A3P1000L-FG144 - 1M Gate Low Power FPGA | Microchip Technology
N.º da peça: A3P1000L-FG144 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $106.6 | $106,60 |
| 10 | $98.5 | $985,00 |
| 100 | $89.2 | $8.920,00 |
| 500 | $80.1 | $40.050,00 |
| 1.000 | $72.5 | $72.500,00 |
A3P1000L-FG144 Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits above CPLDs in complexity and below ASICs in customization. They are essential in rapid prototyping, low-to-mid volume production, and applications requiring field updates. The ProASIC3L family specifically uses flash-based configuration, meaning the device retains its programming without external memory and is instantly available on power-up.
Key features of the A3P1000L-FG144 include 1,000,000 system gates, 24,576 logic elements, 147,456 bits of RAM, and 97 user I/Os. It operates with a core voltage of 1.2V to 1.5V, enabling low power consumption. The flash-based architecture provides security against reverse engineering and supports in-system programming (ISP). The device also offers up to 350 MHz performance, making it suitable for a wide range of applications.
Technically, the A3P1000L-FG144 is built on a 130nm flash process, which combines the benefits of non-volatile configuration with low static power. Unlike SRAM-based FPGAs, it does not require a configuration PROM, reducing BOM cost and board space. The device includes advanced features such as clock conditioning circuits (CCC), phase-locked loops (PLLs), and dedicated memory blocks, enabling complex system-on-chip designs.
Typical applications include industrial automation, automotive electronics, communications infrastructure, and consumer electronics. Its low power and instant-on capability make it ideal for battery-powered devices and safety-critical systems where immediate operation is required. The 97 I/Os support various I/O standards, including LVCMOS, LVTTL, and PCI, providing flexibility in system integration.
When designing with this FPGA, consider the core voltage range and ensure proper decoupling of the 1.2V-1.5V supply. The flash-based configuration eliminates the need for external boot memory, but careful power sequencing is still recommended. Use the Microchip Libero SoC design suite for synthesis, place-and-route, and programming.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P1000L-FG144.
Alternativas drop-in para A3P1000L-FG144 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P1000L-FG144 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Family, System Gates, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P1000L-1FG144
✅ Drop-In✓ Em estoque
$119 / unidade
Ver ficha técnica →A3P1000L-FG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000L-1FGG144
✅ Drop-In✓ Em estoque
$29.9 / unidade
Ver ficha técnica →A3P1000L-1FGG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000L-FG256
✅ Drop-In✓ Em estoque
$55 / unidade
Ver ficha técnica →A3P1000L-FG144 Classificações máximas e características elétricas
| Family | ProASIC3L |
| System Gates | 1,000,000 |
| Logic Elements (LEs) | 24,576 (11KLEs) |
| RAM Bits | 147,456 |
| User I/Os | 97 |
| Core Voltage | 1.2 V to 1.5 V |
| Encapsulamento | 144-LBGA (13x13 mm, 1.0 mm pitch) |
| Maximum Frequency | 350 MHz |
| Configuration | Flash-based, non-volatile |
| I/O Standards | LVCMOS, LVTTL, PCI, etc. |
| Embedded PLLs | 1 (CCC with PLL) |
| Temperatura de operação | 0°C to +85°C (commercial) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Nível MSL | 3 (168 hours) |
Configuração de pinos do A3P1000L-FG144
| Pino 1 | IO — User I/O |
| Pino 2 | IO — User I/O |
| Pino 3 | IO — User I/O |
| Pino 4 | IO — User I/O |
| Pino 5 | IO — User I/O |
| Pino 6 | IO — User I/O |
| Pino 7 | IO — User I/O |
| Pino 8 | IO — User I/O |
| Pino 9 | IO — User I/O |
| Pino 10 | IO — User I/O |
| Pino 11 | IO — User I/O |
| Pino 12 | IO — User I/O |
| Pino 13 | IO — User I/O |
| Pino 14 | IO — User I/O |
| Pino 15 | IO — User I/O |
| Pino 16 | IO — User I/O |
| Pino 17 | IO — User I/O |
| Pino 18 | IO — User I/O |
| Pino 19 | IO — User I/O |
| Pino 20 | IO — User I/O |
| Pino 21 | IO — User I/O |
| Pino 22 | IO — User I/O |
| Pino 23 | IO — User I/O |
| Pino 24 | IO — User I/O |
| Pino 25 | IO — User I/O |
| Pino 26 | IO — User I/O |
| Pino 27 | IO — User I/O |
