5M2210ZF324I5N - 2210 LE MAX V CPLD, 324-ball FBGA | Intel
Référence : 5M2210ZF324I5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.71 | $8,71 |
| 10 | $8.2 | $82,00 |
| 100 | $7.1 | $710,00 |
| 500 | $6.45 | $3 225,00 |
| 1 000 | $5.95 | $5 950,00 |
5M2210ZF324I5N Présentation
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic device that combines the instant-on characteristics of small PAL/GAL architectures with the higher logic density and I/O count of an FPGA-like fabric. In the broader system hierarchy, a CPLD sits below an FPGA in density but above discrete 74-series glue logic, and is most commonly used for I/O expansion, bus bridging, power-sequencing logic, and control-plane state machines in industrial, communications, and consumer designs. The MAX V family specifically targets low standby power (down to 25 uA typical) and instant-on operation after power-up.
Key features of the 5M2210ZF324I5N include 2210 LEs, up to 272 user I/O pins, 172 Kbits of user flash, internal oscillator support, JTAG and ISP programming, hot-socketing tolerance, and a commercial-to-industrial operating temperature range up to +100 C junction. The device is built on a 1.8 V core process with multi-voltage I/O banks that support LVCMOS, LVTTL, and LVDS-style signaling on the same die, eliminating the need for external level translation. The 324-ball FBGA package offers high board-density routing with the supply/ground pin distribution needed for low-EMI operation in noise-sensitive control loops.
Architecturally, the MAX V CPLD uses a non-volatile flash-based Look-Up Table (LUT) array combined with a global routing fabric, providing instant-on behavior (sub-1 ms configuration) and infinite in-system reprogrammability. The integrated flash eliminates an external boot PROM and reduces total BOM count versus SRAM-based FPGAs that require a configuration memory. JTAG (IEEE 1149.1) and a passive serial configuration port are supported for in-system programming and boundary-scan test.
Typical applications include industrial control and I/O expansion modules, telecommunications line cards and backplane glue logic, consumer electronics display and key-scan interfaces, automotive body and infotainment subsystems, and any embedded design that requires low standby power combined with deterministic instant-on behavior. The wide VCCIO range also makes the device a strong fit for mixed-voltage designs that bridge 3.3 V MCUs to 1.8 V ASICs or FPGAs.
When designing with this device, pay attention to VCCINT decoupling (1.8 V core) and place a 0.1 uF plus 10 uF capacitor pair close to each supply pin group. Configure unused I/O banks as LVCMOS inputs with internal weak pull-ups to reduce in-rush current at hot insertion. Quartus Prime or the legacy MAX+PLUS II toolchain is used to compile and program the device.
This page synthesizes distributor stock and pricing, drop-in same-package alternatives from the Intel MAX V family, and practical design notes that supplement the manufacturer datasheet with curated engineer-friendly context.
Alternatives de remplacement direct pour 5M2210ZF324I5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5M2210ZF324I5N (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Operating Temperature, Programming Interface, User Flash Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5M2210ZF324I5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$23.85 / unité
Voir la fiche technique →5M2210ZF324C4N
✅ Remplacement direct✓ En stock
$22.45 / unité
Voir la fiche technique →5M2210ZF324C5N
✅ Remplacement direct✓ En stock
$8.4 / unité
Voir la fiche technique →5M2210ZF324A5N
✅ Remplacement direct✓ En stock
$44.25 / unité
Voir la fiche technique →5M1270ZF324I5N
✅ Remplacement direct✓ En stock
$13.95 / unité
Voir la fiche technique →5M2210ZF324I5N Valeurs maximales et caractéristiques électriques
| Product Type | CPLD - Complex Programmable Logic Device |
| Series | MAX V |
| Logic Elements (LEs) | 2210 |
| User I/O Pins (max) | 272 |
| Embedded User Flash | 172 Kbits |
| Internal Supply Voltage VCCINT | 1.8 V (1.71 V to 1.89 V) |
| I/O Supply Voltages VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Boîtier | 324-ball FBGA (LBGA) |
| Type de montage | Surface Mount (BGA) |
| Operating Temperature (Industrial) | -40 C to +100 C (TJ) |
| Programming Interface | JTAG (IEEE 1149.1) + ISP |
| Configuration Method | Non-volatile flash, instant-on |
| Hot Socketing | Supported |
| Typical Standby Current | 25 uA (Iccstndby, data-dependent) |
| Internal Oscillator | Yes |
| Statut RoHS | Compliant |
Guide de configuration des broches du 5M2210ZF324I5N 324-ball fbga (lbga)
Configuration des broches du 5M2210ZF324I5N (boîtier 324-ball fbga (lbga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 5M2210ZF324I5N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
5M2210ZF324I5N convient pour 6 applications: Industrial I/O Expansion and Glue Logic, Telecommunications Backplane Bridging, Automotive Body Electronics and Infotainment, Consumer Electronics Display and Key-Scan Interfaces, Power Sequencing and Supervisory Logic, Motor Control and PWM Generation.
