A3P060-1VQG100T - ProASIC3 Flash FPGA 60k Gates | Microchip
MPN: A3P060-1VQG100T ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.8 | $298.00 |
| 100 | $26.4 | $2,640.00 |
| 500 | $23.1 | $11,550.00 |
| 1,000 | $20.9 | $20,900.00 |
Drop-in alternatives for A3P060-1VQG100T — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P060-1VQG100I
✅ Drop-In📋 Reference alternative (not in catalog)
A3P060-2VQG100
✅ Drop-In✓ In Stock
$21.6 / Unit
View Datasheet →A3P060-2VQG100I
✅ Drop-In✓ In Stock
$19.75 / Unit
View Datasheet →A3P060-VQG100I
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$6.95 / Unit
View Datasheet →A3P125-1VQG100T
✅ Drop-In✓ In Stock
$17.6 / Unit
View Datasheet →A3P250-1VQG100T
✅ Drop-In✓ In Stock
$22.3 / Unit
View Datasheet →A3P060-1VQG100T Maximum Ratings & Electrical Characteristics
| System Gates | 60000 |
| Logic Cells / VersTiles | 1536 |
| Maximum User I/O | 71 |
| Maximum Internal Frequency | 350 MHz |
| Core Voltage | 1.5 V |
| Speed Grade | -1 (standard) |
| Logic Family | CMOS (flash switch) |
| Configuration Memory | On-chip flash (non-volatile, single chip) |
| Package Type | 100-TQFP / VQFP-100, 0.5 mm pitch, green |
| Pins | 100 |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Family | ProASIC3 (Microsemi/Microchip) |
| Junction Temperature Grades | Grade TA (115C TJ) and Grade TA (135C TJ), PPAP documentation supported |
A3P060-1VQG100T 100-tqfp / vqfp-100, 0.5 mm pitch, green Pin Configuration Guide
Complete pinout information for A3P060-1VQG100T (100-tqfp / vqfp-100, 0.5 mm pitch, green package) with 100 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P060-1VQG100T.
Refer to the datasheet for full pin configuration.
Estimated pin count: 100 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P060-1VQG100T is suitable for 6 applications: Industrial Automation and Control, Portable Medical Instrumentation, Aerospace and Defense Glue Logic, Smart Consumer and IoT Devices, Test and Measurement Equipment, Secure Embedded Controllers.
Industrial Automation and Control
The A3P060-1VQG100T fits industrial automation because its flash-based fabric powers up instantly without an external configuration device, reducing boot time and BOM complexity in factory controllers. The 60,000-gate / 1,536 VersTile fabric with 71 user I/O handles sensor de-glitching, PWM generation, and legacy bus bridging at up to 350 MHz internal performance. Low static power from low-impedance flash switches keeps enclosure thermal budgets modest, and PPAP documentation support plus TA junction grades (115C/135C TJ) ease qualification for industrial programs. Place the FPGA between PLC I/O modules and a host processor, supplying a 1.5 V core rail and 3.3 V I/O banks; the trade-off versus a CPLD is more flexible fabric at slightly higher static cost per I/O.
Recommended
Portable Medical Instrumentation
Microchip's ProASIC3 family is explicitly positioned for portable medical devices, and the A3P060-1VQG100T delivers the ultra-low-density, low-power profile these designs need. The flash switch fabric exhibits near-zero static power, extending battery runtime in handheld diagnostic and monitoring instruments, while single-chip non-volatile configuration eliminates configuration PROMs that add size and boot delay. The 100-TQFP's 0.5 mm pitch suits compact two- or four-layer boards, and 71 I/O covers display interfaces, sensor front ends, and button arrays. Design with a clean 1.5 V LDO-supplied core rail; unlike SRAM FPGAs there is no configuration readback path, supporting designs where configuration security matters. Verify timing at the -1 grade or step to the -2 speed grade variant if critical paths are tight.
Recommended
Aerospace and Defense Glue Logic
Microsemi (now Microchip) flash FPGAs have a long heritage in terrestrial and aerospace programs, and the A3P060-1VQG100T serves as secure, non-volatile glue logic consolidating discrete 74xx-style functions. The flash configuration is inherently resistant to bitstream readback, a recognized advantage over SRAM FPGAs in defense systems, and PPAP/TA-grade documentation (115C and 135C TJ) supports reliability qualification workflows. The 60k-gate fabric implements address decoding, bus formatting, watchdog logic, and interface conversion at moderate speed. Design boards with the VQFP-100 footprint so the higher-density A3P125-1VQG100T or A3P250-1VQG100T can be substituted without layout changes when logic grows; re-verify I/O bank assignments after any density migration.
