5M2210ZF324I5N - 2210 LE MAX V CPLD, 324-ball FBGA | Intel
部品番号: 5M2210ZF324I5N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8.71 | $8.71 |
| 10 | $8.2 | $82.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.45 | $3,225.00 |
| 1,000 | $5.95 | $5,950.00 |
5M2210ZF324I5N 概要
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic device that combines the instant-on characteristics of small PAL/GAL architectures with the higher logic density and I/O count of an FPGA-like fabric. In the broader system hierarchy, a CPLD sits below an FPGA in density but above discrete 74-series glue logic, and is most commonly used for I/O expansion, bus bridging, power-sequencing logic, and control-plane state machines in industrial, communications, and consumer designs. The MAX V family specifically targets low standby power (down to 25 uA typical) and instant-on operation after power-up.
Key features of the 5M2210ZF324I5N include 2210 LEs, up to 272 user I/O pins, 172 Kbits of user flash, internal oscillator support, JTAG and ISP programming, hot-socketing tolerance, and a commercial-to-industrial operating temperature range up to +100 C junction. The device is built on a 1.8 V core process with multi-voltage I/O banks that support LVCMOS, LVTTL, and LVDS-style signaling on the same die, eliminating the need for external level translation. The 324-ball FBGA package offers high board-density routing with the supply/ground pin distribution needed for low-EMI operation in noise-sensitive control loops.
Architecturally, the MAX V CPLD uses a non-volatile flash-based Look-Up Table (LUT) array combined with a global routing fabric, providing instant-on behavior (sub-1 ms configuration) and infinite in-system reprogrammability. The integrated flash eliminates an external boot PROM and reduces total BOM count versus SRAM-based FPGAs that require a configuration memory. JTAG (IEEE 1149.1) and a passive serial configuration port are supported for in-system programming and boundary-scan test.
Typical applications include industrial control and I/O expansion modules, telecommunications line cards and backplane glue logic, consumer electronics display and key-scan interfaces, automotive body and infotainment subsystems, and any embedded design that requires low standby power combined with deterministic instant-on behavior. The wide VCCIO range also makes the device a strong fit for mixed-voltage designs that bridge 3.3 V MCUs to 1.8 V ASICs or FPGAs.
When designing with this device, pay attention to VCCINT decoupling (1.8 V core) and place a 0.1 uF plus 10 uF capacitor pair close to each supply pin group. Configure unused I/O banks as LVCMOS inputs with internal weak pull-ups to reduce in-rush current at hot insertion. Quartus Prime or the legacy MAX+PLUS II toolchain is used to compile and program the device.
This page synthesizes distributor stock and pricing, drop-in same-package alternatives from the Intel MAX V family, and practical design notes that supplement the manufacturer datasheet with curated engineer-friendly context.
ドロップイン代替品: 5M2210ZF324I5N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5M2210ZF324I5N （同一形状・フットプリント） — 相違点: Package, Configuration Memory, Operating Temperature, Programming Interface, User Flash Memory.
クイック比較ツール — 並列比較する代替部品を選択:
5M2210ZF324I5
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$23.85 / 個
データシートを見る →5M2210ZF324C4N
✅ ドロップイン✓ 在庫あり
$22.45 / 個
データシートを見る →5M2210ZF324C5N
✅ ドロップイン✓ 在庫あり
$8.4 / 個
データシートを見る →5M2210ZF324A5N
✅ ドロップイン✓ 在庫あり
$44.25 / 個
データシートを見る →5M1270ZF324I5N
✅ ドロップイン✓ 在庫あり
$13.95 / 個
データシートを見る →5M2210ZF324I5N 最大定格＆電気的特性
| Product Type | CPLD - Complex Programmable Logic Device |
| Series | MAX V |
| Logic Elements (LEs) | 2210 |
| User I/O Pins (max) | 272 |
| Embedded User Flash | 172 Kbits |
| Internal Supply Voltage VCCINT | 1.8 V (1.71 V to 1.89 V) |
| I/O Supply Voltages VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| パッケージ | 324-ball FBGA (LBGA) |
| 実装タイプ | Surface Mount (BGA) |
| Operating Temperature (Industrial) | -40 C to +100 C (TJ) |
| Programming Interface | JTAG (IEEE 1149.1) + ISP |
| Configuration Method | Non-volatile flash, instant-on |
| Hot Socketing | Supported |
| Typical Standby Current | 25 uA (Iccstndby, data-dependent) |
| Internal Oscillator | Yes |
| RoHS ステータス | Compliant |
5M2210ZF324I5N 324-ball fbga (lbga) ピン配置ガイド
5M2210ZF324I5N (324-ball fbga (lbga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 5M2210ZF324I5N.
