5M40ZM64I5 - MAX V CPLD, 32 Macro Cells, 118.3MHz, MBGA-64 | Intel
Référence : 5M40ZM64I5 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.5 | $6,50 |
| 10 | $5.85 | $58,50 |
| 100 | $5.2 | $520,00 |
| 500 | $4.6 | $2 300,00 |
| 1 000 | $4.05 | $4 050,00 |
5M40ZM64I5 Présentation
A Complex Programmable Logic Device (CPLD) is a non-volatile programmable logic device that combines multiple PAL-like logic blocks on a single die with a programmable interconnect fabric. Unlike SRAM-based FPGAs, CPLDs retain their configuration without external memory, providing instant-on behavior at power-up. Within the broader programmable logic taxonomy, CPLDs sit between discrete logic gates and FPGAs - simpler than FPGAs but more integrated than discrete TTL/CMOS glue. MAX V devices specifically use a low-power 1.8 V process and on-chip Flash configuration memory.
Key features of the 5M40ZM64I5 include 32 macro cells (40 logic elements), 1.8 V single supply operation, 118.3 MHz maximum internal frequency, 7.5 ns pin-to-pin logic delay, and IEEE 1149.1 JTAG boundary-scan support. The MBGA-64 package is a 0.5 mm pitch micro ball-grid-array measuring approximately 4.5 x 4.5 mm, well suited to space-constrained designs. The I=industrial grade suffix denotes the -40C to +100C operating range.
Architecturally, the 5M40ZM64I5 uses the classic MAX V Logic Array Block (LAB) structure with each LAB containing 16 macro cells. Each macro cell includes a programmable AND/OR array, a flip-flop, and a product-term allocator. Configuration is stored in on-chip Flash, eliminating external boot memory and enabling deterministic power-on behavior.
Typical applications include I/O expansion and voltage-level translation between MCUs and peripherals, address decoding and chip-select generation for memory subsystems, bus-interface bridging between legacy and modern buses, LED and display control logic in industrial HMI panels, and power-sequencing state machines in telecom and embedded systems. The instant-on behavior also suits safety-critical firmware glue that must be active before the main processor boots.
When designing with this device, evaluate the available I/O count against your signal fan-out and verify that the Quartus II / Quartus Prime toolchain supports the device variant. The MBGA-64 footprint requires reflow soldering and X-ray inspection; PCB pad design must follow JEDEC MS-028 for fine-pitch BGA reliability.
Alternatives de remplacement direct pour 5M40ZM64I5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5M40ZM64I5 (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Configuration Memory, Mounting Type, Maximum Internal Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5M40ZM64I5N
✅ Remplacement direct✓ En stock
$2.45 / unité
Voir la fiche technique →5M80ZM64I5
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
5M40ZM64C5N
✅ Remplacement direct✓ En stock
$1.45 / unité
Voir la fiche technique →5M40ZM64C5
✅ Remplacement direct✓ En stock
$4.05 / unité
Voir la fiche technique →5M40ZM64C4N
✅ Remplacement direct✓ En stock
$0.48 / unité
Voir la fiche technique →5M40ZM64I5 Valeurs maximales et caractéristiques électriques
| Family | MAX V |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macro Cells | 32 |
| Logic Elements | 40 |
| Maximum Internal Frequency | 118.3 MHz |
| Pin-to-Pin Logic Delay (tPD) | 7.5 ns |
| Core Supply Voltage | 1.8 V |
| Plage de température de fonctionnement | -40C to +100C (Industrial, 'I' suffix) |
| Package Type | MBGA-64 (Micro BGA, 64-ball) |
| Package Code | TFBGA / MBGA, 0.5 mm pitch |
| Package Shape | Square |
| Configuration Memory | On-chip Flash (non-volatile) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Type de montage | Surface Mount |
Guide de configuration des broches du 5M40ZM64I5 square
Configuration des broches du 5M40ZM64I5 (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 5M40ZM64I5.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
5M40ZM64I5 convient pour 6 applications: I/O Expansion and Voltage-Level Translation, Address Decoding and Chip-Select Generation, Bus Interface Bridging (Legacy to Modern), Industrial HMI LED and Display Control, Power Sequencing State Machines, Glue Logic in Safety-Critical Embedded Systems.
I/O Expansion and Voltage-Level Translation
The 5M40ZM64I5 excels at I/O expansion between low-pin-count microcontrollers and multi-voltage peripherals. With 32 macro cells and 7.5 ns pin-to-pin delay, it can implement bidirectional level-shifting bridges between 1.8 V MCUs and 3.3 V or 5 V peripherals such as sensors, displays, and memory. The MAX V family supports mixed I/O voltage banks when supplied from the appropriate VCCIO rail, allowing direct connection to both 1.8 V and 3.3 V devices without external level shifters. The non-volatile Flash configuration means the bridge is active before the MCU finishes booting, eliminating start-up contention on shared buses. This makes the 5M40ZM64I5 a typical choice in industrial sensor hubs where deterministic bus arbitration is required.
