10CX220YU484I6G - Cyclone 10 GX FPGA 220K LE, 12.5G Transceiver | Intel
MPN: 10CX220YU484I6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $462 | $462.00 |
| 10 | $416 | $4,160.00 |
| 100 | $370 | $37,000.00 |
| 500 | $339 | $169,500.00 |
| 1,000 | $308 | $308,000.00 |
| 3,000 | $277 | $831,000.00 |
Drop-in alternatives for 10CX220YU484I6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX220YU484I5G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$42.38 / Unit
View Datasheet →10CX220YU484E6G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10CX220YU484E5G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10CX220YF780I6G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10CX220YF780I5G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1995 / Unit
View Datasheet →10CX220YF672I6G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10CX220YU484I6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements | 220,000 |
| Embedded Memory (bits) | 13,752,320 |
| Number of Logic Cells | 220000 |
| Maximum User I/Os | 188 |
| Transceiver Data Rate | 12.5 Gbps |
| Hardened PCIe | PCIe Gen2 (x1/x2/x4) |
| Memory Interface | DDR3 SDRAM up to 1,866 Mbps, 72-bit wide |
| LVDS Data Rate | 1.4 Gbps |
| DSP Blocks | Variable-precision (18x19, 27x27 multiplier modes) |
| Package | 484-ball UBGA (U484) |
| Process Technology | 20 nm low-power |
| Core Voltage | 0.9 V (estimated) |
| Transceiver Supply | 1.1 V (estimated) |
| Operating Temperature | -40C to +100C (industrial) |
| Speed Grade | I6G (industrial, transceiver bin 6) |
| RoHS Status | Compliant |
10CX220YU484I6G Pin Configuration
| Pin 1 | VCC — Core supply voltage (0.9 V estimated) |
| Pin 2 | GND — Ground reference |
| Pin 3 | IO_BANK_1A — User I/O bank 1A |
| Pin 4 | IO_BANK_1B — User I/O bank 1B |
| Pin 5 | GXB_TX — Transceiver transmit data |
| Pin 6 | GXB_RX — Transceiver receive data |
| Pin 7 | REFCLK — Transceiver reference clock input |
| Pin 8 | VCCA_GXB — Transceiver analog supply (1.1 V estimated) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX220YU484I6G is suitable for 7 applications: 10GbE Network Interface Card, Industrial Machine Vision, Broadcast Video Processing, 5G Fronthaul / CPRI, PCIe Gen2 Endpoint Card, Test & Measurement Equipment, Wireless Baseband Processing.
10GbE Network Interface Card
The 10CX220YU484I6G is ideal for 10 Gigabit Ethernet NIC designs where its 12.5 Gbps transceivers directly drive SFP+ optical modules for 10GBASE-R connectivity. The hardened PCIe Gen2 x4 endpoint eliminates soft-IP overhead and reduces latency for host communication, while 188 user I/Os provide ample headroom for status LEDs, external PHY control, and management interfaces. Compared to using a discrete PHY plus smaller FPGA, the integrated SERDES approach shrinks BOM, PCB area, and power budget.
Recommended
Industrial Machine Vision
For machine vision camera and frame-grabber designs, the 10CX220YU484I6G delivers 220K logic elements plus variable-precision DSP blocks that accelerate pixel processing pipelines. Its industrial temperature rating (-40C to +100C) ensures reliable operation in factory-floor enclosures, and the 12.5 Gbps transceivers accept CoaXPress or 10GigE Vision camera links. The DDR3 72-bit interface running at 1,866 Mbps provides high-bandwidth frame buffering for multi-stream capture.
Recommended
Broadcast Video Processing
In broadcast video routers and format converters, the 10CX220YU484I6G handles multi-channel SDI processing with its 12.5 Gbps transceivers supporting 3G-SDI/6G-SDI/12G-SDI standards. The 13.75 Mbit embedded memory buffers audio/video frames, while 188 user I/Os fan out to multiple BNC connectors and HDMI encoder/decoder chips. Compared to ASIC solutions, the FPGA approach supports evolving broadcast standards like ST 2110 and ST 2059 PTP timestamping.
Recommended
5G Fronthaul / CPRI
The 10CX220YU484I6G is well-suited for 5G fronthaul applications where its transceivers support CPRI and eCPRI links up to 12.5 Gbps. The hardened PCIe Gen2 endpoint enables direct connection to baseband SoCs, while the FPGA fabric implements PHY-layer processing, IQ data routing, and timing synchronization. Industrial temperature range ensures outdoor small-cell deployments operate reliably across seasons and climate zones.