| Pino 28 | IO — User I/O |
| Pino 29 | IO — User I/O |
| Pino 30 | IO — User I/O |
| Pino 31 | IO — User I/O |
| Pino 32 | IO — User I/O |
| Pino 33 | IO — User I/O |
| Pino 34 | IO — User I/O |
| Pino 35 | IO — User I/O |
| Pino 36 | IO — User I/O |
| Pino 37 | IO — User I/O |
| Pino 38 | IO — User I/O |
| Pino 39 | IO — User I/O |
| Pino 40 | IO — User I/O |
| Pino 41 | IO — User I/O |
| Pino 42 | IO — User I/O |
| Pino 43 | IO — User I/O |
| Pino 44 | IO — User I/O |
| Pino 45 | IO — User I/O |
| Pino 46 | IO — User I/O |
| Pino 47 | IO — User I/O |
| Pino 48 | IO — User I/O |
| Pino 49 | IO — User I/O |
| Pino 50 | IO — User I/O |
| Pino 51 | IO — User I/O |
| Pino 52 | IO — User I/O |
| Pino 53 | IO — User I/O |
| Pino 54 | IO — User I/O |
| Pino 55 | IO — User I/O |
| Pino 56 | IO — User I/O |
| Pino 57 | IO — User I/O |
| Pino 58 | IO — User I/O |
| Pino 59 | IO — User I/O |
| Pino 60 | IO — User I/O |
| Pino 61 | IO — User I/O |
| Pino 62 | IO — User I/O |
| Pino 63 | IO — User I/O |
| Pino 64 | IO — User I/O |
| Pino 65 | IO — User I/O |
| Pino 66 | IO — User I/O |
| Pino 67 | IO — User I/O |
| Pino 68 | IO — User I/O |
| Pino 69 | IO — User I/O |
| Pino 70 | IO — User I/O |
| Pino 71 | IO — User I/O |
| Pino 72 | IO — User I/O |
| Pino 73 | IO — User I/O |
| Pino 74 | IO — User I/O |
| Pino 75 | IO — User I/O |
| Pino 76 | IO — User I/O |
| Pino 77 | IO — User I/O |
| Pino 78 | IO — User I/O |
| Pino 79 | IO — User I/O |
| Pino 80 | IO — User I/O |
| Pino 81 | IO — User I/O |
| Pino 82 | IO — User I/O |
| Pino 83 | IO — User I/O |
| Pino 84 | IO — User I/O |
| Pino 85 | IO — User I/O |
| Pino 86 | IO — User I/O |
| Pino 87 | IO — User I/O |
| Pino 88 | IO — User I/O |
| Pino 89 | IO — User I/O |
| Pino 90 | IO — User I/O |
| Pino 91 | IO — User I/O |
| Pino 92 | IO — User I/O |
| Pino 93 | IO — User I/O |
| Pino 94 | IO — User I/O |
| Pino 95 | IO — User I/O |
| Pino 96 | IO — User I/O |
| Pino 97 | IO — User I/O |
| Pino 98 | VCC — Core power supply |
| Pino 99 | GND — Ground |
| Pino 100 | VCC — Core power supply |
| Pino 101 | GND — Ground |
| Pino 102 | VCC — Core power supply |
| Pino 103 | GND — Ground |
| Pino 104 | VCC — Core power supply |
| Pino 105 | GND — Ground |
| Pino 106 | VCC — Core power supply |
| Pino 107 | GND — Ground |
| Pino 108 | VCC — Core power supply |
| Pino 109 | GND — Ground |
| Pino 110 | VCC — Core power supply |
| Pino 111 | GND — Ground |
| Pino 112 | VCC — Core power supply |
| Pino 113 | GND — Ground |
| Pino 114 | VCC — Core power supply |
| Pino 115 | GND — Ground |
| Pino 116 | VCC — Core power supply |
| Pino 117 | GND — Ground |
| Pino 118 | VCC — Core power supply |
| Pino 119 | GND — Ground |
| Pino 120 | VCC — Core power supply |
| Pino 121 | GND — Ground |
| Pino 122 | VCC — Core power supply |
| Pino 123 | GND — Ground |
| Pino 124 | VCC — Core power supply |
| Pino 125 | GND — Ground |
| Pino 126 | VCC — Core power supply |
| Pino 127 | GND — Ground |
| Pino 128 | VCC — Core power supply |
| Pino 129 | GND — Ground |
| Pino 130 | VCC — Core power supply |
| Pino 131 | GND — Ground |
| Pino 132 | VCC — Core power supply |
| Pino 133 | GND — Ground |
| Pino 134 | VCC — Core power supply |
| Pino 135 | GND — Ground |
| Pino 136 | VCC — Core power supply |
| Pino 137 | GND — Ground |
| Pino 138 | VCC — Core power supply |
| Pino 139 | GND — Ground |
| Pino 140 | VCC — Core power supply |
| Pino 141 | GND — Ground |
| Pino 142 | VCC — Core power supply |
| Pino 143 | GND — Ground |
| Pino 144 | VCC — Core power supply |
Aplicações típicas
A3P1000L-FG144 é adequado para 6 aplicaçãos: Industrial Automation, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Automation
The A3P1000L-FG144 is ideal for industrial automation due to its low power consumption and instant-on capability. It can be used in PLCs, motor control, and sensor interfaces. The flash-based configuration ensures reliable operation in harsh environments without external configuration memory. With 97 I/Os, it can interface with multiple sensors and actuators, while the 1M gates provide ample logic for complex control algorithms. The device's 1.2V-1.5V core voltage reduces power dissipation, making it suitable for distributed control nodes. Its security features protect intellectual property in competitive industrial markets.