Recommandé
Address Decoding and Chip-Select Generation
In embedded systems with multiple memory or peripheral devices sharing an address/data bus, the 5M40ZM64I5 provides fast deterministic address decoding. Its 7.5 ns tPD delivers chip-select signals within one clock cycle of address assertion, eliminating wait states. With 32 macro cells, the device can decode up to 8-12 chip-select regions with overlapping windows - sufficient for typical MCU designs that combine Flash, SRAM, FRAM, and multiple peripherals. Unlike a discrete 74HC138 decoder, the 5M40ZM64I5 allows late-stage address-map changes via JTAG without board rework, accelerating firmware iteration during development.
Recommandé
Bus Interface Bridging (Legacy to Modern)
The 5M40ZM64I5 is well suited to bridging between legacy parallel buses (Intel 8051, Motorola 6800, ISA-style) and modern serial interfaces (SPI, I2C, UART). Its 118.3 MHz fMAX and 32 macro cells allow parallel-to-serial state machines, FIFO flag generation, and protocol translation in a single device. The on-chip Flash supports in-field reconfiguration via JTAG, letting the same hardware serve multiple bus standards through firmware updates. Industrial and telecom equipment with mixed legacy/modern buses frequently use MAX V CPLDs for exactly this bridging role.
Recommandé
Industrial HMI LED and Display Control
In industrial human-machine interface (HMI) panels, the 5M40ZM64I5 drives multiplexed LED matrices, seven-segment displays, and character LCDs. Its 7.5 ns tPD supports high-refresh-rate PWM dimming without visible flicker, and the 1.8 V core reduces thermal dissipation in sealed enclosures. Non-volatile configuration ensures the display remains functional during brown-out and power-cycling events typical of factory-floor environments. The industrial temperature grade (-40C to +100C) covers unheated cabinet installations. Combined with JTAG-supported in-field updates, the 5M40ZM64I5 enables late-stage display customization without hardware changes.
Recommandé
Power Sequencing State Machines
The 5M40ZM64I5 implements deterministic power-sequencing state machines in multi-rail systems where MCU-boot dependency is undesirable. Its instant-on Flash configuration means rails are sequenced before the main processor is ready, satisfying FPGA, ASIC, and SoC power-on requirements that mandate specific rail orderings. With 32 macro cells, the device can sequence 6-10 rails with PG (power-good) feedback, fault detection, and retry logic. Telecom, networking, and server motherboard designs frequently use MAX V CPLDs in this exact role. The 1.8 V core and sub-2 mA quiescent current suit battery-backed always-on domains.
Recommandé
Glue Logic in Safety-Critical Embedded Systems
In safety-critical designs (IEC 61508 SIL-2/3 paths), the 5M40ZM64I5 serves as deterministic glue logic between sensors, MCUs, and actuators. Unlike a software FSM running on the main MCU, the CPLD's hardware logic executes in parallel and within fixed timing bounds, providing a separate isolation layer for safety interlocks. The on-chip Flash and JTAG-supported diagnostics support both initial programming and in-system verification. Industrial machinery, robotics controllers, and medical-device subsystems benefit from this hardware-isolation pattern.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5M40ZM64I5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5M40ZM64I5N | 5M80ZM64I5 | 5M40ZM64C5N | 5M40ZM64C5 | 5M40ZM64C4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | MBGA-64 | MBGA-64 - same | MBGA-64 - same | MBGA-64 - same | MBGA-64 - same | MBGA-64 - same |
| Family | MAX V | MAX V | MAX V | MAX V | MAX V | MAX V |
| Macro Cells | 32 | 32 | 64 | 32 | 32 | 32 |
| Core Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
Principaux différenciateurs
- On-chip Flash configuration - instant-on non-volatile behavior (vs 5M40ZM64I5N)
- Doubles macro-cell count in the same footprint (vs 5M80ZM64I5)
- Industrial temperature rating with same logic resources (vs 5M40ZM64C5N)
Notes de conception
Estimated: at 1.8 V core supply and 50% logic utilization, the 5M40ZM64I5 consumes approximately 10-15 mW typical. The MBGA-64 package has a small exposed die area; in sealed industrial enclosures, derate ambient temperature by 5-10C to keep junction below 100C. Provide at least 1 cm^2 of unbroken ground plane under the BGA for thermal spreading.
The MBGA-64 uses a 0.5 mm ball pitch and requires NSMD (non-solder-mask-defined) PCB pads per JEDEC MS-028. Stencil apertures 0.4 mm with 0.1 mm thickness yield reliable paste release. Place 100 nF decoupling capacitors within 2 mm of each VCCIO/VCCINT ball group. Route all high-speed signals on inner layers with adjacent ground reference planes to control impedance.
Do not confuse the 5M40ZM64I5 (industrial temperature) with the 5M40ZM64C5N (commercial temperature) - they share the same MBGA footprint but differ in operating range. The 'I' indicates industrial (-40C to +100C) while 'C' indicates commercial (0C to +85C). Additionally, the '5' suffix denotes the speed grade; speed grade '4' parts are slower and must not be substituted where 7.5 ns tPD timing is required.
Informations de conformité
Compliance status not directly stated in the verified web data. For RoHS/lead-free compliance, prefer variants with the 'N' suffix (e.g., 5M40ZM64I5N) which are documented as Matte-Tin (Pb-free) finish per MAX V family datasheet naming conventions.
