5CSXFC2C6U23C6N - Cyclone V SX SoC FPGA, 25K LE, 672-UBGA | Intel
Référence : 5CSXFC2C6U23C6N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $215 | $215,00 |
| 10 | $195 | $1 950,00 |
| 100 | $175 | $17 500,00 |
| 500 | $158 | $79 000,00 |
| 1 000 | $142 | $142 000,00 |
5CSXFC2C6U23C6N Présentation
A System-on-Chip (SoC) FPGA is an integrated circuit that combines a hardened processor subsystem (typically ARM Cortex-A cores, peripherals, and memory controllers) with programmable FPGA logic on a single silicon die. The SoC FPGA hierarchy spans: SoC -> embedded FPGA -> programmable logic -> semiconductor. Compared with a soft-core processor implemented in FPGA fabric, the hardened ARM Cortex-A9 subsystem delivers deterministic performance, lower power, and frees programmable logic for application-specific acceleration. The Cyclone V SX family specifically targets industrial motor control, video surveillance, and machine vision use cases.
Key features of the 5CSXFC2C6U23C6N include the dual-core 925 MHz ARM Cortex-A9 MPCore with NEON media engine, CoreSight debug and trace, hardware floating-point unit, and ARM TrustZone security extensions. The FPGA fabric contains 25K logic elements, 66 (18x18) hardware multipliers, 66 DSP blocks, and approximately 1.4 Mb of embedded memory. Integrated transceivers and a rich set of hardened IP peripherals (Ethernet MAC, USB, DDR controllers) reduce system BOM cost and board area.
From an architectural standpoint, the Cyclone V SX combines a 28 nm low-power TSMC process with a tightly coupled coherent interconnect between the HPS and FPGA fabric. Designers can move data between the hard processor system and FPGA logic via AXI bridges, enabling high-bandwidth accelerator offload with deterministic latency. The 'C6' speed grade provides a balance between timing margin and cost, while the 'U23' package code identifies the 672-ball fine-pitch BGA.
Typical applications include industrial machine vision with real-time preprocessing, motor control and drives, video surveillance with analytics, factory automation controllers, and portable medical imaging. The device is also well suited to software-defined radio front-ends and protocol bridging in industrial IoT gateways. When designing with this part, plan HPS boot memory (QSPI/NAND/SD), DDR3 layout, and decoupling carefully; the 672-UBGA requires careful PCB stack-up and at least 6 PCB layers with microvia technology to route the 0.8 mm pitch BGA successfully.
This page synthesizes Intel (Altera) datasheet specifications, distributor pricing, and drop-in same-footprint alternatives not found in the manufacturer datasheet alone. Use the comparison table and design notes to evaluate whether 5CSXFC2C6U23C6N matches your application requirements and whether a same-package variant with different speed grade or temperature grade is preferable.
Alternatives de remplacement direct pour 5CSXFC2C6U23C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5CSXFC2C6U23C6N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Series, Logic Elements, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5CSXFC2C6U23A7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$31.75 / unité
Voir la fiche technique →5CSXFC2C6U23I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$285 / unité
Voir la fiche technique →5CSXFC6C6U23C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$285 / unité
Voir la fiche technique →5CSXFC6D6U23C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
5CSEBA6U23C6N
✅ Remplacement direct✓ En stock
$185 / unité
Voir la fiche technique →5CSEMA2U23C6N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
5CSXFC2C6U23C6N Valeurs maximales et caractéristiques électriques
| Series | Cyclone V SX |
| Device Type | SoC FPGA (HPS + FPGA fabric) |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 925 MHz |
| Logic Elements | 25K |
| DSP Blocks | 66 (18x18 multipliers) |
| Embedded Memory | Approximately 1.4 Mbit |
| User I/O Count | 224 |
| Boîtier | 672-UBGA (U23), 23 mm x 23 mm |
| Ball Pitch | 0.8 mm |
| Speed Grade | C6 |
| Process Technology | 28 nm TSMC low-power |
| Supply Voltage (Core) | 1.1 V typical |
| Température de fonctionnement | Commercial (0C to +85C) per 'C' suffix |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du 5CSXFC2C6U23C6N 672-ubga (u23), 23 mm x 23 mm
Configuration des broches du 5CSXFC2C6U23C6N (boîtier 672-ubga (u23), 23 mm x 23 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 5CSXFC2C6U23C6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
5CSXFC2C6U23C6N convient pour 6 applications: Industrial Machine Vision, Motor Control and Drives, Video Surveillance with Analytics, Industrial IoT Gateway, Software Defined Radio Front-End, Medical Imaging Equipment.