詳細は データシート をご参照ください。
主な用途
5M2210ZF324I5N の用途: 6 件s: Industrial I/O Expansion and Glue Logic, Telecommunications Backplane Bridging, Automotive Body Electronics and Infotainment, Consumer Electronics Display and Key-Scan Interfaces, Power Sequencing and Supervisory Logic, Motor Control and PWM Generation.
Industrial I/O Expansion and Glue Logic
The 5M2210ZF324I5N is purpose-built for industrial I/O expansion where an MCU's native GPIO is insufficient. With 2210 LEs, 272 user I/Os, and multi-voltage VCCIO support (1.2 V to 3.3 V), the device bridges 3.3 V MCUs to 1.8 V sensors, opto-isolators, and 5 V-tolerant legacy peripherals in a single chip. Its 1.8 V VCCINT core (1.71 V to 1.89 V) draws only 25 uA typical standby current, ideal for always-on industrial controllers. Designers typically pair the CPLD with an STM32 or similar MCU to handle address decoding, PWM fan control, and watchdog logic that would otherwise consume main-processor cycles.
おすすめ
Telecommunications Backplane Bridging
The 5M2210ZF324I5N serves as a deterministic, instant-on glue-logic bridge on telecom line cards where sub-millisecond boot is mandatory after power-up or brown-out recovery. The MAX V family's non-volatile flash configuration boots without an external boot PROM, while 172 Kbits of user flash accommodates small lookup tables and revision IDs. The 324-ball FBGA package supports high-pin-count parallel buses typical of TDM/PCM backplane interfaces, and the multi-voltage VCCIO banks interface cleanly to both legacy 3.3 V framers and modern 1.8 V SerDes logic on the same board.
おすすめ
Automotive Body Electronics and Infotainment
With an industrial temperature range of -40 C to +100 C junction and hot-socketing tolerance, the 5M2210ZF324I5N suits automotive body controllers, HVAC modules, and infotainment I/O hubs. The 2210 LEs handle CAN/LIN gateway logic, key-scan matrices, and backlight PWM without burdening the main MCU. The non-volatile instant-on behavior is critical for CAN wake-up sequences that must complete within 100 ms of ignition. The 324-ball FBGA footprint supports dense routing on space-constrained instrument-cluster PCBs.
おすすめ
Consumer Electronics Display and Key-Scan Interfaces
The 5M2210ZF324I5N's 272 user I/Os and instant-on flash configuration make it ideal for consumer product front-panel interfaces such as dishwasher, washing-machine, and microwave keypads that require 16x8 or larger key-scan matrices. The CPLD decodes the matrix, debounces inputs, drives LED backlight PWM at 200 Hz to 1 kHz, and presents a clean I2C or SPI interface to the main MCU. Standby current of 25 uA typical keeps always-on appliances within Energy Star idle budgets.
おすすめ
Power Sequencing and Supervisory Logic
The 5M2210ZF324I5N excels at multi-rail power sequencing in FPGA-based designs, DSP modules, and ASIC prototyping boards where multiple voltage rails (1.0 V, 1.2 V, 1.8 V, 3.3 V) must come up in a specific order. The CPLD's multi-voltage VCCIO banks interface directly to each rail's PG (power-good) signal, and the device drives discrete MOSFET gate signals or EN pins on point-of-load converters. The instant-on flash eliminates the boot-PROM requirement seen with SRAM-based PLDs, while JTAG support enables in-system reprogramming of the sequencing script.
