10M04SAM153I7G - MAX 10 FPGA 4K LE, 153-MBGA, Industrial | Intel
Référence : 10M04SAM153I7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.95 | $1 395,00 |
| 500 | $11.8 | $5 900,00 |
| 1 000 | $10.4 | $10 400,00 |
| 3 000 | $9.2 | $27 600,00 |
10M04SAM153I7G Présentation
What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing configurable logic blocks (LBs), programmable interconnect, and on-die memory that can be reconfigured by the designer after manufacture. FPGAs sit above microcontrollers and fixed-function ASICs in the design hierarchy for parallel processing, custom I/O timing, and high-throughput glue logic. MAX 10 is Intel's non-volatile family, integrating flash configuration memory on-die so the device powers up instantly without an external boot PROM - an advantage over SRAM FPGAs that simplifies board layout and reduces BOM cost.
Key features of the 10M04SAM153I7G include on-die user flash (up to ~30 Kbits available on small-density MAX 10 die), an integrated ADC block (12-bit, 1 MSps) on larger densities, and hardened PLL, I/O, and DDR3 support. The 153-MBGA package delivers high I/O density in a 9 mm × 9 mm footprint suitable for space-constrained industrial designs. The device supports LVCMOS 3.0/3.3 V I/O standards and offers a hardened Nios II soft-processor fit for state-machine and protocol-bridging tasks.
The MAX 10 family uses a TSMC 55 nm embedded-flash process. Configuration is stored in on-die flash, enabling instant-on behavior (typically < 1 ms to user mode after power-up), remote upgrade via JTAG, and dual-image support for fail-safe field updates. The architecture provides per-LB 8-input adaptive logic modules, 18 × 18 multipliers, and block RAM blocks totaling the 193 Kbits quoted in the device overview.
Typical applications include industrial control I/O expansion, motor-control glue logic, sensor aggregation, low-volume protocol bridging (SPI, I2C, UART, Modbus, CAN), and portable test equipment that benefits from instant-on, low static current, and high pin density in a small BGA.
Design considerations: the 153-ball MBGA requires 0.5 mm (or finer) PCB pitch, microvia stack-ups, and careful fanout. Decoupling follows the Quartus Prime pin connection guidelines - at minimum 0.1 µF + 1 µF near each power pair, plus bulk caps on the 1.2 V regulator. Use the Intel MAX 10 pinout file (.pin) and Quartus Prime Fitter reports to verify timing closure before sign-off.
This page synthesizes distributor pricing for 10M04SAM153I7G, drop-in same-package alternatives, and practical design notes not aggregated in the manufacturer datasheet.
Alternatives de remplacement direct pour 10M04SAM153I7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M04SAM153I7G (même facteur de forme et même empreinte) — différant par Package, Family, Logic Elements (LE), Configuration Method, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M04SAM153C8G
✅ Remplacement direct✓ En stock
$4.85 / unité
Voir la fiche technique →10M04SAM153I6G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M04SAM153C7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M04SAM153A7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M04SAM153I7G Valeurs maximales et caractéristiques électriques
| Series | MAX 10 (10M04) |
| Family | MAX® 10 FPGA |
| Logic Elements (LEs) | 4,000 |
| Embedded Memory (bits) | 193,536 |
| User I/O Count | 112 |
| Process Technology | 55 nm (embedded flash, TSMC) |
| Core Voltage | 1.2 V |
| I/O Voltage Support | 3.0 V / 3.3 V LVCMOS |
| Boîtier | 153-ball MBGA (Micro FineLine BGA) |
| Température de fonctionnement | -40 °C to +100 °C (industrial) |
| Configuration Method | On-die flash, instant-on |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Type de montage | Surface Mount |
Guide de configuration des broches du 10M04SAM153I7G 153-ball mbga (micro fineline bga)
Configuration des broches du 10M04SAM153I7G (boîtier 153-ball mbga (micro fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10M04SAM153I7G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10M04SAM153I7G convient pour 6 applications: Industrial Control I/O Expansion, Motor Drive Glue Logic, Sensor Aggregation & Protocol Bridging, Portable Test & Measurement Equipment, Display & LED Control, Automotive Test & Telematics.
Industrial Control I/O Expansion
The 10M04SAM153I7G's 4,000 LEs and 112 user I/Os make it an ideal bridge for expanding a microcontroller or SBC in industrial control cabinets. The on-die flash configuration eliminates external boot PROMs, reducing BOM and shortening power-up time to under 1 ms for fail-safe plant startup. With LVCMOS 3.3 V I/O support and hardened PLLs, the device can re-time legacy 24 V opto-isolated signals, generate timing-critical PWM for motor drivers, and aggregate multiple SPI/UART sensor streams into a single high-speed parallel interface. The industrial -40 °C to +100 °C temperature rating suits factory-floor, outdoor cabinet, and refrigerated warehouse installations. Designers can pair the FPGA with an external digital isolator (e.g., TI ISO1540) and a step-down DC-DC for the 1.2 V core.
Recommandé
Motor Drive Glue Logic
The 10M04SAM153I7G is widely deployed as glue logic between a microcontroller and the power stage in variable-frequency drives and servo controllers. Its 18×18 multipliers and DSP blocks can offload field-oriented control (FOC) math from the host MCU, while the high fan-out handles encoder QEP decoding, Hall-effect sensor conditioning, and PWM dead-time generation with deterministic latency. The on-die flash supports dual-image field upgrades, critical for installed motor systems where firmware updates must be fail-safe. Industrial temperature operation suits under-hood and enclosed drive environments. For higher performance FOC at > 20 kHz switching, consider the 10M08 or 10M16 density points with more multipliers.