Industrial Machine Vision
The 5CSXFC2C6U23C6N is well suited for industrial machine vision systems where a hard processor is required to run Linux-based vision frameworks (OpenCV, ROS) while FPGA fabric accelerates pixel preprocessing. The dual-core 925 MHz ARM Cortex-A9 HPS handles host-side image acquisition over GigE Vision or USB3 Vision, while the 25K logic elements and 66 DSP blocks perform real-time filtering, edge detection, and feature extraction at line rate. The 224 user I/Os allow direct connection to CMOS image sensors via parallel LVDS lanes or via the FPGA fabric to MIPI CSI-2 bridges. Compared with a discrete CPU+FPGA solution, this SoC FPGA reduces PCB area by 40% and removes inter-chip high-speed serial links. Power consumption typically runs 5-8 W depending on HPS and fabric utilization, suitable for fanless IP67 vision enclosures.
Recommandé
Motor Control and Drives
The 5CSXFC2C6U23C6N enables single-chip industrial motor control designs running field-oriented control (FOC) loops on the dual-core ARM Cortex-A9 HPS while FPGA fabric implements high-resolution PWM generation and encoder interfaces. The hardware floating-point unit on the Cortex-A9 handles the FOC math with sub-microsecond latency, while the 66 DSP blocks accelerate Park/Clarke transforms. The HPS Ethernet MAC supports EtherCAT, PROFINET, and EtherNet/IP slave stacks. Compared with a microcontroller-only solution, the SoC FPGA delivers 10x faster control-loop execution and integrates deterministic FPGA-based safety functions (STO, SLS) per IEC 61800-5-2. The 672-UBGA package provides sufficient I/O for triple-shunt current sensing, resolver excitation, and isolated gate-driver control.
Recommandé
Video Surveillance with Analytics
The 5CSXFC2C6U23C6N powers next-generation IP video surveillance cameras and NVR appliances running on-device analytics. The dual-core ARM Cortex-A9 runs a Linux distribution (typically Yocto-built) hosting ONVIF server, RTSP streaming, and motion detection pipelines, while FPGA fabric accelerates H.264/H.265 encoding at low latency. The 25K logic elements comfortably implement a single 1080p60 encode pipeline with rate-control, and the HPS DDR3 controller supports the 300+ MB/s memory bandwidth needed for 4K preview streams. The 925 MHz HPS clock supports software-based analytics (person detection, license plate recognition) at 5-10 fps for secondary streams. Compared with separate SoC plus FPGA designs, this part reduces BOM cost and PCB footprint significantly, enabling smaller PoE-powered camera form factors.
Recommandé
Industrial IoT Gateway
The 5CSXFC2C6U23C6N serves as the central controller for industrial IoT gateways aggregating multiple fieldbuses (PROFINET, EtherCAT, Modbus, CAN) and publishing data to cloud platforms. The dual-core ARM Cortex-A9 runs containerized edge applications (Node-RED, Docker) while FPGA fabric implements deterministic real-time protocol handling. The 224 user I/Os and HPS peripherals (USB, Ethernet, SD/MMC) support multiple physical interfaces in parallel. Compared with low-power Cortex-M gateways, the SoC FPGA handles 10x more concurrent fieldbus streams and supports on-device machine-learning inference via the FPGA fabric. The 1.1 V core supply and power-management features keep idle power under 2 W, suitable for DIN-rail mounted enclosures.
Recommandé
Software Defined Radio Front-End
The 5CSXFC2C6U23C6N is used in software-defined radio baseband processing where the dual-core ARM Cortex-A9 handles MAC-layer stacks and network protocols while the FPGA fabric implements digital up/down-conversion (DUC/DDC) and channelization. The 66 DSP blocks provide sufficient capacity for 4-8 simultaneous DDC channels at 20 MHz bandwidth. The 925 MHz HPS clock supports real-time GNU Radio or proprietary waveforms, and the HPS DDR3 controller sustains the data rates required for streaming ADC samples to host processors. Per the Cyclone V device overview, the SX family integrates well with RF front-end modules via LVDS and external JESD204B serializers. Power consumption at full utilization is approximately 7-9 W, requiring attention to thermal design.
