10AX090U2F45E1SG - Arria 10 GX 900K LE FPGA | Intel | 1932-FCBGA
Référence : 10AX090U2F45E1SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7250 | $7 250,00 |
| 10 | $6900 | $69 000,00 |
| 100 | $6450 | $645 000,00 |
| 250 | $6180 | $1 545 000,00 |
| 500 | $5895 | $2 947 500,00 |
10AX090U2F45E1SG Présentation
What is an Arria 10 GX FPGA? The Arria 10 GX family sits in Intel's mid-range FPGA portfolio between the lower-cost Cyclone/MAX series and the high-end Stratix family, optimized for transceiver-rich applications requiring a balance of logic density, DSP performance, and power efficiency. Arria 10 devices use a 20nm process and introduce features such as hardened floating-point DSP blocks, variable-precision DSP, and partial reconfiguration, making them suitable for DSP-intensive workloads. In the broader taxonomy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
Key features of the 10AX090U2F45E1SG include 900K logic elements, 3,378 DSP blocks (typical for this density), 28.05 Mbit embedded memory, 24 transceiver channels with data rates up to 17.4 Gbps (chip-to-chip), 0.9V core voltage, and integrated PCI Express hard IP blocks. The F45 package designation indicates a 45x45 mm body with 1932 balls in an FCBGA (Flip-Chip Ball Grid Array) configuration supporting industrial-grade thermal envelopes.
The architecture combines a heterogeneous fabric of adaptive logic modules (ALMs), M20K memory blocks, and DSP blocks with a serial transceiver subsystem hardened for backplane and chip-to-chip interconnect. The mid-range Arria 10 GX balances cost-per-logic-element with high-speed serial I/O, making it competitive with Xilinx Kintex-7/Kintex UltraScale for many mid-tier designs.
Typical applications include 4K video broadcasting equipment, LTE/5G baseband processing, software-defined radio, military radar preprocessing, ASIC prototyping, medical imaging acceleration, and high-speed data acquisition systems. Industrial temperature grading and built-in PCIe Gen3 hard IP further suit it for embedded compute and test-and-measurement backplanes.
When designing with this device, ensure the PCB has matched-length routing for the high-speed transceivers and a sufficient number of decoupling capacitors around the 0.9V core and 1.8V/2.5V/3.3V auxiliary rails. Thermal design must account for the FCBGA's high junction-to-ambient resistance; a heatsink is typically required for sustained operation. Intel's Quartus Prime software is required for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-family alternatives from the Arria 10 lineup, and practical PCB/thermal guidance beyond what the manufacturer datasheet alone provides for sourcing decisions.
Alternatives de remplacement direct pour 10AX090U2F45E1SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX090U2F45E1SG (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Logic Elements, Operating Temperature Grade, Max Transceiver Data Rate.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX090U1F45E1SG
✅ Remplacement direct✓ En stock
$8750 / unité
Voir la fiche technique →10AX090U1F45I1SG
✅ Remplacement direct✓ En stock
$9750 / unité
Voir la fiche technique →10AX090U2F45I1SG
✅ Remplacement direct✓ En stock
$6895.59 / unité
Voir la fiche technique →10AX090N2F45E1SG
✅ Remplacement direct✓ En stock
$10250 / unité
Voir la fiche technique →10AX090S2F45E1SG
✅ Remplacement direct✓ En stock
$4890 / unité
Voir la fiche technique →10AX090U2F45E1SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits (~28.05 Mbit) |
| User I/O Pins | 480 |
| Transceiver Channels | Up to 24 |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Boîtier | 1932-BBGA, FCBGA |
| Package Code | F45 (45x45 mm) |
| Operating Temperature Grade | Industrial (E1) |
| Type de montage | Surface Mount (BGA) |
| Hard IP | PCIe Gen3, memory controllers |
Guide de configuration des broches du 10AX090U2F45E1SG f45 (45x45 mm)
Configuration des broches du 10AX090U2F45E1SG (boîtier f45 (45x45 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX090U2F45E1SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX090U2F45E1SG convient pour 7 applications: 4K Video Broadcasting and Processing, Wireless Baseband and 5G Infrastructure, Software Defined Radio (SDR), ASIC Prototyping and Emulation, Medical Imaging Acceleration, High-Speed Data Acquisition and Test Equipment, Defense and Radar Signal Processing.
4K Video Broadcasting and Processing
The 10AX090U2F45E1SG is ideal for 4K video broadcast equipment where 900K logic elements and 28 Mbit embedded memory enable real-time video processing pipelines. Its 24 transceiver channels at 17.4 Gbps carry uncompressed 4K video over SDI or Ethernet, while 480 user I/O pins interface HDMI, DisplayPort, and audio subsystems. The hardened floating-point DSP blocks accelerate color-space conversion and HDR tone-mapping at line rate.
Recommandé
Wireless Baseband and 5G Infrastructure
The 10AX090U2F45E1SG's 900K logic elements and 3,378-class DSP block count deliver sufficient compute for LTE/5G baseband PHY processing, including channel coding, FFT/iFFT, and MIMO detection. Its up to 24 transceivers at 17.4 Gbps support CPRI and JESD204B/C fronthaul links to radio units. The 1932-ball F45 FCBGA provides the routing density needed for high-lane-count antenna interfaces.
