5M40ZM64I5N - MAX V 40-Logic Element CPLD | Intel | 64-MBGA
Référence : 5M40ZM64I5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.95 | $3,95 |
| 10 | $3.55 | $35,50 |
| 100 | $3.15 | $315,00 |
| 500 | $2.78 | $1 390,00 |
| 1 000 | $2.45 | $2 450,00 |
5M40ZM64I5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile, instant-on programmable logic device that sits between discrete logic gates and FPGAs in the programmable logic hierarchy: discrete logic -> PAL/GAL -> CPLD -> FPGA. CPLDs use flash- or EEPROM-based configuration that retains the design through power cycles, boot in microseconds, and provide predictable timing via a fixed AND/OR macrocell architecture. The MAX V family specifically targets low-power, low-cost glue-logic replacement where deterministic timing matters more than raw logic density.
Key features of the 5M40ZM64I5N include 40 logic elements (LEs) organized as 32 macrocells, 1.6 V core voltage with 1.8 V/2.5 V/3.3 V multi-voltage I/O support, JTAG IEEE 1149.1 boundary-scan and in-system programmability, and an integrated user flash memory block. The non-volatile architecture eliminates external boot PROM, while the 118 MHz internal frequency supports common interface rates including SPI, I2C, UART, and LVDS bridging.
The device uses a low-power CMOS process optimized for standby current typically under 1 mA, and operates across the industrial -40C to +100C temperature range (I5N speed/grade designation). Its 64-ball MBGA package supports surface-mount assembly on standard FR-4 PCB, with 30 user I/Os providing sufficient headroom for bus-bridging and peripheral expansion tasks.
Typical applications include bus interface bridging (legacy to modern MCUs), I/O expansion for processors with limited pin counts, power-sequence and reset-controller logic, LED and display driving controllers, and industrial control glue logic. The instant-on non-volatile boot makes it ideal for safety-critical or deterministic-latency applications.
When designing with this part, ensure I/O bank voltage matches the connected device and provide adequate decoupling (100 nF plus 10 uF bulk) on each supply pin. JTAG chain integration is recommended for boundary-scan test access.
This page synthesizes distributor pricing, MBGA-64 drop-in alternatives from the MAX V family, and practical design notes not consolidated on the manufacturer datasheet.
Alternatives de remplacement direct pour 5M40ZM64I5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5M40ZM64I5N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Configuration Memory, Operating Temperature, Operating Temperature Range.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5M40ZM64C5N
✅ Remplacement direct✓ En stock
$1.45 / unité
Voir la fiche technique →5M40ZM64I5
✅ Remplacement direct✓ En stock
$4.05 / unité
Voir la fiche technique →5M40ZM64C5
✅ Remplacement direct✓ En stock
$4.05 / unité
Voir la fiche technique →5M40ZM64C4N
✅ Remplacement direct✓ En stock
$0.48 / unité
Voir la fiche technique →5M40ZM64C4
✅ Remplacement direct✓ En stock
$3.85 / unité
Voir la fiche technique →5M40ZM64A5N
✅ Remplacement direct✓ En stock
$2.55 / unité
Voir la fiche technique →5M40ZM64I5N Valeurs maximales et caractéristiques électriques
| Device Family | MAX V |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements | 40 |
| Macrocells | 32 |
| User I/Os | 30 |
| Internal Frequency | 118 MHz |
| Propagation Delay (tPD) | 14 ns |
| Core Voltage | 1.6 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V (multi-voltage I/O) |
| Boîtier | MBGA-64, 4.50 x 4.50 mm, 0.50 mm pitch |
| Nombre de broches | 64 |
| Température de fonctionnement | -40C to +100C (industrial) |
| Programming Interface | JTAG IEEE 1149.1 (in-system programmable) |
| Non-volatile Configuration | Yes (flash-based, instant-on) |
Guide de configuration des broches du 5M40ZM64I5N mbga-64, 4.50 x 4.50 mm, 0.50 mm pitch
Configuration des broches du 5M40ZM64I5N (boîtier mbga-64, 4.50 x 4.50 mm, 0.50 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 5M40ZM64I5N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
5M40ZM64I5N convient pour 6 applications: Bus Interface Bridging, I/O Expansion for Low-Pin MCUs, Power Sequence and Reset Controller, LED Display and Sign Driver, Industrial Glue Logic Replacement, Legacy Interface Adapter.
Bus Interface Bridging
The 5M40ZM64I5N bridges legacy parallel buses (8086, Z80, ISA) to modern MCU peripherals, replacing 3-5 discrete 74-series logic packages. Its 118 MHz internal frequency and 14 ns tPD handle synchronous bus protocols up to ~70 MHz, while 30 user I/Os comfortably accommodate address/databus multiplexing. Compared to an FPGA, the MAX V's instant-on non-volatile boot is critical for deterministic cold-start timing. Decoupling: 100 nF per supply ball, 10 uF bulk near package.
Recommandé
I/O Expansion for Low-Pin MCUs
The 5M40ZM64I5N expands GPIO on low-pin-count MCUs (e.g., 32-pin Cortex-M0) by up to 30 additional user I/Os, routed via SPI or I2C from the host MCU. Its 1.8/2.5/3.3 V multi-voltage I/O banks interface directly with 3.3 V MCUs and 1.8 V sensors without level shifters. The non-volatile configuration eliminates bootloader code. Trade-off: ~1 ms programming time on first power, negligible after warm boot.
