A3P1000L-FG144 - 1M Gate Low Power FPGA | Microchip Technology
Référence : A3P1000L-FG144 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $106.6 | $106,60 |
| 10 | $98.5 | $985,00 |
| 100 | $89.2 | $8 920,00 |
| 500 | $80.1 | $40 050,00 |
| 1 000 | $72.5 | $72 500,00 |
A3P1000L-FG144 Présentation
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits above CPLDs in complexity and below ASICs in customization. They are essential in rapid prototyping, low-to-mid volume production, and applications requiring field updates. The ProASIC3L family specifically uses flash-based configuration, meaning the device retains its programming without external memory and is instantly available on power-up.
Key features of the A3P1000L-FG144 include 1,000,000 system gates, 24,576 logic elements, 147,456 bits of RAM, and 97 user I/Os. It operates with a core voltage of 1.2V to 1.5V, enabling low power consumption. The flash-based architecture provides security against reverse engineering and supports in-system programming (ISP). The device also offers up to 350 MHz performance, making it suitable for a wide range of applications.
Technically, the A3P1000L-FG144 is built on a 130nm flash process, which combines the benefits of non-volatile configuration with low static power. Unlike SRAM-based FPGAs, it does not require a configuration PROM, reducing BOM cost and board space. The device includes advanced features such as clock conditioning circuits (CCC), phase-locked loops (PLLs), and dedicated memory blocks, enabling complex system-on-chip designs.
Typical applications include industrial automation, automotive electronics, communications infrastructure, and consumer electronics. Its low power and instant-on capability make it ideal for battery-powered devices and safety-critical systems where immediate operation is required. The 97 I/Os support various I/O standards, including LVCMOS, LVTTL, and PCI, providing flexibility in system integration.
When designing with this FPGA, consider the core voltage range and ensure proper decoupling of the 1.2V-1.5V supply. The flash-based configuration eliminates the need for external boot memory, but careful power sequencing is still recommended. Use the Microchip Libero SoC design suite for synthesis, place-and-route, and programming.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P1000L-FG144.
Alternatives de remplacement direct pour A3P1000L-FG144 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P1000L-FG144 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Family, System Gates, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P1000L-1FG144
✅ Remplacement direct✓ En stock
$119 / unité
Voir la fiche technique →A3P1000L-FG144I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000L-1FGG144
✅ Remplacement direct✓ En stock
$29.9 / unité
Voir la fiche technique →A3P1000L-1FGG144I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000L-FG256
✅ Remplacement direct✓ En stock
$55 / unité
Voir la fiche technique →A3P1000L-FG144 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3L |
| System Gates | 1,000,000 |
| Logic Elements (LEs) | 24,576 (11KLEs) |
| RAM Bits | 147,456 |
| User I/Os | 97 |
| Core Voltage | 1.2 V to 1.5 V |
| Boîtier | 144-LBGA (13x13 mm, 1.0 mm pitch) |
| Maximum Frequency | 350 MHz |
| Configuration | Flash-based, non-volatile |
| I/O Standards | LVCMOS, LVTTL, PCI, etc. |
| Embedded PLLs | 1 (CCC with PLL) |
| Température de fonctionnement | 0°C to +85°C (commercial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de A3P1000L-FG144
| Broche 1 | IO — User I/O |
| Broche 2 | IO — User I/O |
| Broche 3 | IO — User I/O |
| Broche 4 | IO — User I/O |
| Broche 5 | IO — User I/O |
| Broche 6 | IO — User I/O |
| Broche 7 | IO — User I/O |
| Broche 8 | IO — User I/O |
| Broche 9 | IO — User I/O |
| Broche 10 | IO — User I/O |
| Broche 11 | IO — User I/O |
| Broche 12 | IO — User I/O |
| Broche 13 | IO — User I/O |
| Broche 14 | IO — User I/O |
| Broche 15 | IO — User I/O |
| Broche 16 | IO — User I/O |
| Broche 17 | IO — User I/O |
| Broche 18 | IO — User I/O |
| Broche 19 | IO — User I/O |
| Broche 20 | IO — User I/O |
| Broche 21 | IO — User I/O |
| Broche 22 | IO — User I/O |
| Broche 23 | IO — User I/O |
| Broche 24 | IO — User I/O |
| Broche 25 | IO — User I/O |
| Broche 26 | IO — User I/O |
| Broche 27 | IO — User I/O |
| Broche 28 | IO — User I/O |
| Broche 29 | IO — User I/O |
| Broche 30 | IO — User I/O |
| Broche 31 | IO — User I/O |