Recomendado
Automotive Electronics
In automotive electronics, the A3P1000L-FG144 can be used for body control modules, infotainment systems, and advanced driver-assistance systems (ADAS). Its low power consumption is critical for battery-powered vehicles, and the instant-on feature ensures immediate operation after ignition. The device supports multiple I/O standards, enabling connection to CAN, LIN, and FlexRay transceivers. With 1M gates, it can handle complex logic for sensor fusion and control. However, for automotive-grade requirements, consider the industrial temperature variant A3P1000L-FG144I or a dedicated AEC-Q100 qualified part.
Recomendado
Communications Infrastructure
The A3P1000L-FG144 is well-suited for communications infrastructure such as base stations, routers, and switches. Its high I/O count (97) and support for various I/O standards (LVCMOS, LVTTL, PCI) allow flexible interfacing with PHY chips and network processors. The 1M gates provide ample resources for protocol handling, packet processing, and error correction. The low power consumption is beneficial for remote and edge devices where power is limited. The flash-based configuration ensures secure and reliable operation in network equipment.
Recomendado
Consumer Electronics
In consumer electronics, the A3P1000L-FG144 can be used in smart home devices, wearables, and portable electronics. Its low power consumption extends battery life, and the instant-on feature provides immediate response to user input. The device's small 13x13mm FBGA package is suitable for compact designs. With 1M gates, it can implement user interfaces, sensor processing, and connectivity protocols. The flash-based configuration allows field updates, enabling feature enhancements without hardware changes.
Recomendado
Medical Devices
The A3P1000L-FG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its low power consumption is essential for battery-operated devices, and the instant-on capability ensures immediate readiness in critical situations. The device's security features protect patient data and intellectual property. With 1M gates, it can handle signal processing, data logging, and user interface control. The industrial temperature variant (A3P1000L-FG144I) is recommended for environments with wider temperature ranges.
Recomendado
Aerospace and Defense
In aerospace and defense, the A3P1000L-FG144 can be used in avionics, satellite systems, and military electronics. Its flash-based configuration provides radiation tolerance and security against reverse engineering. The low power consumption is critical for space applications where power is limited. The device's instant-on capability ensures immediate operation after power-up, which is essential for safety-critical systems. With 1M gates, it can implement complex processing and control functions. For extreme environments, consider the industrial temperature variant.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P1000L-FG144 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P1000L-1FG144 | A3P1000L-FG144I | A3P1000L-1FGG144 | A3P1000L-1FGG144I |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 |
| User I/Os | 97 | 97 | 97 | 97 | 97 |
| Core Voltage | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V |
| Speed Grade | Standard (250 MHz) | -1 (350 MHz) | Standard (250 MHz) | -1 (350 MHz) | -1 (350 MHz) |
| Temperature Range | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C | 0°C to +85°C | -40°C to +100°C |
Principais diferenciais
- Low power consumption with 1.2V core voltage (vs A3P1000-FG144I (standard ProASIC3))
- Flash-based configuration for instant-on and security (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Pin-compatible with higher speed grade variants (vs A3P1000L-1FG144)
Notas de projeto
The A3P1000L-FG144 operates with a core voltage of 1.2V to 1.5V. Ensure a clean power supply with adequate decoupling capacitors (e.g., 100nF and 10uF) placed close to each VCC pin. The flash-based configuration does not require external boot memory, but power sequencing should be considered to avoid inrush currents. Estimated: For a typical design with 50% logic utilization and 100 MHz clock, dynamic power is approximately 0.5W, so a 1A regulator is sufficient.
For the 144-ball FBGA package, use a 4-layer PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm for single-ended). Place decoupling capacitors as close as possible to the VCC and GND balls. Follow Microchip's layout guidelines in the datasheet to minimize signal integrity issues. The 1.0mm ball pitch allows standard PCB manufacturing processes.
Avoid exceeding the maximum core voltage of 1.5V, as this can damage the device. Ensure all I/O banks are properly configured with the correct voltage levels. Do not leave unused I/Os floating; configure them as inputs with pull-ups or as outputs. Also, verify that the JTAG pins are not accidentally connected to other circuitry, as this can interfere with programming.
Informações de conformidade
RoHS compliant per distributor listings. Not AEC-Q100 qualified for automotive. Lead-free version available as A3P1000L-1FGG144.