Recommandé
Software Defined Radio (SDR)
For SDR platforms, the 10AX090U2F45E1SG pairs wideband ADC/DAC interfaces via its 17.4 Gbps transceivers with on-chip DSP resources sufficient for digital down-conversion, filtering, and demodulation across multiple channels simultaneously. The 59 Mbit embedded memory buffers IQ samples at high sample rates without external SRAM, reducing BOM cost and latency. PCIe Gen3 hard IP simplifies integration with host processors.
Recommandé
ASIC Prototyping and Emulation
The 10AX090U2F45E1SG with 900K logic elements and 480 user I/O pins is well-suited for prototyping large ASIC designs, especially those with multi-gigabit serial interfaces. Quartus Prime's incremental compilation and partition-based debug flow let teams map an ASIC RTL across one or more FPGAs. The F45 FCBGA package's signal-integrity characteristics preserve timing closure at high clock rates.
Recommandé
Medical Imaging Acceleration
Medical imaging systems (ultrasound, CT, MRI reconstruction) require dense DSP and high-bandwidth memory access - exactly what the 10AX090U2F45E1SG provides. Its floating-point DSP blocks accelerate beamforming and back-projection algorithms, while 28 Mbit of embedded memory holds working datasets close to compute. Industrial temperature grading (E1) supports use in clinical equipment enclosures.
Recommandé
High-Speed Data Acquisition and Test Equipment
Test and measurement instruments (digitizers, protocol analyzers, ATE) leverage the 10AX090U2F45E1SG's 24 transceivers to capture multi-channel high-speed data and its DSP fabric for real-time triggering and analysis. The 0.9V core and 20nm process yield better power efficiency than previous-generation Arria V devices, important for densely-packed PXI/AXIe instruments.
Recommandé
Defense and Radar Signal Processing
Radar preprocessing chains (pulse compression, MTI, beamforming) map efficiently onto the 10AX090U2F45E1SG's hardened DSP blocks. The Arria 10 GX family meets the throughput and latency requirements for phased-array radar while the F45 FCBGA package's rugged construction suits deployed military hardware. Multiple transceiver channels connect directly to ADC/DAC front-ends.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX090U2F45E1SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX090U1F45E1SG | 10AX090U1F45I1SG | 10AX090U2F45I1SG | 10AX090N2F45E1SG | 10AX090S2F45E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-BBGA, FCBGA (F45, 45x45 mm) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory | 59,234,304 bits (~28.05 Mbit) | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
| User I/O Pins | 480 | 480 | 480 | 480 | 480 | 480 |
| Speed Grade | 2 | 1 (slower) | 1 | 2 | 2 | 2 |
| Temperature Grade | Extended (E1) | Extended (E1) | Industrial (I1) | Industrial (I1) | Extended (E1) | Extended (E1) |
| Transceiver Tier | U2 (highest count) | U1 | U1 | U2 | N2 (reduced) | S2 (reduced) |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Principaux différenciateurs
- Highest transceiver tier within the 10AX090 F45 family (vs 10AX090N2F45E1SG)
- Extended temperature grade (E1) for harsher environments (vs 10AX090U2F45I1SG)
- Speed grade 2 balances timing margin and cost (vs 10AX090U1F45E1SG)
Notes de conception
Estimated: The 10AX090U2F45E1SG in a 1932-ball FCBGA can dissipate 25-40W under full utilization. With a typical theta_JA of 8-12 C/W on a standard 8-layer PCB, junction temperature can rise 200-400C above ambient without thermal management. A heatsink with thermal interface material, plus internal PCB copper planes bonded to BGA thermal balls, is required for reliable operation. Use Quartus Prime's PowerPlay analyzer to estimate power before finalizing thermal design.
Route all 24 high-speed transceivers with controlled impedance (100 ohm differential) and matched length within each transceiver group. Use the Arria 10 GX pin connection guidelines for via count and antipad dimensions. Decouple every power rail with a combination of bulk, ceramic, and high-frequency capacitors placed within 100 mils of the relevant BGA balls. The 0.9V core rail requires at least 4-6 low-ESR ceramic caps per device.
Maintain at least 4 PCB layers with dedicated ground and power planes. Place configuration flash memory within 2 inches of the FPGA configuration pins to ensure signal integrity for MSEL/AS_DATA signals. Separate analog and digital grounds if the design mixes RF transceivers with baseband logic. Use Intel's board design guidelines for the F45 package to determine breakout via pattern and escape routing topology.
Do not confuse the Arria 10 GX (10AX) with Arria V (10AS) or Cyclone 10 families - pinouts are not compatible even in the same package code. Confirm the exact ordering code matches your Quartus Prime device selection before PCB fab. Also, the 'U'/'N'/'S' transceiver tier letter is a fabric-level choice; verify the number of active transceiver channels matches your IP usage.
For 17.4 Gbps transceivers, use Megtron 6 or equivalent low-loss PCB material with a smooth copper profile. Simulate channels with the Arria 10 GX transceiver IBIS-AMI models before committing to PCB fab. Pre-emphasis and equalization settings in Quartus Prime can compensate for moderate channel loss, but excessive loss forces a re-spin.
Informations de conformité
RoHS and lead-free compliance per Intel/Altera product page. AEC-Q100 not applicable (this is an FPGA IC, not an automotive-grade qualified component).