10CX220YU484I6G - Cyclone 10 GX FPGA 220K LE, 12.5G Transceiver | Intel
Référence : 10CX220YU484I6G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $462 | $462,00 |
| 10 | $416 | $4 160,00 |
| 100 | $370 | $37 000,00 |
| 500 | $339 | $169 500,00 |
| 1 000 | $308 | $308 000,00 |
| 3 000 | $277 | $831 000,00 |
10CX220YU484I6G Présentation
A Cyclone 10 GX FPGA is a programmable logic device from Intel's low-density Cyclone family that combines hard IP blocks (transceivers, PCIe Gen2, memory controllers) with general-purpose FPGA fabric. It sits in the broader taxonomy of FPGA -> programmable logic device -> logic IC -> semiconductor, and is the direct successor to Cyclone V GX/GT families, offering higher transceiver bandwidth and lower core voltage than its predecessors.
Key features of this 10CX220 variant include up to 12.5 Gbps multi-protocol transceivers that support PCIe Gen2 x4, 10GbE (10GBASE-R), CPRI, and JESD204B. The device integrates a hardened PCIe Gen2 controller with up to x4 lane support, eliminating soft IP overhead for PCIe endpoint designs. It also embeds variable-precision DSP blocks supporting 18x19 and 27x27 multiplier modes for high-efficiency signal processing, and dual-configuration memory interfaces for fail-safe remote updates. Memory interface support extends to DDR3 SDRAM up to 1,866 Mbps with a 72-bit wide interface.
Architecturally, this device uses Intel's 20 nm low-power process and a logic-structure voltage of 0.9 V core. The transceiver tiles are powered from a separate 1.1 V supply to maintain signal integrity at 12.5 Gbps. The 484-pin UBGA package offers a compact footprint suitable for space-constrained designs such as industrial cameras and small-form-factor embedded systems. The 'I6G' speed grade indicates industrial temperature range (-40C to +100C) and a specific transceiver performance bin.
Typical applications include 10GbE network interface cards, industrial machine vision, broadcast video processing, 5G fronthaul, and PCIe Gen2 endpoint cards. When designing with this FPGA, plan for adequate PCB layers to route 12.5 Gbps SERDES signals - typically six or more layers with controlled impedance and a continuous ground plane below the SERDES region.
Alternatives de remplacement direct pour 10CX220YU484I6G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CX220YU484I6G (même facteur de forme et même empreinte) — différant par Package, Process Technology, DSP Blocks, Hardened PCIe, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CX220YU484I5G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$42.38 / unité
Voir la fiche technique →10CX220YU484E6G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$160 / unité
Voir la fiche technique →10CX220YU484E5G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$189.95 / unité
Voir la fiche technique →10CX220YF780I6G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$121.83 / unité
Voir la fiche technique →10CX220YF780I5G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1995 / unité
Voir la fiche technique →10CX220YF672I6G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$365 / unité
Voir la fiche technique →10CX220YU484I6G Valeurs maximales et caractéristiques électriques
| Family | Cyclone 10 GX |
| Logic Elements | 220,000 |
| Embedded Memory (bits) | 13,752,320 |
| Number of Logic Cells | 220000 |
| Maximum User I/Os | 188 |
| Transceiver Data Rate | 12.5 Gbps |
| Hardened PCIe | PCIe Gen2 (x1/x2/x4) |
| Memory Interface | DDR3 SDRAM up to 1,866 Mbps, 72-bit wide |
| LVDS Data Rate | 1.4 Gbps |
| DSP Blocks | Variable-precision (18x19, 27x27 multiplier modes) |
| Boîtier | 484-ball UBGA (U484) |
| Process Technology | 20 nm low-power |
| Core Voltage | 0.9 V (estimated) |
| Transceiver Supply | 1.1 V (estimated) |
| Température de fonctionnement | -40C to +100C (industrial) |
| Speed Grade | I6G (industrial, transceiver bin 6) |
| Statut RoHS | Compliant |
Configuration des broches de 10CX220YU484I6G
| Broche 1 | VCC — Core supply voltage (0.9 V estimated) |
| Broche 2 | GND — Ground reference |
| Broche 3 | IO_BANK_1A — User I/O bank 1A |
| Broche 4 | IO_BANK_1B — User I/O bank 1B |
| Broche 5 | GXB_TX — Transceiver transmit data |
| Broche 6 | GXB_RX — Transceiver receive data |
| Broche 7 | REFCLK — Transceiver reference clock input |
| Broche 8 | VCCA_GXB — Transceiver analog supply (1.1 V estimated) |
Applications typiques
10CX220YU484I6G convient pour 7 applications: 10GbE Network Interface Card, Industrial Machine Vision, Broadcast Video Processing, 5G Fronthaul / CPRI, PCIe Gen2 Endpoint Card, Test & Measurement Equipment, Wireless Baseband Processing.