おすすめ
Motor Control and PWM Generation
The 5M2210ZF324I5N generates precise, multi-channel PWM waveforms for BLDC motor control, stepper sequencing, and solenoid drivers where dedicated MCUs are overkill. Up to 272 user I/Os and deterministic pin-to-pin propagation delay support complementary PWM pairs with dead-time insertion, while the multi-voltage I/O banks interface directly to 3.3 V gate drivers or 1.8 V DSP controllers. JTAG-based ISP enables field firmware updates for motor-control calibration tables without disassembly.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5M2210ZF324I5N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5M2210ZF324I5 | 5M2210ZF324C4N | 5M2210ZF324C5N | 5M2210ZF324A5N | 5M1270ZF324I5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball FBGA | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Logic Elements | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 1270 LEs |
| User Flash | 172 Kbits | 172 Kbits | 172 Kbits | 172 Kbits | 172 Kbits | 8 Kbits |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | Automotive grade | -40 C to +100 C |
| User I/O (max) | 272 | 272 | 272 | 272 | 272 | 272 |
| VCCINT | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| VCCIO Options | 1.2 / 1.5 / 1.8 / 2.5 / 3.3 V | Same multi-voltage | Same multi-voltage | Same multi-voltage | Same multi-voltage | Same multi-voltage |
| Qty-1 Price (USD, 2026-09-06) | 8.71 | Similar | Slightly lower | Slightly higher | Higher (automotive) | Lower (smaller die) |
主な差別化要因
- Highest logic density in the MAX V 324-ball FBGA family （vs 5M1270ZF324I5N)
- Industrial temperature grade for harsh environments （vs 5M2210ZF324C4N)
- Multi-voltage I/O in a single device （vs 5M160ZE64I5N (MAX V E64-package lower-density cousin))
設計ノート
The 5M2210ZF324I5N requires a clean 1.8 V VCCINT rail (1.71 V to 1.89 V) and one or more VCCIO rails (1.2 V to 3.3 V). Place a 0.1 uF X7R ceramic capacitor within 3 mm of each VCCINT pin pair, and a single 10 uF bulk capacitor per VCCIO bank. Use a ferrite bead on the VCCINT feed if the upstream LDO is shared with a noisy switching converter. Power-up sequence is not strictly required (the device is hot-socketing tolerant), but a monotonic 1.8 V ramp avoids I/O tri-state glitches during initialization.
The 324-ball FBGA has a 1.0 mm ball pitch, which requires laser-drilled micro-vias and a 4-layer or 6-layer stack-up for reliable assembly. Escape-route all VCCINT and GND balls to inner ground/power planes with short stubs (less than 0.5 mm). Keep JTAG TDI/TDO/TMS/TCK traces short (under 50 mm) and length-matched to within 5 mm. Use 0.8 mm or 1.0 mm BGA escape vias and follow Intel/Altera's reference layout in the MAX V handbook for fan-out details.
Estimated: at typical commercial use with 50% I/O toggling at 50 MHz, the 5M2210ZF324I5N dissipates roughly 0.3 W to 0.6 W. The 324-ball FBGA has a theta-JA of approximately 25 C/W on a JEDEC 4-layer test board, giving a junction-to-ambient rise of 8 C to 15 C. At the +100 C industrial junction limit, this keeps the design within safe thermal envelopes. For higher I/O toggle rates or extended industrial enclosures, use thermal vias under the package center balls to a dedicated ground plane.
Do not leave unused I/O pins floating - configure them as LVCMOS inputs with internal weak pull-up enabled, or drive them to a defined state in the Quartus pin planner, to avoid in-rush current at power-up. Do not apply VCCIO before VCCINT - while hot-socketing is supported, simultaneous power-up with VCCIO ahead of VCCINT by more than 100 ms can trigger I/O latch-up. Finally, when migrating from MAX II designs, note that MAX V has a different User Flash programming algorithm; recompile the POF file in Quartus Prime.
コンプライアンス情報
RoHS and REACH compliance per Intel/Altera material declaration as of 2026-09-06. Not AEC-Q100 qualified; for automotive-grade screening use 5M2210ZF324A5N variant. Conflict-minerals statement available from Intel supplier portal.