Recommended
PCIe Gen2 Endpoint Card
For PCIe Gen2 endpoint add-in cards, the 10CX220YU484I6G provides a hardened PCIe Gen2 controller supporting x1/x2/x4 configurations, eliminating the need for soft PCIe IP cores. The 12.5 Gbps transceivers can also drive board-to-board links to companion chips. With 188 user I/Os and 220K logic elements, the FPGA implements custom protocol logic, data buffering, and host-side register interfaces on a single chip, replacing discrete PCIe bridge + FPGA solutions.
Recommended
Test & Measurement Equipment
In protocol analyzers and bit-error-rate testers, the 10CX220YU484I6G's 12.5 Gbps transceivers support multi-standard pattern generation and error analysis. The 220K logic elements implement protocol state machines and statistics counters, while 13.75 Mbits of embedded memory buffer captured data streams. The 484-ball UBGA package offers excellent signal integrity for high-speed probe connections required in lab-grade instruments.
Recommended
Wireless Baseband Processing
The 10CX220YU484I6G supports wireless baseband processing through its variable-precision DSP blocks implementing 18x19 and 27x27 multipliers for channelization, FFT/iFFT, and beamforming operations. Its 12.5 Gbps transceivers connect to RF front-end modules via CPRI or JESD204B, and the DDR3 controller buffers high-bandwidth IQ sample streams. Compared to DSP-only solutions, the FPGA approach offers reconfigurability for evolving wireless standards like 5G NR and private LTE.
Recommended
Recommended Products Summary
Engineering reference data for 10CX220YU484I6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX220YU484I5G | 10CX220YU484E6G | 10CX220YU484E5G | 10CX220YF780I6G | 10CX220YF780I5G | 10CX220YF672I6G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball UBGA (U484) | 484-ball UBGA (U484) | 484-ball UBGA (U484) | 484-ball UBGA (U484) | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 672-ball FBGA (F672) |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 |
| Embedded Memory (Mbits) | 13.75 | 13.75 | 13.75 | 13.75 | 13.75 | 13.75 | 13.75 |
| Maximum User I/Os | 188 | 188 | 188 | 188 | 280 | 280 | 240 |
| Transceiver Data Rate | 12.5 Gbps | 10 Gbps | 12.5 Gbps | 10 Gbps | 12.5 Gbps | 10 Gbps | 12.5 Gbps |
| Speed Grade | I6G (industrial) | I5G (industrial, lower bin) | E6G (commercial) | E5G (commercial, lower bin) | I6G (industrial) | I5G (industrial, lower bin) | I6G (industrial) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Pin Compatibility | U484 base | Drop-in (same U484) | Drop-in (same U484) | Drop-in (same U484) | Requires F780 PCB | Requires F780 PCB | Requires F672 PCB |
| Approximate Unit Price (1 pc) | $462 USD | Lower (est. 5-10% less) | Lower (commercial grade) | Lowest (commercial + lower speed) | Higher (larger package) | Higher (larger package) | Similar (mid package) |
Key Differentiators
- Highest-density Cyclone 10 GX with 12.5 Gbps transceivers in U484 package (vs 10CX150YU484I6G)
- Industrial temperature range with I6G transceiver bin (vs 10CX220YU484E6G)
- Compact U484 footprint with 188 user I/Os (vs 10CX220YF780I6G)
- Maximum transceiver speed bin (I6G) (vs 10CX220YU484I5G)
Design Notes
Cyclone 10 GX FPGAs with 12.5 Gbps transceivers require a minimum six-layer PCB stackup with continuous ground planes below the SERDES region. Use 100-ohm differential impedance for SERDES lanes and 90-ohm for LVDS, with length matching within 5 mils for tx/rx pairs. Decoupling requires 100nF X7R capacitors every 5 transceiver power pins and bulk 10uF tantalum capacitors per supply rail.
Cyclone 10 GX devices operating at full transceiver utilization (12.5 Gbps, multiple channels active) typically dissipate 4-6 W. The 484-ball UBGA package requires thermal vias in the BGA pattern to conduct heat to internal ground planes. Without proper thermal management, junction temperature can exceed the 100C industrial limit in sealed enclosures. Estimated: at 5 W dissipation with the U484 package theta-JA of approximately 18 C/W (with thermal vias), the junction temperature rises 90C above ambient.
Do not omit the transceiver reference clock - each GXB channel requires a low-jitter 100 MHz or 156.25 MHz reference clock with phase noise below -120 dBc/Hz at 1 MHz offset to meet 12.5 Gbps link budgets. Additionally, configure MSEL pins for the correct configuration scheme (AS, JTAG, or FPP) before power-on to avoid boot failures. DDR3 interfaces require exact-matched fly-by routing topology per Intel's external memory interface guidelines.
Compliance Information
RoHS compliant per Altera/Intel product page. Industrial temperature grade qualified for -40C to +100C operation. AEC-Q100 not applicable for FPGA family.