Industrial I/O Expansion and Glue Logic
The 5M2210ZF324I5N is purpose-built for industrial I/O expansion where an MCU's native GPIO is insufficient. With 2210 LEs, 272 user I/Os, and multi-voltage VCCIO support (1.2 V to 3.3 V), the device bridges 3.3 V MCUs to 1.8 V sensors, opto-isolators, and 5 V-tolerant legacy peripherals in a single chip. Its 1.8 V VCCINT core (1.71 V to 1.89 V) draws only 25 uA typical standby current, ideal for always-on industrial controllers. Designers typically pair the CPLD with an STM32 or similar MCU to handle address decoding, PWM fan control, and watchdog logic that would otherwise consume main-processor cycles.
Recommandé
Telecommunications Backplane Bridging
The 5M2210ZF324I5N serves as a deterministic, instant-on glue-logic bridge on telecom line cards where sub-millisecond boot is mandatory after power-up or brown-out recovery. The MAX V family's non-volatile flash configuration boots without an external boot PROM, while 172 Kbits of user flash accommodates small lookup tables and revision IDs. The 324-ball FBGA package supports high-pin-count parallel buses typical of TDM/PCM backplane interfaces, and the multi-voltage VCCIO banks interface cleanly to both legacy 3.3 V framers and modern 1.8 V SerDes logic on the same board.
Recommandé
Automotive Body Electronics and Infotainment
With an industrial temperature range of -40 C to +100 C junction and hot-socketing tolerance, the 5M2210ZF324I5N suits automotive body controllers, HVAC modules, and infotainment I/O hubs. The 2210 LEs handle CAN/LIN gateway logic, key-scan matrices, and backlight PWM without burdening the main MCU. The non-volatile instant-on behavior is critical for CAN wake-up sequences that must complete within 100 ms of ignition. The 324-ball FBGA footprint supports dense routing on space-constrained instrument-cluster PCBs.
Recommandé
Consumer Electronics Display and Key-Scan Interfaces
The 5M2210ZF324I5N's 272 user I/Os and instant-on flash configuration make it ideal for consumer product front-panel interfaces such as dishwasher, washing-machine, and microwave keypads that require 16x8 or larger key-scan matrices. The CPLD decodes the matrix, debounces inputs, drives LED backlight PWM at 200 Hz to 1 kHz, and presents a clean I2C or SPI interface to the main MCU. Standby current of 25 uA typical keeps always-on appliances within Energy Star idle budgets.
Recommandé
Power Sequencing and Supervisory Logic
The 5M2210ZF324I5N excels at multi-rail power sequencing in FPGA-based designs, DSP modules, and ASIC prototyping boards where multiple voltage rails (1.0 V, 1.2 V, 1.8 V, 3.3 V) must come up in a specific order. The CPLD's multi-voltage VCCIO banks interface directly to each rail's PG (power-good) signal, and the device drives discrete MOSFET gate signals or EN pins on point-of-load converters. The instant-on flash eliminates the boot-PROM requirement seen with SRAM-based PLDs, while JTAG support enables in-system reprogramming of the sequencing script.
