free (G suffix). Not AEC-Q100 qualified - this is a logic IC, not an automotive analog part. Halogen-free status not explicitly stated in retrieved data.