Recommended
Smart Consumer and IoT Devices
For smart consumer products, the A3P060-1VQG100T provides single-chip programmable control with low total cost of ownership: no configuration flash chip, instant power-up, and low static draw from flash switches extend standby performance in always-on IoT nodes. The 60k-gate capacity is sufficient for sensor aggregation, simple state machines, protocol conversion (e.g., legacy serial to I2C/SPI bridging), and LED or display sequencing. The green VQFP-100 package supports lead-free assembly lines at 0.5 mm pitch, and tape-and-reel delivery (T suffix) suits automated pick-and-place. Budget the 1.5 V core from a small buck converter; core current is modest at this density but decouple locally with ceramic capacitors per the datasheet power guidance.
Recommended
Test and Measurement Equipment
Bench and modular instruments use the A3P060-1VQG100T as reconfigurable control and timing logic: the 350 MHz maximum internal frequency and deterministic segmented routing support counter/timer functions, trigger logic, and interface sequencing. The 71 user I/O connect front-panel controls, display buses, and measurement front ends, while flash configuration keeps the instrument ready at power-on with zero configuration delay - useful for rack systems with strict turn-on time requirements. The VQFP-100 footprint is hand- and reflow-solderable for prototyping. When instrument firmware requires more logic (e.g., added FIFO depth), migrate to the same-package A3P125-1VQG100T with minimal layout rework, then re-run timing closure in Libero SoC against the -1 grade.
Recommended
Secure Embedded Controllers
Designs requiring configuration security benefit from the A3P060-1VQG100T because ProASIC3 stores its bitstream in on-chip flash with no external configuration readback path, unlike SRAM FPGAs that fetch bitstreams from external memory at boot. This makes it a fit for secure embedded controllers in access-control, point-of-sale peripherals, and industrial gateways. The 60k-gate fabric implements cryptographic辅助 logic, secure state machines, and tamper-response sequencing alongside the main control function. The single-chip solution also reduces the attack surface by removing the configuration PROM from the BOM. Design the 1.5 V core rail with adequate decoupling and keep unused I/O configured per datasheet recommendations to minimize noise pickup and leakage.
Recommended
Recommended Products Summary
Engineering reference data for A3P060-1VQG100T — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P060-1VQG100I | A3P060-2VQG100 | A3P125-1VQG100T | A3P250-1VQG100T |
|---|---|---|---|---|---|
| Package | 100-TQFP (VQFP-100), 0.5 mm pitch | 100-TQFP (VQFP-100) - same | 100-TQFP (VQFP-100) - same | 100-TQFP (VQFP-100) - same | 100-TQFP (VQFP-100) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 60000 | 60000 | 60000 | 125000 | 250000 |
| Logic Cells (VersTiles) | 1536 | 1536 | 1536 | 3072 | 6144 |
| Speed Grade | -1 (standard) | -1 | -2 (faster) | -1 | -1 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Commercial (T ordering code) | Industrial (I) | Commercial | Commercial (T) | Commercial (T) |
| Configuration | On-chip flash, single chip, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile |
Key Differentiators
- Lowest-cost standard speed grade (vs A3P060-2VQG100)
- In-place density migration on same footprint (vs A3P125-1VQG100T)
- Single-chip non-volatile configuration (vs SRAM FPGAs (e.g., Xilinx Spartan class))
Design Notes
The A3P060-1VQG100T requires a dedicated 1.5 V core rail; I/O banks use separate supply pins. Because ProASIC3 flash switches draw very low static current, a small LDO or low-current buck converter sized per the datasheet current tables is sufficient at this 60k-gate density. Sequence the I/O supplies relative to the core per the ProASIC3 power-up specification to avoid latch-up, and place 0.1 uF ceramic capacitors at each supply pin plus bulk capacitance near the regulator. Estimated: core current at this density is typically in the low tens of milliamps, but confirm against the datasheet DC characteristics for your clock activity.
The VQFP-100 package uses 0.5 mm lead pitch, so design land patterns to the manufacturer mechanical drawing rather than generic TQFP-100 footprints. Fine-pitch QFPs are reflow-friendly but hand-solderable; keep thermal relief minimal on GND pins to aid solderability. Route the 1.5 V core plane as a solid pour on an inner layer, and keep the flash supply (VPP) pin routed short and clean per the datasheet programming requirements - this pin is only exercised during programming but must be correctly terminated on the board.
Two common mistakes: (1) migrating between ProASIC3 densities in the same 100-TQFP package without re-verifying I/O bank assignments - the A3P125/A3P250 pin tables differ from A3P060 even though the footprint is shared; (2) confusing ordering codes - the T suffix (tape-and-reel), I suffix (industrial temperature), and speed grade digits (-1/-2) are independent fields, so A3P060-1VQG100T and A3P060-1VQG100I are the same silicon with different temp grade and packing. Always confirm the exact ordering code against your BOM before placing volume orders.
Compliance Information
Datasheet summary describes a GREEN package (0.50 mm pitch, GREEN, VQFP-100), indicating Microchip/Microsemi green packaging program; formal RoHS/REACH declarations should be confirmed per exact ordering code on the Microchip product page. PPAP documentation is supported.