Recommandé
Medical Imaging Equipment
The 5CSXFC2C6U23C6N enables compact medical imaging devices such as portable ultrasound and endoscopy processors where a hard processor running the application UI and FPGA fabric implementing beamforming or image reconstruction must coexist on one chip. The dual-core ARM Cortex-A9 with NEON accelerates image scaling, while 25K logic elements implement 16-32 channel beamforming pipelines. The hardware TrustZone on the Cortex-A9 supports patient-data isolation per medical-device cybersecurity guidance (FDA premarket cybersecurity guidance). The 672-UBGA package provides ample I/O for probe-interface connectors and display outputs. Compared with discrete CPU+FPGA designs, the SoC FPGA reduces system size by 35-45%, critical for portable cart-based medical equipment where battery life and ergonomics matter.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5CSXFC2C6U23C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5CSXFC2C6U23A7N | 5CSXFC2C6U23I7N | 5CSXFC6C6U23C6N | 5CSXFC6D6U23C8N | 5CSEBA6U23C6N | 5CSEMA2U23C6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same |
| Family | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SE | Cyclone V SE |
| Logic Elements | 25K | 25K (same) | 25K (same) | 40K (+60%) | 40K (+60%) | 110K (+340%) | 25K (same) |
| DSP Blocks | 66 | 66 (same) | 66 (same) | 112 (+70%) | 112 (+70%) | 224 (+239%) | 66 (same) |
| HPS | Dual-core ARM Cortex-A9 925 MHz | Dual-core ARM Cortex-A9 925 MHz (same) | Dual-core ARM Cortex-A9 925 MHz (same) | Dual-core ARM Cortex-A9 925 MHz (same) | Dual-core ARM Cortex-A9 925 MHz (same) | Dual-core ARM Cortex-A9 925 MHz (same) | Dual-core ARM Cortex-A9 925 MHz (same) |
| Speed Grade | C6 | A7 (slower Fmax) | I7 (slower Fmax) | C6 (same) | C8 (faster Fmax) | C6 (same) | C6 (same) |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (same) | Commercial (same) | Commercial (same) | Commercial (same) |
| User I/O | 224 | 224 (same) | 224 (same) | 224 (same) | 224 (same) | 224 (same) | 224 (same) |
Principaux différenciateurs
- Cyclone V SX tier with dual-core ARM Cortex-A9 HPS plus 25K logic elements in a single 672-UBGA package (vs 5CEBA2F17C8N (Cyclone V E FPGA-only))
- Same-package migration path to 40K and 110K logic element variants in the U23 footprint (vs 5CSXFC2C6U23A7N (same density, different temp/speed))
- Lower cost per logic element than Zynq-7000 in the same density tier (vs Xilinx Zynq-7010 (XC7Z010))
Notes de conception
The 672-UBGA package at 0.8 mm ball pitch requires a minimum 6-layer PCB stack-up with 1 oz copper outer layers and HDI microvia technology (laser-drilled 0.1 mm vias with 0.2 mm capture pads). Per the Altera Cyclone V package user guide, escape routing for the inner BGA rows must use via-in-pad or dog-bone fan-out with microvias. For low-cost 4-layer designs, plan for a 4+ mil dielectric between BGA and first inner layer, and verify signal integrity on DDR3 routes with the Quartus Prime DDR3 controller IP constraints. Ground planes should be unbroken under the BGA area to provide a low-impedance return path for the HPS Ethernet and DDR interfaces.
The 5CSXFC2C6U23C6N requires at least four separate power rails: VCC_HPS (1.1 V core for ARM subsystem), VCC_FPGA (1.1 V core for fabric), VCCIO (1.5/1.8/2.5/3.3 V user I/O banks, configurable per bank), and VCC_PLL (1.1/2.5 V for PLLs). Per the Altera power management guide, use a dedicated LDO or switching regulator per rail with bulk decoupling of 22 uF + 100 nF placed close to each BGA power pin group. Power sequencing must follow the VCC_HPS ramp before VCC_FPGA to avoid HPS latch-up during cold start. Total typical power is 5-8 W depending on toggle rate and HPS utilization.
At typical utilization (50% logic + 50% HPS load) the 5CSXFC2C6U23C6N dissipates 5-7 W, requiring thermal management. Per the Cyclone V device thermal characterization report, the 672-UBGA package has a theta_JA of approximately 10 C/W with a standard 4-layer JEDEC test board, giving a junction-to-ambient rise of 50-70 C above ambient at full load. In production designs, place a thermal pad array on the bottom side of the BGA or use a heat spreader to keep junction temperature below 100 C in commercial-temperature designs. Industrial-temperature variants (A7/I7 suffix) must keep junction below 100 C for the -40C to +100C ambient range.
Three common pitfalls when designing with this part: (1) Do not confuse Cyclone V SX with Cyclone V SE - the SX family (this part) targets maximum fabric density with HPS, while SE targets cost-optimized HPS designs; selecting the wrong family affects Quartus Prime IP licensing and configuration bitstream size. (2) The HPS EMAC does not include a PHY - external Ethernet PHY (RGMII interface) is required, and PHYREF clock must be sourced from a dedicated HPS clock pin, not a fabric clock pin. (3) Configuration mode selection via MSEL pins must be pulled correctly at power-up; incorrect MSEL values cause the device to fail to configure. Always verify MSEL settings against the Cyclone V configuration user guide table before PCB fab.
Informations de conformité
RoHS and lead-free per Altera (now Intel) Cyclone V product page. AEC-Q100 not applicable - this is a commercial-temperature SoC FPGA. REACH compliance stated by Intel. Halogen-free status not explicitly stated in verified data - set to unknown.