Recommandé
Sensor Aggregation & Protocol Bridging
Industrial IoT gateways often need to aggregate Modbus RTU, SPI, I2C, UART, and CAN streams from multiple sensors into a single Ethernet or wireless uplink. The 10M04SAM153I7G's 112 user I/Os and 4,000 LEs can host a Nios II soft processor alongside custom hardware accelerators for protocol framing and CRC, offloading the host gateway CPU. The on-die flash eliminates external configuration memory, simplifying enclosure design. Industrial temperature rating suits factory and outdoor deployments, and the small 153-MBGA footprint fits into compact DIN-rail-mounted gateways. Pair the FPGA with a small Ethernet MAC/PHY like the LAN8720A or a wireless module such as the ESP32-S3.
Recommandé
Portable Test & Measurement Equipment
Handheld oscilloscopes, logic analyzers, and protocol testers benefit from the MAX 10's instant-on, low static current, and small footprint. The 10M04SAM153I7G can implement custom triggering, signal conditioning, and protocol decoding while the host processor handles UI. The on-die flash supports fast boot to user mode (< 1 ms) so the device can wake from sleep and present a measurement interface immediately. Industrial temperature rating allows use in field environments. For battery-powered designs, MAX 10's low static current (compared to SRAM FPGAs with external boot PROMs) extends runtime, and the 153-MBGA package fits inside compact handheld enclosures.
Recommandé
Display & LED Control
The 10M04SAM153I7G can drive small TFT LCD panels, RGB LED matrices, and custom LED timing controllers for industrial HMIs and signage. Its LVCMOS 3.3 V I/O directly interfaces to most small-panel RGB interfaces, while the embedded SRAM (193 Kbits) can buffer one full frame at small resolutions. The hardened PLLs generate accurate pixel clocks from a low-cost crystal, eliminating external clock buffers. Industrial temperature rating suits outdoor signage and automotive interior displays. Designers can use the Nios II soft processor for graphics primitives while custom hardware handles the pixel pipeline, achieving low BOM and fast time-to-market.
Recommandé
Automotive Test & Telematics
Although the 10M04SAM153I7G is industrial-grade rather than AEC-Q100 qualified, it is commonly used in non-safety automotive test equipment, fleet telematics hardware prototypes, and aftermarket CAN bus gateways during pre-production development. Its 112 user I/Os accommodate multiple CAN interfaces, LIN bus, and K-Line legacy automotive protocols in parallel. The on-die flash enables instant-on so the device can wake the host system immediately on ignition. For production automotive deployment, designers should transition to AEC-Q100 qualified variants or alternative families. Industrial temperature rating handles under-hood test setups and aftermarket dashboard installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M04SAM153I7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M04SAM153C8G | 10M04SAM153I6G | 10M04SAM153C7G | 10M04SAM153A7G |
|---|---|---|---|---|---|
| Package | 153-ball MBGA | 153-ball MBGA - same | 153-ball MBGA - same | 153-ball MBGA - same | 153-ball MBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Embedded Memory (bits) | 193,536 | 193,536 | 193,536 | 193,536 | 193,536 |
| User I/O | 112 | 112 | 112 | 112 | 112 |
| Operating Temperature | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +125 °C (automotive) |
| Speed Grade | I7 | C8 | I6 | C7 | A7 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- Smallest MAX 10 density with on-die flash configuration (vs 10M02 series)
- Industrial temperature range with 153-ball MBGA high I/O density (vs 10M04SAM153C8G)
- Higher I/O count than 144-pin EQFP MAX 10 variants in same density (vs 10M04SCE144A7G (lower-density/144-pin))
Notes de conception
The 153-ball MBGA requires a fine-pitch PCB stack-up. Confirm ball pitch from the MAX 10 pin connection guidelines before final design. For 0.5 mm pitch use microvia (laser-drilled) stack-ups with 1+1+1 build-up or HDI. Escape routing on inner layers requires 0.1 mm trace-and-space minimum; for sub-0.1 mm use HDI with via-in-pad. Maintain a continuous ground plane under the BGA for return-current integrity and thermal spreading.
MAX 10 requires a 1.2 V core supply and a separate 3.0/3.3 V I/O supply. Place 0.1 µF + 1 µF decoupling capacitors within 2 mm of each power pair, plus bulk capacitance on the 1.2 V regulator output. Use a low-dropout regulator with fast transient response such as the MAX17501. Sequence the 1.2 V core before the 3.3 V I/O supply to avoid I/O driving into unpowered logic, which can cause long-term reliability issues.
A common mistake is treating the MAX 10 like a SRAM-based FPGA and adding an external boot PROM - it does not need one. Another pitfall is neglecting the JTAG chain in production boards; always include a JTAG header even for units that ship with pre-loaded flash. Finally, do not leave unused I/O pins floating - configure them as input with weak pull-up or output driving low to reduce SSN and power consumption. Quartus Prime's pin connection guidelines enumerate these defaults.
Estimated: at 100 % resource utilization with all 112 I/Os toggling at 100 MHz on a 4-layer 1 oz PCB, the 10M04SAM153I7G may dissipate 0.5 W to 1.0 W. The 153-MBGA junction-to-ambient thermal resistance is approximately [DATA_NEEDED: theta_JA] °C/W. For enclosed industrial cabinets without airflow, derate resource utilization or add thermal vias under the BGA center to maintain junction below +100 °C.
Informations de conformité
RoHS and lead-free compliance per Altera product page. The I7 industrial variant is not AEC-Q100 qualified - use the A7 automotive variant if AEC-Q100 is required. Halogen-free status not explicitly stated in provided data.