| Broche 32 | IO — User I/O |
| Broche 33 | IO — User I/O |
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| Broche 35 | IO — User I/O |
| Broche 36 | IO — User I/O |
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| Broche 38 | IO — User I/O |
| Broche 39 | IO — User I/O |
| Broche 40 | IO — User I/O |
| Broche 41 | IO — User I/O |
| Broche 42 | IO — User I/O |
| Broche 43 | IO — User I/O |
| Broche 44 | IO — User I/O |
| Broche 45 | IO — User I/O |
| Broche 46 | IO — User I/O |
| Broche 47 | IO — User I/O |
| Broche 48 | IO — User I/O |
| Broche 49 | IO — User I/O |
| Broche 50 | IO — User I/O |
| Broche 51 | IO — User I/O |
| Broche 52 | IO — User I/O |
| Broche 53 | IO — User I/O |
| Broche 54 | IO — User I/O |
| Broche 55 | IO — User I/O |
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| Broche 57 | IO — User I/O |
| Broche 58 | IO — User I/O |
| Broche 59 | IO — User I/O |
| Broche 60 | IO — User I/O |
| Broche 61 | IO — User I/O |
| Broche 62 | IO — User I/O |
| Broche 63 | IO — User I/O |
| Broche 64 | IO — User I/O |
| Broche 65 | IO — User I/O |
| Broche 66 | IO — User I/O |
| Broche 67 | IO — User I/O |
| Broche 68 | IO — User I/O |
| Broche 69 | IO — User I/O |
| Broche 70 | IO — User I/O |
| Broche 71 | IO — User I/O |
| Broche 72 | IO — User I/O |
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| Broche 74 | IO — User I/O |
| Broche 75 | IO — User I/O |
| Broche 76 | IO — User I/O |
| Broche 77 | IO — User I/O |
| Broche 78 | IO — User I/O |
| Broche 79 | IO — User I/O |
| Broche 80 | IO — User I/O |
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| Broche 85 | IO — User I/O |
| Broche 86 | IO — User I/O |
| Broche 87 | IO — User I/O |
| Broche 88 | IO — User I/O |
| Broche 89 | IO — User I/O |
| Broche 90 | IO — User I/O |
| Broche 91 | IO — User I/O |
| Broche 92 | IO — User I/O |
| Broche 93 | IO — User I/O |
| Broche 94 | IO — User I/O |
| Broche 95 | IO — User I/O |
| Broche 96 | IO — User I/O |
| Broche 97 | IO — User I/O |
| Broche 98 | VCC — Core power supply |
| Broche 99 | GND — Ground |
| Broche 100 | VCC — Core power supply |
| Broche 101 | GND — Ground |
| Broche 102 | VCC — Core power supply |
| Broche 103 | GND — Ground |
| Broche 104 | VCC — Core power supply |
| Broche 105 | GND — Ground |
| Broche 106 | VCC — Core power supply |
| Broche 107 | GND — Ground |
| Broche 108 | VCC — Core power supply |
| Broche 109 | GND — Ground |
| Broche 110 | VCC — Core power supply |
| Broche 111 | GND — Ground |
| Broche 112 | VCC — Core power supply |
| Broche 113 | GND — Ground |
| Broche 114 | VCC — Core power supply |
| Broche 115 | GND — Ground |
| Broche 116 | VCC — Core power supply |
| Broche 117 | GND — Ground |
| Broche 118 | VCC — Core power supply |
| Broche 119 | GND — Ground |
| Broche 120 | VCC — Core power supply |
| Broche 121 | GND — Ground |
| Broche 122 | VCC — Core power supply |
| Broche 123 | GND — Ground |
| Broche 124 | VCC — Core power supply |
| Broche 125 | GND — Ground |
| Broche 126 | VCC — Core power supply |
| Broche 127 | GND — Ground |
| Broche 128 | VCC — Core power supply |
| Broche 129 | GND — Ground |
| Broche 130 | VCC — Core power supply |
| Broche 131 | GND — Ground |
| Broche 132 | VCC — Core power supply |
| Broche 133 | GND — Ground |
| Broche 134 | VCC — Core power supply |
| Broche 135 | GND — Ground |
| Broche 136 | VCC — Core power supply |
| Broche 137 | GND — Ground |
| Broche 138 | VCC — Core power supply |
| Broche 139 | GND — Ground |
| Broche 140 | VCC — Core power supply |
| Broche 141 | GND — Ground |
| Broche 142 | VCC — Core power supply |
| Broche 143 | GND — Ground |
| Broche 144 | VCC — Core power supply |
Applications typiques
A3P1000L-FG144 convient pour 6 applications: Industrial Automation, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Automation
The A3P1000L-FG144 is ideal for industrial automation due to its low power consumption and instant-on capability. It can be used in PLCs, motor control, and sensor interfaces. The flash-based configuration ensures reliable operation in harsh environments without external configuration memory. With 97 I/Os, it can interface with multiple sensors and actuators, while the 1M gates provide ample logic for complex control algorithms. The device's 1.2V-1.5V core voltage reduces power dissipation, making it suitable for distributed control nodes. Its security features protect intellectual property in competitive industrial markets.