Recommandé
Motor Control and PWM Generation
The 5M2210ZF324I5N generates precise, multi-channel PWM waveforms for BLDC motor control, stepper sequencing, and solenoid drivers where dedicated MCUs are overkill. Up to 272 user I/Os and deterministic pin-to-pin propagation delay support complementary PWM pairs with dead-time insertion, while the multi-voltage I/O banks interface directly to 3.3 V gate drivers or 1.8 V DSP controllers. JTAG-based ISP enables field firmware updates for motor-control calibration tables without disassembly.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5M2210ZF324I5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5M2210ZF324I5 | 5M2210ZF324C4N | 5M2210ZF324C5N | 5M2210ZF324A5N | 5M1270ZF324I5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball FBGA | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Logic Elements | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 1270 LEs |
| User Flash | 172 Kbits | 172 Kbits | 172 Kbits | 172 Kbits | 172 Kbits | 8 Kbits |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | Automotive grade | -40 C to +100 C |
| User I/O (max) | 272 | 272 | 272 | 272 | 272 | 272 |
| VCCINT | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| VCCIO Options | 1.2 / 1.5 / 1.8 / 2.5 / 3.3 V | Same multi-voltage | Same multi-voltage | Same multi-voltage | Same multi-voltage | Same multi-voltage |
| Qty-1 Price (USD, 2026-09-06) | 8.71 | Similar | Slightly lower | Slightly higher | Higher (automotive) | Lower (smaller die) |
Principaux différenciateurs
- Highest logic density in the MAX V 324-ball FBGA family (vs 5M1270ZF324I5N)
- Industrial temperature grade for harsh environments (vs 5M2210ZF324C4N)
- Multi-voltage I/O in a single device (vs 5M160ZE64I5N (MAX V E64-package lower-density cousin))
Notes de conception
The 5M2210ZF324I5N requires a clean 1.8 V VCCINT rail (1.71 V to 1.89 V) and one or more VCCIO rails (1.2 V to 3.3 V). Place a 0.1 uF X7R ceramic capacitor within 3 mm of each VCCINT pin pair, and a single 10 uF bulk capacitor per VCCIO bank. Use a ferrite bead on the VCCINT feed if the upstream LDO is shared with a noisy switching converter. Power-up sequence is not strictly required (the device is hot-socketing tolerant), but a monotonic 1.8 V ramp avoids I/O tri-state glitches during initialization.
The 324-ball FBGA has a 1.0 mm ball pitch, which requires laser-drilled micro-vias and a 4-layer or 6-layer stack-up for reliable assembly. Escape-route all VCCINT and GND balls to inner ground/power planes with short stubs (less than 0.5 mm). Keep JTAG TDI/TDO/TMS/TCK traces short (under 50 mm) and length-matched to within 5 mm. Use 0.8 mm or 1.0 mm BGA escape vias and follow Intel/Altera's reference layout in the MAX V handbook for fan-out details.
Estimated: at typical commercial use with 50% I/O toggling at 50 MHz, the 5M2210ZF324I5N dissipates roughly 0.3 W to 0.6 W. The 324-ball FBGA has a theta-JA of approximately 25 C/W on a JEDEC 4-layer test board, giving a junction-to-ambient rise of 8 C to 15 C. At the +100 C industrial junction limit, this keeps the design within safe thermal envelopes. For higher I/O toggle rates or extended industrial enclosures, use thermal vias under the package center balls to a dedicated ground plane.
Do not leave unused I/O pins floating - configure them as LVCMOS inputs with internal weak pull-up enabled, or drive them to a defined state in the Quartus pin planner, to avoid in-rush current at power-up. Do not apply VCCIO before VCCINT - while hot-socketing is supported, simultaneous power-up with VCCIO ahead of VCCINT by more than 100 ms can trigger I/O latch-up. Finally, when migrating from MAX II designs, note that MAX V has a different User Flash programming algorithm; recompile the POF file in Quartus Prime.
Informations de conformité
RoHS and REACH compliance per Intel/Altera material declaration as of 2026-09-06. Not AEC-Q100 qualified; for automotive-grade screening use 5M2210ZF324A5N variant. Conflict-minerals statement available from Intel supplier portal.