10GbE Network Interface Card
The 10CX220YU484I6G is ideal for 10 Gigabit Ethernet NIC designs where its 12.5 Gbps transceivers directly drive SFP+ optical modules for 10GBASE-R connectivity. The hardened PCIe Gen2 x4 endpoint eliminates soft-IP overhead and reduces latency for host communication, while 188 user I/Os provide ample headroom for status LEDs, external PHY control, and management interfaces. Compared to using a discrete PHY plus smaller FPGA, the integrated SERDES approach shrinks BOM, PCB area, and power budget.
Recommandé
Industrial Machine Vision
For machine vision camera and frame-grabber designs, the 10CX220YU484I6G delivers 220K logic elements plus variable-precision DSP blocks that accelerate pixel processing pipelines. Its industrial temperature rating (-40C to +100C) ensures reliable operation in factory-floor enclosures, and the 12.5 Gbps transceivers accept CoaXPress or 10GigE Vision camera links. The DDR3 72-bit interface running at 1,866 Mbps provides high-bandwidth frame buffering for multi-stream capture.
Recommandé
Broadcast Video Processing
In broadcast video routers and format converters, the 10CX220YU484I6G handles multi-channel SDI processing with its 12.5 Gbps transceivers supporting 3G-SDI/6G-SDI/12G-SDI standards. The 13.75 Mbit embedded memory buffers audio/video frames, while 188 user I/Os fan out to multiple BNC connectors and HDMI encoder/decoder chips. Compared to ASIC solutions, the FPGA approach supports evolving broadcast standards like ST 2110 and ST 2059 PTP timestamping.
Recommandé
5G Fronthaul / CPRI
The 10CX220YU484I6G is well-suited for 5G fronthaul applications where its transceivers support CPRI and eCPRI links up to 12.5 Gbps. The hardened PCIe Gen2 endpoint enables direct connection to baseband SoCs, while the FPGA fabric implements PHY-layer processing, IQ data routing, and timing synchronization. Industrial temperature range ensures outdoor small-cell deployments operate reliably across seasons and climate zones.
Recommandé
PCIe Gen2 Endpoint Card
For PCIe Gen2 endpoint add-in cards, the 10CX220YU484I6G provides a hardened PCIe Gen2 controller supporting x1/x2/x4 configurations, eliminating the need for soft PCIe IP cores. The 12.5 Gbps transceivers can also drive board-to-board links to companion chips. With 188 user I/Os and 220K logic elements, the FPGA implements custom protocol logic, data buffering, and host-side register interfaces on a single chip, replacing discrete PCIe bridge + FPGA solutions.
Recommandé
Test & Measurement Equipment
In protocol analyzers and bit-error-rate testers, the 10CX220YU484I6G's 12.5 Gbps transceivers support multi-standard pattern generation and error analysis. The 220K logic elements implement protocol state machines and statistics counters, while 13.75 Mbits of embedded memory buffer captured data streams. The 484-ball UBGA package offers excellent signal integrity for high-speed probe connections required in lab-grade instruments.