Recommandé
Automotive Electronics
In automotive electronics, the A3P1000L-FG144 can be used for body control modules, infotainment systems, and advanced driver-assistance systems (ADAS). Its low power consumption is critical for battery-powered vehicles, and the instant-on feature ensures immediate operation after ignition. The device supports multiple I/O standards, enabling connection to CAN, LIN, and FlexRay transceivers. With 1M gates, it can handle complex logic for sensor fusion and control. However, for automotive-grade requirements, consider the industrial temperature variant A3P1000L-FG144I or a dedicated AEC-Q100 qualified part.
Recommandé
Communications Infrastructure
The A3P1000L-FG144 is well-suited for communications infrastructure such as base stations, routers, and switches. Its high I/O count (97) and support for various I/O standards (LVCMOS, LVTTL, PCI) allow flexible interfacing with PHY chips and network processors. The 1M gates provide ample resources for protocol handling, packet processing, and error correction. The low power consumption is beneficial for remote and edge devices where power is limited. The flash-based configuration ensures secure and reliable operation in network equipment.
Recommandé
Consumer Electronics
In consumer electronics, the A3P1000L-FG144 can be used in smart home devices, wearables, and portable electronics. Its low power consumption extends battery life, and the instant-on feature provides immediate response to user input. The device's small 13x13mm FBGA package is suitable for compact designs. With 1M gates, it can implement user interfaces, sensor processing, and connectivity protocols. The flash-based configuration allows field updates, enabling feature enhancements without hardware changes.
Recommandé
Medical Devices
The A3P1000L-FG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its low power consumption is essential for battery-operated devices, and the instant-on capability ensures immediate readiness in critical situations. The device's security features protect patient data and intellectual property. With 1M gates, it can handle signal processing, data logging, and user interface control. The industrial temperature variant (A3P1000L-FG144I) is recommended for environments with wider temperature ranges.
Recommandé
Aerospace and Defense
In aerospace and defense, the A3P1000L-FG144 can be used in avionics, satellite systems, and military electronics. Its flash-based configuration provides radiation tolerance and security against reverse engineering. The low power consumption is critical for space applications where power is limited. The device's instant-on capability ensures immediate operation after power-up, which is essential for safety-critical systems. With 1M gates, it can implement complex processing and control functions. For extreme environments, consider the industrial temperature variant.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P1000L-FG144 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P1000L-1FG144 | A3P1000L-FG144I | A3P1000L-1FGG144 | A3P1000L-1FGG144I |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 |
| User I/Os | 97 | 97 | 97 | 97 | 97 |
| Core Voltage | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V |
| Speed Grade | Standard (250 MHz) | -1 (350 MHz) | Standard (250 MHz) | -1 (350 MHz) | -1 (350 MHz) |
| Temperature Range | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C | 0°C to +85°C | -40°C to +100°C |
Principaux différenciateurs
- Low power consumption with 1.2V core voltage (vs A3P1000-FG144I (standard ProASIC3))
- Flash-based configuration for instant-on and security (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Pin-compatible with higher speed grade variants (vs A3P1000L-1FG144)
Notes de conception
The A3P1000L-FG144 operates with a core voltage of 1.2V to 1.5V. Ensure a clean power supply with adequate decoupling capacitors (e.g., 100nF and 10uF) placed close to each VCC pin. The flash-based configuration does not require external boot memory, but power sequencing should be considered to avoid inrush currents. Estimated: For a typical design with 50% logic utilization and 100 MHz clock, dynamic power is approximately 0.5W, so a 1A regulator is sufficient.
For the 144-ball FBGA package, use a 4-layer PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm for single-ended). Place decoupling capacitors as close as possible to the VCC and GND balls. Follow Microchip's layout guidelines in the datasheet to minimize signal integrity issues. The 1.0mm ball pitch allows standard PCB manufacturing processes.
Avoid exceeding the maximum core voltage of 1.5V, as this can damage the device. Ensure all I/O banks are properly configured with the correct voltage levels. Do not leave unused I/Os floating; configure them as inputs with pull-ups or as outputs. Also, verify that the JTAG pins are not accidentally connected to other circuitry, as this can interfere with programming.
Informations de conformité
RoHS compliant per distributor listings. Not AEC-Q100 qualified for automotive. Lead-free version available as A3P1000L-1FGG144.