5CEBA4F23C8N - Cyclone V E FPGA, 49K LE, 484-BGA | Intel
MPN: 5CEBA4F23C8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $92.5 | $92.50 |
| 10 | $84.2 | $842.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $67.85 | $33,925.00 |
| 1,000 | $62.41 | $62,410.00 |
Drop-in alternatives for 5CEBA4F23C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5CEBA4F23C7N
β Drop-Inπ Reference alternative (not in catalog)
5CEBA4F23I7N
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5CEBA4F23A7N
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5CEBA4F23C8N
β Drop-Inβ In Stock
$62.41 / Unit
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β Drop-Inπ Reference alternative (not in catalog)
5CEBA4F17C8N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5CEBA4F23C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V E |
| Device Model | 5CEA4 (49K logic elements) |
| Logic Elements (LE) | 49,000 |
| Embedded Memory (bits) | 3,464,192 |
| Maximum User I/O | 224 |
| I/O Banks | 8 |
| Package | 484-ball FBGA (F23, 23x23 mm) |
| Mounting Type | Surface Mount |
| Speed Grade | 8 |
| Temperature Grade | Commercial (0 Β°C to +85 Β°C junction) |
| Process Technology | TSMC 28 nm low-power |
| Configuration Scheme | Passive serial / fast passive parallel / JTAG |
| Design Toolchain | Intel Quartus Prime (Standard / Lite) |
| RoHS Status | Compliant |
| Lead Free | Yes |
5CEBA4F23C8N 484-ball fbga (f23, 23x23 mm) Pin Configuration Guide
Complete pinout information for 5CEBA4F23C8N (484-ball fbga (f23, 23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CEBA4F23C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CEBA4F23C8N is suitable for 6 applications: Industrial Motor Control and Drive, Industrial Machine Vision and Video Bridging, Factory Automation and PLC Backplane, Medical Imaging and Diagnostic Equipment, Software-Defined Radio Pre-Processing, LED Video Wall and Display Controllers.
Industrial Motor Control and Drive
The 5CEBA4F23C8N is well matched to multi-axis industrial motor control designs. Its 49,000 logic elements easily accommodate field-oriented control (FOC), space-vector PWM generation, encoder feedback, and protection logic for three-phase inverters at switching frequencies above 100 kHz. The 224 GPIO supports simultaneous input from quadrature encoders, Hall sensors, and analog front ends while driving insulated-gate driver enable and PWM signals to multiple half-bridges. Variable-precision DSP blocks accelerate Park/Clarke transforms and PI controllers, and the 3,464,192 bits of M10K block RAM buffer lookup tables for sine, space-vector, and field-weakening profiles without external memory. Hardened DDR3 controllers simplify data logging of vibration or current waveforms for predictive maintenance. According to the Intel Cyclone V Device Handbook, Cyclone V E family devices achieve the lowest static power per LE of any 28 nm FPGA family - a key advantage in always-on factory-floor installations where ambient air may reach 60 Β°C inside enclosures.
Recommended
Industrial Machine Vision and Video Bridging
The 5CEBA4F23C8N serves as a flexible bridge between image sensors, processors, and displays in industrial vision systems. The 224 GPIO includes multi-standard LVDS lanes suitable for Camera Link, MIPI CSI-2 (via LVDS physical bridging), and channel-link serializer interfaces, while the high I/O count supports dual-channel processing of 1080p60 video streams in real time. Variable-precision DSP blocks implement 2D convolution, edge detection, and color-space conversion at line rates up to 150 MHz, and the abundant M10K block RAM provides line and frame buffers without external SRAM. Cyclone V E devices integrate hard DDR3 controllers, enabling direct attachment of LPDDR3 image-frame stores. The commercial 0-85 Β°C temperature grade fits typical machine-vision enclosure environments. Reference designs in the Intel FPGA Industrial Video Reference Library demonstrate 1080p60 video pipelines on the 5CEA4 device variant with under 50% logic utilization.
Recommended
Factory Automation and PLC Backplane
In factory-automation backplanes and programmable logic controllers, the 5CEBA4F23C8N acts as a protocol-conversion and timing hub. The logic density supports simultaneous EtherCAT, PROFINET, Modbus TCP, and EtherNet/IP slaves in a single fabric, while the 8 I/O banks accept a mix of 3.3 V LVCMOS, 5 V tolerant (with external resistor networks), and 1.8 V LVDS signals from sensors and actuators. The PLL clock tree distributes deterministic frequencies to multiple time-critical interfaces, and the hard PCIe Gen2 controller enables a high-throughput link to a host CPU or DSP. Intel documentation shows the 5CEA4 device family delivering sub-100 Β΅s network cycle times on industrial Ethernet protocols - well within PROFINET IRT requirements. Reference designs from Intel's Industrial Automation Reference Bundle include EtherCAT slave IP running on the 5CEBA4 silicon with complete software stacks.
Recommended
Medical Imaging and Diagnostic Equipment
The 5CEBA4F23C8N's combination of logic density, deterministic timing, and embedded DSP is well matched to medical imaging front-ends such as ultrasound beamformers, patient-monitoring signal processors, and portable diagnostic analyzers. The 224 GPIO accommodates multi-channel transducer arrays, while variable-precision DSP blocks execute finite-impulse-response (FIR) and infinite-impulse-response (IIR) filters for signal conditioning with sub-microsecond latency. The 28 nm low-power process keeps board thermal dissipation within the compact form factors required for handheld analyzers. Intel publishes a Functional Safety Design Package with documented IEC 61508 SIL-2 architectures for Cyclone V E devices, accelerating certification of safety-critical patient monitors. The commercial 0-85 Β°C temperature grade fits controlled clinical environments but is not rated for autoclave or outdoor use.
