A3P060-1VQG100T - ProASIC3 Flash FPGA 60k Gates | Microchip
Référence : A3P060-1VQG100T ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $29.8 | $298,00 |
| 100 | $26.4 | $2 640,00 |
| 500 | $23.1 | $11 550,00 |
| 1 000 | $20.9 | $20 900,00 |
A3P060-1VQG100T Présentation
A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory rather than an external configuration device. Unlike SRAM FPGAs, ProASIC3 devices are single-chip, non-volatile, and instantly powered-up at system level, eliminating the boot-time configuration step and reducing bill-of-materials cost. Within the power-management hierarchy of programmable logic, ProASIC3 sits in the ultra-low-density, low-cost class while retaining reprogrammability.
Key features include 1.5 V core voltage support for 1.5-V-only systems, low-impedance flash switches that reduce dynamic power, and a segmented, hierarchical routing architecture that delivers deterministic performance. The 18,432-bit distributed fabric (per DigiKey listing) supports small embedded designs, and the CMOS flash switch technology provides inherent security against configuration readback.
Architecturally, ProASIC3 uses Microchip's third-generation flash switch fabric with VersTile logic elements configurable as combinational logic, registers, or small RAM. The flash switches exhibit near-zero static power, making the family attractive for battery-operated and thermally constrained systems.
Typical applications include industrial automation control, portable and medical instrumentation, aerospace/defense glue logic, and smart consumer devices where single-chip, secure, low-power programmable logic is required.
Design consideration: budget the 1.5 V core rail separately from the 2.5 V/3.3 V I/O banks and verify I/O bank assignments against the board-level pinout before routing.
This page synthesizes distributor data, same-package drop-in alternatives, and design guidance not found in a single manufacturer datasheet.
Alternatives de remplacement direct pour A3P060-1VQG100T — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P060-1VQG100T (même facteur de forme et même empreinte) — différant par Configuration Memory, Operating Temperature, Package / Case, Family, Packaging.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P060-1VQG100I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P060-2VQG100
✅ Remplacement direct✓ En stock
$21.6 / unité
Voir la fiche technique →A3P060-2VQG100I
✅ Remplacement direct✓ En stock
$19.75 / unité
Voir la fiche technique →A3P060-VQG100I
✅ Remplacement direct✓ En stock
$6.95 / unité
Voir la fiche technique →A3P125-1VQG100T
✅ Remplacement direct✓ En stock
$17.6 / unité
Voir la fiche technique →A3P250-1VQG100T
✅ Remplacement direct✓ En stock
$22.3 / unité
Voir la fiche technique →A3P060-1VQG100T Valeurs maximales et caractéristiques électriques
| System Gates | 60000 |
| Logic Cells / VersTiles | 1536 |
| Maximum User I/O | 71 |
| Maximum Internal Frequency | 350 MHz |
| Core Voltage | 1.5 V |
| Speed Grade | -1 (standard) |
| Logic Family | CMOS (flash switch) |
| Configuration Memory | On-chip flash (non-volatile, single chip) |
| Package Type | 100-TQFP / VQFP-100, 0.5 mm pitch, green |
| Pins | 100 |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Family | ProASIC3 (Microsemi/Microchip) |
| Junction Temperature Grades | Grade TA (115C TJ) and Grade TA (135C TJ), PPAP documentation supported |
Guide de configuration des broches du A3P060-1VQG100T 100-tqfp / vqfp-100, 0.5 mm pitch, green
Configuration des broches du A3P060-1VQG100T (boîtier 100-tqfp / vqfp-100, 0.5 mm pitch, green). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3P060-1VQG100T.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3P060-1VQG100T convient pour 6 applications: Industrial Automation and Control, Portable Medical Instrumentation, Aerospace and Defense Glue Logic, Smart Consumer and IoT Devices, Test and Measurement Equipment, Secure Embedded Controllers.
Industrial Automation and Control
The A3P060-1VQG100T fits industrial automation because its flash-based fabric powers up instantly without an external configuration device, reducing boot time and BOM complexity in factory controllers. The 60,000-gate / 1,536 VersTile fabric with 71 user I/O handles sensor de-glitching, PWM generation, and legacy bus bridging at up to 350 MHz internal performance. Low static power from low-impedance flash switches keeps enclosure thermal budgets modest, and PPAP documentation support plus TA junction grades (115C/135C TJ) ease qualification for industrial programs. Place the FPGA between PLC I/O modules and a host processor, supplying a 1.5 V core rail and 3.3 V I/O banks; the trade-off versus a CPLD is more flexible fabric at slightly higher static cost per I/O.
Recommandé
Portable Medical Instrumentation
Microchip's ProASIC3 family is explicitly positioned for portable medical devices, and the A3P060-1VQG100T delivers the ultra-low-density, low-power profile these designs need. The flash switch fabric exhibits near-zero static power, extending battery runtime in handheld diagnostic and monitoring instruments, while single-chip non-volatile configuration eliminates configuration PROMs that add size and boot delay. The 100-TQFP's 0.5 mm pitch suits compact two- or four-layer boards, and 71 I/O covers display interfaces, sensor front ends, and button arrays. Design with a clean 1.5 V LDO-supplied core rail; unlike SRAM FPGAs there is no configuration readback path, supporting designs where configuration security matters. Verify timing at the -1 grade or step to the -2 speed grade variant if critical paths are tight.