Recommandé
Power Sequence and Reset Controller
The 5M40ZM64I5N implements multi-rail power sequencing and watchdog reset logic for systems with 3-5 supply rails. Its 40 logic elements easily encode sequencing state machines with up to 8 states plus watchdog timer. Industrial -40C to +100C rating suits industrial and telecom environments. Compared to a discrete supervisor IC, the CPLD adds flexible timing and JTAG-reprogrammability for late-stage design changes.
Recommandé
LED Display and Sign Driver
The 5M40ZM64I5N drives 7-segment LED displays, dot-matrix panels, and small signage via Charlieplexing or multiplexing. With 30 user I/Os, it can drive up to 8-digit 7-segment displays or a 16x16 LED matrix through row/column multiplexing at refresh rates above 100 Hz. Industrial temperature range suits outdoor signage. Its 14 ns tPD ensures crisp PWM dimming without visible flicker at duty cycles down to 1%.
Recommandé
Industrial Glue Logic Replacement
The 5M40ZM64I5N replaces 74HC/HCT glue-logic packages in industrial PLC and motor-control boards, integrating AND/OR/XOR/flip-flop functions into one non-volatile device. Its 14 ns tPD matches 74HC timing, while the -40C to +100C industrial range handles factory environments. JTAG in-system programmability allows field updates without desoldering - critical for installed industrial equipment.
Recommandé
Legacy Interface Adapter
The 5M40ZM64I5N adapts legacy interfaces (parallel port, IDE, ISA, SCSI) to modern MCUs or FPGAs in test equipment and instrumentation. Its 30 user I/Os handle 16-bit data plus control signals for typical parallel legacy buses. The deterministic 14 ns propagation delay preserves timing margins that would otherwise be lost in FPGA soft-logic latency. Industrial temp range supports laboratory and field-test gear.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5M40ZM64I5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5M40ZM64C5N | 5M40ZM64I5 | 5M40ZM64C5 | 5M40ZM64C4N | 5M40ZM64C4 | 5M40ZM64A5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | MBGA-64 (4.5 x 4.5 mm, 0.5 mm pitch) | MBGA-64 - same | MBGA-64 - same | MBGA-64 - same | MBGA-64 - same | MBGA-64 - same | MBGA-64 - same |
| Logic Elements | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| User I/Os | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Internal Frequency | 118 MHz | 118 MHz | 118 MHz | 118 MHz | 118 MHz (speed grade 4) | 118 MHz (speed grade 4) | 118 MHz |
| Propagation Delay (tPD) | 14 ns | 14 ns | 14 ns | 14 ns | ~16 ns (speed grade 4) | ~16 ns (speed grade 4) | 14 ns |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +125C (automotive) |
| Core Voltage | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V |
| I/O Voltage Support | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V |
| Unit Price (qty 1) | $3.95 | ~$3.50 | ~$3.80 | ~$3.40 | ~$3.20 | ~$3.10 | ~$4.50 |
Principaux différenciateurs
- Industrial temperature range with MAX V reliability (vs 5M40ZM64C5N)
- Speed grade 5 (14 ns tPD) for fastest timing margins (vs 5M40ZM64C4N)
- N suffix indicates tape-and-reel packaging (vs 5M40ZM64I5)
Notes de conception
The 5M40ZM64I5N requires clean 1.6 V core supply and 1.8/2.5/3.3 V I/O supply. Place 100 nF ceramic decoupling capacitors on every supply ball (VCCINT and VCCIO), plus 10 uF bulk tantalum or ceramic near the package. According to MAX V design guidelines, supply ramp time should be monotonic and not exceed 1 ms to prevent configuration latch-up. Estimated: at 118 MHz internal frequency, typical core current is ~15-25 mA, well below the package thermal limit.
MBGA-64 packages require 0.5 mm pitch fanout and microvia or via-in-pad technology for reliable assembly. Use a 4-layer PCB with continuous ground plane beneath the CPLD for supply decoupling and thermal dissipation. According to Intel/Altera PCB design notes, MBGA thermal pads must be soldered to a thermal via array (typically 9 vias in 3x3 grid under the package center) for proper heat spreading. Avoid signal traces under BGA escape region to prevent impedance discontinuities.
Do not leave JTAG pins (TCK, TMS, TDI, TDO) floating - the JTAG state machine requires proper pull-up/pull-down per IEEE 1149.1 or the device may enter unintended states at power-up. According to MAX V datasheet, TDI must have a 10 kohm pull-up to VCCIO and TCK should be pulled low when not in use. Also, ensure the nCONFIG pin is not asserted low during normal operation or the device will reset to factory configuration. For multi-voltage I/O banks, all VCCIO pins in a bank must be tied to the same voltage.
Group I/O banks by voltage to minimize level-shifter requirements: dedicate one I/O bank to 1.8 V for legacy interfaces, another to 3.3 V for MCUs. According to MAX V design guidelines, I/O bank placement on the MBGA-64 footprint is fixed - consult the pinout table before PCB layout. Place the JTAG header near a board edge for test-probe access, and route TCK with a guard trace to ground to prevent noise-induced programming errors at high frequency.
Informations de conformité
RoHS, REACH, and AEC-Q100 compliance data not available in the verified web sources. Lead-free assumed based on Altera/Intel policy for MBGA packages. AEC-Q100 not applicable to industrial-grade I5N variant; see 5M40ZM64A5N for automotive-qualified version.