Recommandé
Wireless Baseband Processing
The 10CX220YU484I6G supports wireless baseband processing through its variable-precision DSP blocks implementing 18x19 and 27x27 multipliers for channelization, FFT/iFFT, and beamforming operations. Its 12.5 Gbps transceivers connect to RF front-end modules via CPRI or JESD204B, and the DDR3 controller buffers high-bandwidth IQ sample streams. Compared to DSP-only solutions, the FPGA approach offers reconfigurability for evolving wireless standards like 5G NR and private LTE.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CX220YU484I6G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CX220YU484I5G | 10CX220YU484E6G | 10CX220YU484E5G | 10CX220YF780I6G | 10CX220YF780I5G | 10CX220YF672I6G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball UBGA (U484) | 484-ball UBGA (U484) | 484-ball UBGA (U484) | 484-ball UBGA (U484) | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 672-ball FBGA (F672) |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 |
| Embedded Memory (Mbits) | 13.75 | 13.75 | 13.75 | 13.75 | 13.75 | 13.75 | 13.75 |
| Maximum User I/Os | 188 | 188 | 188 | 188 | 280 | 280 | 240 |
| Transceiver Data Rate | 12.5 Gbps | 10 Gbps | 12.5 Gbps | 10 Gbps | 12.5 Gbps | 10 Gbps | 12.5 Gbps |
| Speed Grade | I6G (industrial) | I5G (industrial, lower bin) | E6G (commercial) | E5G (commercial, lower bin) | I6G (industrial) | I5G (industrial, lower bin) | I6G (industrial) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Pin Compatibility | U484 base | Drop-in (same U484) | Drop-in (same U484) | Drop-in (same U484) | Requires F780 PCB | Requires F780 PCB | Requires F672 PCB |
| Approximate Unit Price (1 pc) | $462 USD | Lower (est. 5-10% less) | Lower (commercial grade) | Lowest (commercial + lower speed) | Higher (larger package) | Higher (larger package) | Similar (mid package) |
Principaux différenciateurs
- Highest-density Cyclone 10 GX with 12.5 Gbps transceivers in U484 package (vs 10CX150YU484I6G)
- Industrial temperature range with I6G transceiver bin (vs 10CX220YU484E6G)
- Compact U484 footprint with 188 user I/Os (vs 10CX220YF780I6G)
- Maximum transceiver speed bin (I6G) (vs 10CX220YU484I5G)
Notes de conception
Cyclone 10 GX FPGAs with 12.5 Gbps transceivers require a minimum six-layer PCB stackup with continuous ground planes below the SERDES region. Use 100-ohm differential impedance for SERDES lanes and 90-ohm for LVDS, with length matching within 5 mils for tx/rx pairs. Decoupling requires 100nF X7R capacitors every 5 transceiver power pins and bulk 10uF tantalum capacitors per supply rail.
Cyclone 10 GX devices operating at full transceiver utilization (12.5 Gbps, multiple channels active) typically dissipate 4-6 W. The 484-ball UBGA package requires thermal vias in the BGA pattern to conduct heat to internal ground planes. Without proper thermal management, junction temperature can exceed the 100C industrial limit in sealed enclosures. Estimated: at 5 W dissipation with the U484 package theta-JA of approximately 18 C/W (with thermal vias), the junction temperature rises 90C above ambient.
Do not omit the transceiver reference clock - each GXB channel requires a low-jitter 100 MHz or 156.25 MHz reference clock with phase noise below -120 dBc/Hz at 1 MHz offset to meet 12.5 Gbps link budgets. Additionally, configure MSEL pins for the correct configuration scheme (AS, JTAG, or FPP) before power-on to avoid boot failures. DDR3 interfaces require exact-matched fly-by routing topology per Intel's external memory interface guidelines.
Informations de conformité
RoHS compliant per Altera/Intel product page. Industrial temperature grade qualified for -40C to +100C operation. AEC-Q100 not applicable for FPGA family.