Recommended
Software-Defined Radio Pre-Processing
The 5CEBA4F23C8N is well-suited to SDR pre-processing tasks such as digital down-conversion, channelization, and pulse shaping that precede a host CPU or DSP. Variable-precision DSP blocks execute mixing and filtering of wideband IF signals at sample rates above 200 MSPS, while the 3,464,192-bit block RAM provides sample buffering between antenna channels without external memory. The 8 I/O banks accept LVDS data from parallel-output ADCs such as the AD9680 family. Cyclone V E devices are optimized for low power per DSP operation, making them appropriate for multi-channel portable or vehicular SDR systems. Intel's DSP Builder Advanced blockset integrates Model-Based Design with MATLAB/Simulink, accelerating the development of OFDM, LTE, and custom waveforms directly on the 5CEA4 fabric.
Recommended
LED Video Wall and Display Controllers
The 5CEBA4F23C8N's high GPIO count and parallel LVDS capability make it effective as a scan-converter and timing controller for large LED video walls. Each GPIO bank can drive a row of constant-current LED drivers over a high-speed LVDS link, supporting refresh rates above 3840 Hz for flicker-free broadcasting. The 49,000 logic elements store display-mapped bitmaps and execute gamma correction and color-space conversion per frame. Embedded M10K RAM holds frame buffers for layering and crossfade effects, and the hard DDR3 controller interfaces to external memory for high-resolution content playback. According to Intel's Cyclone V Display Reference Designs, a single 5CEA4 device can drive LED walls up to 4096 pixels per row at 60 Hz refresh with sub-frame latency suitable for live event video production.
Recommended
Recommended Products Summary
Engineering reference data for 5CEBA4F23C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CEBA4F23C7N | 5CEBA4F23I7N | 5CEBA4F23A7N | 5CGXFC4C6F23C7N | 5CEBA4F17C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 256-ball FBGA (F17) - different |
| Logic Elements | 49,000 | 49,000 | 49,000 | 49,000 | 50,000 (Cyclone V GX) | 49,000 |
| Embedded Memory | 3,464,192 bits | 3,464,192 bits | 3,464,192 bits | 3,464,192 bits | 3,464,192 bits | 3,464,192 bits |
| Maximum User I/O | 224 | 224 | 224 | 224 | 224 | ~128 (256-BGA F17) |
| Speed Grade | 8 | 7 (faster) | 7 (faster) | 7 (slower) | 7 | 8 |
| Temperature Grade | Commercial (0 to +85 Β°C) | Commercial | Industrial (-40 to +100 Β°C) | Commercial | Commercial | Commercial |
| Integrated Transceivers | 0 (Cyclone V E) | 0 | 0 | 0 | Yes (Cyclone V GX, up to 6) | 0 |
| Approx. Unit Price (qty 1, as of 2026-09-05) | USD 92.50 | USD 105-115 (faster grade premium) | USD 120-140 (industrial premium) | USD 85-95 | USD 130-160 (transceivers add cost) | USD 70-85 (smaller package) |
Key Differentiators
- C8 speed grade offers widest timing margin for power-constrained designs (vs 5CEBA4F23C7N)
- Commercial temperature grade lowers unit cost vs industrial equivalent (vs 5CEBA4F23I7N)
- F23 484-ball BGA maximizes I/O density vs F17 256-ball (vs 5CEBA4F17C8N)
Design Notes
The 484-ball F23 FBGA package of the 5CEBA4F23C8N has a published junction-to-ambient thermal resistance of approximately 9.7 Β°C/W with a standard 4-layer JEDEC test board (per Cyclone V Device Handbook Package Information). For designs running at sustained logic utilization above 60%, add at least 8 thermal vias in a 3Γ3 array under the exposed central die pad to a solid copper inner GND plane. In enclosed industrial cabinets without forced airflow, derate total core power below 4 W to keep junction rise under 40 Β°C above ambient.
Follow the Intel Cyclone V F23 package land-pattern exactly: 1.0 mm ball pitch, 0.6 mm solder-ball diameter, 0.45 mm pad diameter with NSMD (non-solder-mask-defined) openings. Use 4 mil (100 Β΅m) trace-and-space with controlled-impedance 50 Ξ© single-ended / 100 Ξ© differential routing for high-speed signals. Route all eight I/O bank VCCIO pins independently so mixed-voltage designs (1.2/1.5/1.8/2.5/3.3 V) are isolated and decoupling is co-located within 100 mil of each ball.
Do not use a single VTT termination supply for DDR3 if the FPGA bank voltage VCCIO is 1.5 V and the VTT is shared across multiple devices - this part requires per-byte VTT to meet JEDEC JESD79-3E slew rates. Ensure the configuration scheme pin MSEL[3:0] is tied to the correct mode for your chosen boot source (AS x1 / x4, FPP, PS, JTAG); an incorrect MSEL setting is the most common cause of first-PCB non-booting failures. After power-up, confirm POR delay (>2 ms) before releasing CONFIG_DONE to the external flash device.
For multi-lane LVDS interfaces above 500 Mbps, perform pre-layout simulation with Intel's IBIS-AMI models and verify channel loss does not exceed -6 dB at the Nyquist frequency. Use length-matched intra-pair skew within 5 mil and inter-pair skew within 50 mil for 8b/10b-encoded data. Place 100 nF X7R decoupling capacitors within 100 mil of every VCC pin and add 10 Β΅F bulk capacitors at each bank supply island to suppress transient current spikes during simultaneous switching output (SSO) events.
Compliance Information
RoHS and lead-free per Intel product page. Not AEC-Q100 qualified - choose Cyclone V E industrial-temperature variants for automotive-grade applications. Compliant with REACH SVHC per Intel declaration.