Recommandé
Aerospace and Defense Glue Logic
Microsemi (now Microchip) flash FPGAs have a long heritage in terrestrial and aerospace programs, and the A3P060-1VQG100T serves as secure, non-volatile glue logic consolidating discrete 74xx-style functions. The flash configuration is inherently resistant to bitstream readback, a recognized advantage over SRAM FPGAs in defense systems, and PPAP/TA-grade documentation (115C and 135C TJ) supports reliability qualification workflows. The 60k-gate fabric implements address decoding, bus formatting, watchdog logic, and interface conversion at moderate speed. Design boards with the VQFP-100 footprint so the higher-density A3P125-1VQG100T or A3P250-1VQG100T can be substituted without layout changes when logic grows; re-verify I/O bank assignments after any density migration.
Recommandé
Smart Consumer and IoT Devices
For smart consumer products, the A3P060-1VQG100T provides single-chip programmable control with low total cost of ownership: no configuration flash chip, instant power-up, and low static draw from flash switches extend standby performance in always-on IoT nodes. The 60k-gate capacity is sufficient for sensor aggregation, simple state machines, protocol conversion (e.g., legacy serial to I2C/SPI bridging), and LED or display sequencing. The green VQFP-100 package supports lead-free assembly lines at 0.5 mm pitch, and tape-and-reel delivery (T suffix) suits automated pick-and-place. Budget the 1.5 V core from a small buck converter; core current is modest at this density but decouple locally with ceramic capacitors per the datasheet power guidance.
Recommandé
Test and Measurement Equipment
Bench and modular instruments use the A3P060-1VQG100T as reconfigurable control and timing logic: the 350 MHz maximum internal frequency and deterministic segmented routing support counter/timer functions, trigger logic, and interface sequencing. The 71 user I/O connect front-panel controls, display buses, and measurement front ends, while flash configuration keeps the instrument ready at power-on with zero configuration delay - useful for rack systems with strict turn-on time requirements. The VQFP-100 footprint is hand- and reflow-solderable for prototyping. When instrument firmware requires more logic (e.g., added FIFO depth), migrate to the same-package A3P125-1VQG100T with minimal layout rework, then re-run timing closure in Libero SoC against the -1 grade.
Recommandé
Secure Embedded Controllers
Designs requiring configuration security benefit from the A3P060-1VQG100T because ProASIC3 stores its bitstream in on-chip flash with no external configuration readback path, unlike SRAM FPGAs that fetch bitstreams from external memory at boot. This makes it a fit for secure embedded controllers in access-control, point-of-sale peripherals, and industrial gateways. The 60k-gate fabric implements cryptographic辅助 logic, secure state machines, and tamper-response sequencing alongside the main control function. The single-chip solution also reduces the attack surface by removing the configuration PROM from the BOM. Design the 1.5 V core rail with adequate decoupling and keep unused I/O configured per datasheet recommendations to minimize noise pickup and leakage.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P060-1VQG100T — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P060-1VQG100I | A3P060-2VQG100 | A3P125-1VQG100T | A3P250-1VQG100T |
|---|---|---|---|---|---|
| Package | 100-TQFP (VQFP-100), 0.5 mm pitch | 100-TQFP (VQFP-100) - same | 100-TQFP (VQFP-100) - same | 100-TQFP (VQFP-100) - same | 100-TQFP (VQFP-100) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 60000 | 60000 | 60000 | 125000 | 250000 |
| Logic Cells (VersTiles) | 1536 | 1536 | 1536 | 3072 | 6144 |
| Speed Grade | -1 (standard) | -1 | -2 (faster) | -1 | -1 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Commercial (T ordering code) | Industrial (I) | Commercial | Commercial (T) | Commercial (T) |
| Configuration | On-chip flash, single chip, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile |
Principaux différenciateurs
- Lowest-cost standard speed grade (vs A3P060-2VQG100)
- In-place density migration on same footprint (vs A3P125-1VQG100T)
- Single-chip non-volatile configuration (vs SRAM FPGAs (e.g., Xilinx Spartan class))
Notes de conception
The A3P060-1VQG100T requires a dedicated 1.5 V core rail; I/O banks use separate supply pins. Because ProASIC3 flash switches draw very low static current, a small LDO or low-current buck converter sized per the datasheet current tables is sufficient at this 60k-gate density. Sequence the I/O supplies relative to the core per the ProASIC3 power-up specification to avoid latch-up, and place 0.1 uF ceramic capacitors at each supply pin plus bulk capacitance near the regulator. Estimated: core current at this density is typically in the low tens of milliamps, but confirm against the datasheet DC characteristics for your clock activity.
The VQFP-100 package uses 0.5 mm lead pitch, so design land patterns to the manufacturer mechanical drawing rather than generic TQFP-100 footprints. Fine-pitch QFPs are reflow-friendly but hand-solderable; keep thermal relief minimal on GND pins to aid solderability. Route the 1.5 V core plane as a solid pour on an inner layer, and keep the flash supply (VPP) pin routed short and clean per the datasheet programming requirements - this pin is only exercised during programming but must be correctly terminated on the board.
Two common mistakes: (1) migrating between ProASIC3 densities in the same 100-TQFP package without re-verifying I/O bank assignments - the A3P125/A3P250 pin tables differ from A3P060 even though the footprint is shared; (2) confusing ordering codes - the T suffix (tape-and-reel), I suffix (industrial temperature), and speed grade digits (-1/-2) are independent fields, so A3P060-1VQG100T and A3P060-1VQG100I are the same silicon with different temp grade and packing. Always confirm the exact ordering code against your BOM before placing volume orders.
Informations de conformité
Datasheet summary describes a GREEN package (0.50 mm pitch, GREEN, VQFP-100), indicating Microchip/Microsemi green packaging program; formal RoHS/REACH declarations should be confirmed per exact ordering code on the Microchip product page. PPAP documentation is supported.
